JPH01234577A - Method for removing burr by laser beam machining - Google Patents

Method for removing burr by laser beam machining

Info

Publication number
JPH01234577A
JPH01234577A JP63061456A JP6145688A JPH01234577A JP H01234577 A JPH01234577 A JP H01234577A JP 63061456 A JP63061456 A JP 63061456A JP 6145688 A JP6145688 A JP 6145688A JP H01234577 A JPH01234577 A JP H01234577A
Authority
JP
Japan
Prior art keywords
burrs
laser beam
work
workpiece
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63061456A
Other languages
Japanese (ja)
Inventor
Osamu Koseki
修 小関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP63061456A priority Critical patent/JPH01234577A/en
Publication of JPH01234577A publication Critical patent/JPH01234577A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To remove burrs by laser beam machining with excellent working precision and roughness on the machined surface by successively applying laser beam machining at the same position with the same shape on a work from the front and rear surfaces and etching only the machined surface. CONSTITUTION:A cross 2 is marked on the relative positions on the front and rear surfaces of the work 1, one surface is positioned, and a laser beam 3 is vertically projected to carry out machining in a specified shape. Since burrs 4 are generated on the outlet side of the beam 3, the work 1 is turned over and positioned with the cross 2. Laser beam machining at the same position with the same shape is applied along the working track to remove large burrs 4. A positive-type resist 5 is applied on the work 1 having small burrs 4, and the work 1 is masked with a mask 6 of the working shape and exposed from both surfaces by a double-side exposing machine. The resist is then developed to expose only the machined surface, the work 1 is dipped in an etching tank 7 and etched, and finally the resist 5 is released to complete the removal of burrs 4.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザー加工のハリの除去方法。[Detailed description of the invention] [Industrial application field] The present invention is a method for removing firmness during laser processing.

〔発明の概要〕[Summary of the invention]

本発明は、被加工物の表裏から同位置、同形状の加工を
した後、加工面のみをエツチングし、レーザー加]二の
ハリを除去するものである。
In the present invention, after machining the front and back of a workpiece in the same position and shape, only the machined surfaces are etched to remove the burrs caused by laser machining.

〔従来の技術〕[Conventional technology]

従来、被加工物をレーザー加工しレーザービームの出口
側にバリ発生した場合、切削加工及び研磨加工などによ
ってハリを除去していた。
Conventionally, when a workpiece is laser processed and burrs are generated on the exit side of the laser beam, the burrs are removed by cutting, polishing, or the like.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記の如くレーザービームの出口側に発生したハリを切
削加工及び研磨jJTI工などによって除去した場合、
一応バリは除去できるが、加工精度や被加工物の受ける
加工抵抗などに難点があった。
If the burrs generated on the exit side of the laser beam are removed by cutting and polishing as described above,
Although it is possible to remove burrs, there are problems with machining accuracy and machining resistance of the workpiece.

例えば、切削加工によってハリを除去すると、加工誤差
が大きく、更に刃具の大きさにも制限があり、加工可能
な範囲(大きさ、形状)が制限される。また、被加工物
へ及ぼす加工抵抗が大きく破壊し易い材料の加工はでき
ない。研磨加工の場合、加工精度には優れているが、被
加工物の形状に制限があり、凹凸のあるものの加工は非
常に困難であるという問題点があった。
For example, if the firmness is removed by cutting, the machining error will be large, and there will also be restrictions on the size of the cutting tool, which will limit the machinable range (size, shape). In addition, it is not possible to process materials that exert large processing resistance on the workpiece and are easily destroyed. In the case of polishing, although the processing accuracy is excellent, there are limitations on the shape of the workpiece, and there is a problem in that it is extremely difficult to process objects with unevenness.

〔課題を解決するための手段〕[Means to solve the problem]

先ず、被加工物をレーザー加工し、この被加工物を裏返
しく表裏を逆にする)1表面(おちて)面との相対的な
位置出しをした後、同位置同形状の加工をするごとによ
ってハリを除去し、続いて加工面のみをエツチングする
ことによって加工面の面粗さを良くする。
First, the workpiece is laser-processed, the workpiece is turned over, and the position is determined relative to the first surface. The roughness of the machined surface is improved by removing the firmness and then etching only the machined surface.

〔作用〕[Effect]

レーザー加工によって加工した場合、被加工物のザーザ
ービームの出口側にバリが発生ずる。この被加工物を裏
返しくハリを上側にする)同位置同形状の加工をした場
合、レーザービームは集光レンズによって絞られテーパ
ーがついているためバリの部分のみにレーザービームが
当たり他の部分に影響を与えることなくハリの除去が可
能となる。(第1図)また、レーザー加工の持っている
加工精度は約±20μmで再現性にも優れている。
When processing by laser processing, burrs are generated on the exit side of the laser beam on the workpiece. If the workpiece is turned over and processed in the same position and shape (with the firmness facing upward), the laser beam is narrowed down by the condensing lens and is tapered, so the laser beam hits only the burr and does not affect other parts. It becomes possible to remove firmness without causing any adverse effects. (Fig. 1) Furthermore, laser processing has a processing accuracy of about ±20 μm and excellent reproducibility.

そして、非接触加工なので被加工物に及ぼず加工抵抗は
ほとんどなく破壊し易い材料(ガラスetu)に悪影響
を及ぼす危険性はない。さらに、加工面のみをエツチン
グすることによって細かいハリを除去し面粗度を向上さ
せレーザー加工によるバリを完全に除去できる。(第2
図) 〔実施例〕 以下に、本発明によるレーザー加工方法の実施例を図面
に基づいて説明する。
Furthermore, since it is a non-contact process, there is almost no process resistance on the workpiece, and there is no risk of adversely affecting the easily broken material (glass etu). Furthermore, by etching only the processed surface, fine burrs can be removed, surface roughness can be improved, and burrs caused by laser processing can be completely removed. (Second
(Figure) [Example] Below, an example of the laser processing method according to the present invention will be described based on the drawings.

第3図に示すように被加工物であるスチール材(50x
30x 1 mm)  1の表裏の相対位置が出せるよ
うに十字の印2を付ける。 (あらかしめレーザー加工
によって被加工物に損傷のない位置に2点の印をつける
。)この2点の印の位置関係からモニターカメラで位置
出しをした後、被加工物の垂直方向からレーザービーム
3を照射して加工したい形状に加工する。(レーザー加
工機の条件:出力60W、加工速度300 mm/mi
n、アシストガス圧5kg/ cM 、  レーザーノ
ズルと被加工物との間隙1+am)このとき、被加工物
のレーザービームの出口側に高さ0.11〜0.3ml
のハリ4が生じる。
As shown in Figure 3, the steel material (50x
30x 1 mm) Mark a cross mark 2 so that you can see the relative position of the front and back sides of 1. (Two points are marked on the workpiece at a position where there is no damage by preparatory laser processing.) After locating the position using the monitor camera based on the positional relationship between these two points, the laser beam is applied from the perpendicular direction of the workpiece. 3 and process it into the desired shape. (Laser processing machine conditions: output 60W, processing speed 300 mm/mi
n, assist gas pressure 5 kg/cM, gap between the laser nozzle and the workpiece 1+am) At this time, there is a height of 0.11 to 0.3 ml on the exit side of the laser beam of the workpiece.
A firmness of 4 occurs.

次に、この被加工物を裏返し、(出口側に発生したハリ
が上側になる。)2点の印を基準に表面との相対的な位
置出しをし、加工跡に沿って、同位置同形状の加工をす
る。(第1図)この両面からの加工によって大川した大
きなバリは除去されるが加工面に小さなハリが残る。続
いてこの両面から加工した被加工物をポジタイプレジス
ト5をディッピングによって塗布し、加工形状通りのマ
スク6 (被加工物の形状がマスクの膜部となるマスク
)でマスキングして、両面露光機で両面から同時に露光
する。(第4図)続いて、レジストを現像することによ
って加工面のみが露光する。そして、マスキングが完了
した被加工物をエツチング槽7 (50%硫酸が入って
いる)に浸し、1分間エツチングを行う。(第2図)最
後にレジストを剥離し、レーザー加工によるハリ取りの
工程が完了する。このようにして得られた被加工物の加
工面の面粗さは±20μmで極めて優れた加工精度を有
することが確認された。
Next, turn this workpiece over (the firmness generated on the exit side will be on the top side), and use the two marks as a reference to determine the relative position to the surface, and follow the machining traces to ensure the same position. Process the shape. (Fig. 1) This processing from both sides removes large burrs, but small burrs remain on the processed surfaces. Next, the workpiece processed from both sides is coated with a positive resist 5 by dipping, masked with a mask 6 according to the shape of the workpiece (a mask in which the shape of the workpiece becomes the film part of the mask), and exposed to a double-sided exposure machine. to expose both sides at the same time. (FIG. 4) Subsequently, by developing the resist, only the processed surface is exposed. Then, the masked workpiece is immersed in an etching tank 7 (containing 50% sulfuric acid) and etched for 1 minute. (Fig. 2) Finally, the resist is peeled off and the process of removing firmness by laser processing is completed. The surface roughness of the machined surface of the workpiece obtained in this way was ±20 μm, and it was confirmed that the workpiece had extremely excellent processing accuracy.

〔発明の効果〕〔Effect of the invention〕

上述の如く本発明によれば、従来の切削加工及び研磨加
工などによってバリを除去する場合に比べて、加工精度
及び加工面粗度共に優れたレーザー加工のハリの除去が
可能となる。
As described above, according to the present invention, it is possible to remove burrs by laser processing with superior processing accuracy and machined surface roughness compared to the case where burrs are removed by conventional cutting and polishing processing.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図から第4図は、本発明の加工工程を示す説明図、
第1図1第2図、第4図は断面図、第3図は平面図であ
る。 1・・・スチール材 2・・・印(2点) 3・・・レーザービーム 4 ・ ・ ・バリ 5、・・ポジタイプレジスト 6・・・マスク 7・・・エツチング槽 以上 出願人 セイコー電子工業株式会社
1 to 4 are explanatory diagrams showing the processing steps of the present invention,
FIG. 1, FIG. 2, and FIG. 4 are cross-sectional views, and FIG. 3 is a plan view. 1...Steel material 2...Mark (2 points) 3...Laser beam 4...Burr 5...Positive resist 6...Mask 7...Etching tank and above Applicant: Seiko Electronic Industries Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 被加工物をレーザー加工した後、この被加工物を裏返し
、表面と同位置にレーザ照射を行ない、同形状の加工を
した後、加工面のみをエッチングすることによって加工
面の面粗さを良くするレーザー加工のバリの除去方法。
After laser processing the workpiece, turn the workpiece over, irradiate the laser to the same position as the surface, process the same shape, and then etch only the processed surface to improve the surface roughness of the processed surface. How to remove burrs from laser processing.
JP63061456A 1988-03-15 1988-03-15 Method for removing burr by laser beam machining Pending JPH01234577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63061456A JPH01234577A (en) 1988-03-15 1988-03-15 Method for removing burr by laser beam machining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63061456A JPH01234577A (en) 1988-03-15 1988-03-15 Method for removing burr by laser beam machining

Publications (1)

Publication Number Publication Date
JPH01234577A true JPH01234577A (en) 1989-09-19

Family

ID=13171563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63061456A Pending JPH01234577A (en) 1988-03-15 1988-03-15 Method for removing burr by laser beam machining

Country Status (1)

Country Link
JP (1) JPH01234577A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269964A (en) * 1993-03-24 1994-09-27 Shinwa Sokutei Kk Formation of recessed part of metallic member and formation of scale of ruler plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269964A (en) * 1993-03-24 1994-09-27 Shinwa Sokutei Kk Formation of recessed part of metallic member and formation of scale of ruler plate

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