JPS6199593A - Hole or slit working method onto elastic member - Google Patents

Hole or slit working method onto elastic member

Info

Publication number
JPS6199593A
JPS6199593A JP59218263A JP21826384A JPS6199593A JP S6199593 A JPS6199593 A JP S6199593A JP 59218263 A JP59218263 A JP 59218263A JP 21826384 A JP21826384 A JP 21826384A JP S6199593 A JPS6199593 A JP S6199593A
Authority
JP
Japan
Prior art keywords
worked
workpiece
laser beam
slit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59218263A
Other languages
Japanese (ja)
Inventor
Kazumasa Ito
和雅 伊藤
Yutaka Amano
裕 天野
Takahiko Ito
孝彦 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPC Electronics Corp
PIGEON KK
Original Assignee
SPC Electronics Corp
PIGEON KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPC Electronics Corp, PIGEON KK filed Critical SPC Electronics Corp
Priority to JP59218263A priority Critical patent/JPS6199593A/en
Publication of JPS6199593A publication Critical patent/JPS6199593A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To perform a hole or slit work of fine dimension with high accuracy onto the object to be worked by irradiating with condensing a laser beam on the working position of the object to be worked with the condition of extending the object to be worked having an elasticity. CONSTITUTION:The object 1 to be worked having the elasticity like the nipple, etc. for a nursing bottle is crowned to the jig 2 for extension with the condition of extending it within its surface to be worked. The extension ratio thereof is decided by the ratio of the opening size at the extension time and stationary time of the object 1 to be worked. The laser beam 3 condensed by a condenser lens 4 is then irradiated from the direction crossing with the surface to be worked and the focus 5 position thereof is set to the work position of the object 1 to be worked. In case of the work shape being a slit the object 1 to be worked is moved in the necessary direction within the surface to be worked with the condition of maintaining said focus position as it is. After working the hole or slit with the above the object 1 to be worked is removed from the jig 2 for extension and restored with shrinking to the stationary state of the original size.

Description

【発明の詳細な説明】 (1)発明の目的 (産業上の利用分野) この発明は、伸縮部材に極小孔または細スリットを設け
、圧力の作用時にのみ開口するバルブ類の技術分野にお
いて利用され、特に上記極小孔または細スリットの加工
方法に関するものである。
Detailed Description of the Invention (1) Purpose of the Invention (Field of Industrial Application) The present invention is applicable in the technical field of valves that are provided with extremely small holes or thin slits in a telescoping member and open only when pressure is applied. In particular, the present invention relates to a method of processing the above-mentioned extremely small holes or narrow slits.

(従来の技術) 従来この種の加工方法としては、刃物等による機械的方
法とレーザ光の照射による方法とが知られている。
(Prior Art) Conventionally, as this type of processing method, a mechanical method using a cutter or the like and a method using laser light irradiation are known.

前者の方法にあっては、例えばスリットの加工の場合、
刃物によって被加工物を剪断で押し切る方法であるため
、加工後の保存期間中に材料の伸縮性によってスリット
の切開面が癒着してしまって使用時に支障をきたしたり
、長期使用によってスリット切開端部から亀裂が生じた
りして使用上問題があった。また刃物自体の問題として
は複雑なスリットの場合には刃物の製作に費用がかさむ
と共に刃物の寿命をも考慮せねばならなかった。
In the former method, for example, when processing slits,
Since this method uses a cutter to shear the workpiece, the cut surfaces of the slits may adhere to each other due to the elasticity of the material during storage after processing, causing problems during use, or the edges of the slits may become damaged due to long-term use. There were problems in use due to cracks occurring. In addition, as for the problem of the cutter itself, in the case of complicated slits, the production cost of the cutter increases, and the life of the cutter has to be taken into consideration.

また後者の方法にあっては、例えば加工形状が極小孔の
ときには第4図に示されるようにレーザ光30の焦点3
1を被加工面11に設定して、あるいはスリットのとき
には該焦点を被加工面内で移動させ、さらには、焦点の
設定を行うことなく第6図のごとくのスリ、ト形状の透
過孔21をもつマスクパターン20を第5図のように被
加工面上に配してレーザ光を照射して所定の孔・スリッ
トを加工していた。
In the latter method, for example, when the processed shape is a very small hole, the focal point 3 of the laser beam 30 is
1 on the surface to be processed 11, or in the case of a slit, the focal point is moved within the surface to be processed, and furthermore, a slit-shaped transmission hole 21 as shown in FIG. As shown in FIG. 5, a mask pattern 20 having a mask pattern 20 is placed on the surface to be processed, and laser light is irradiated to form predetermined holes and slits.

上述の孔の径またはスリットの幅(以下「開口寸法」と
いう)が極めて小さいため、レーザ光を移動する場合は
その駆動機構が複雑で高価となりまたマスクパターンを
使用する場合は製品の開口寸法と同寸法のマスクパター
ンの製作が困難でありまた一般に金属製の(マスクパタ
ーンの場合、製造技術上その厚さは最高でスリット幅以
下とされており、したがってマスクパターンの厚さも薄
くなるためその耐久性に劣ることとなる。さらにレーザ
光の回折及びマスクパターンからの熱影響によってマス
クパターンのスリット幅より太く加工されてしまう傾向
を伴う。
Since the diameter of the hole or the width of the slit (hereinafter referred to as "aperture size") is extremely small, the drive mechanism is complicated and expensive when moving the laser beam, and when using a mask pattern, it is difficult to match the aperture size of the product. It is difficult to produce a mask pattern with the same dimensions, and in the case of a metal mask pattern, the maximum thickness is less than the slit width due to manufacturing technology. Further, due to the diffraction of the laser beam and the thermal influence from the mask pattern, there is a tendency for the slit width to be processed to be wider than the width of the mask pattern.

(発明が解決しようとする問題点) 本発明は上述のごとくの従来の方法における諸問題を一
挙に解決し、レーザ光の焦点位置あるいはマスクパター
ンの精度を要することなく正確かつ細スリット等を加工
する方法を提供する。
(Problems to be Solved by the Invention) The present invention solves the problems of the conventional methods as described above all at once, and accurately processes narrow slits without requiring precision of the focus position of the laser beam or the precision of the mask pattern. provide a method to do so.

(2)発明の構成 (問題点を解決するための手段及び作用)本発明は、上
記目的を達成するために、伸縮性を有する被加工物をそ
の被加工面で伸張させた状態で、レーザ光を該被加工面
に照射することにより所望寸法より大きい寸法の孔スリ
ットを加工し、加工後に被加工物の伸張力を解除して被
加工物が原寸まで収縮復帰した定常状態で精度の高い微
細寸法の孔・スリットを得るものである。そしてレーザ
光の照射の方法としては次の二つの方法が可能である。
(2) Structure of the Invention (Means and Effects for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides a method for applying a laser beam to a stretchable workpiece in a state where the workpiece is stretched on its workpiece surface. A hole slit with a size larger than the desired size is machined by irradiating the workpiece surface with light, and after machining, the stretching force of the workpiece is released and the workpiece contracts and returns to its original size, resulting in high precision in a steady state. It is used to obtain holes and slits with minute dimensions. The following two methods are possible for laser beam irradiation.

その第一の方法はレーザ光の焦点を、伸張された被加工
物の加工位置に設定せしめることである。ここで加工位
置は、被加工物が薄ものの場合は被加工物の上表面とな
るが、厚ものの場合は上表面より複数回に分けて加工す
るので順次上表面より一定深さだけ進入した位置となる
。その際加工形状が極小丸孔であれば一点におけるレー
ザ光の照射でよいが、例えばスリットの場合にはレーザ
光あるいは被加工物を被加工面内で所定の方向に相対移
動させてスリットを形成することができる。第二の方法
としてはレーザ光をその焦点位置に係わりなく被加工面
に照射する方法で、その際被加工面上とレーザ光発振装
置との間に、所望の加工形状より大きい相似形の透過孔
をもったマスクパターンを配し、該透過孔を含む範囲に
幅をもったレーザ光を照射して孔・スリットを加工する
ものである。その結果、加工後に被加工物から張力を解
除すれば、被加工物は原寸まで収縮復帰し、加工された
孔・スリットの寸法は一様に小さくなり、所定の寸法・
精度のものを得ることができる。
The first method is to focus the laser beam on the processing position of the elongated workpiece. If the workpiece is thin, the processing position will be the upper surface of the workpiece, but if the workpiece is thick, the processing will be performed in multiple steps starting from the upper surface, so the position will be a position that has entered a certain depth from the upper surface one after another. becomes. In this case, if the machined shape is a very small round hole, irradiation with laser light at one point is sufficient, but in the case of a slit, for example, the slit is formed by moving the laser light or the workpiece relatively in a predetermined direction within the workpiece surface. can do. The second method is to irradiate the workpiece surface with a laser beam regardless of its focal position, and in this case, a similar shape larger than the desired processing shape is transmitted between the workpiece surface and the laser beam oscillation device. A mask pattern with holes is arranged, and holes and slits are processed by irradiating a laser beam with a width to an area including the transmission holes. As a result, when the tension is released from the workpiece after machining, the workpiece shrinks back to its original size, and the dimensions of the machined holes and slits uniformly decrease to the specified dimensions.
You can get precision stuff.

(実施例) 以下、添付図面の第1図ないし第3図にもとづいて本発
明の実施例を哺乳ビン用乳首の孔加工の場合を例として
説明する。
(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3 of the accompanying drawings, taking as an example the case of machining a hole in a nipple for a baby bottle.

第1図はレーザ光を被加工面に焦点をもつように照射し
て加工する場合の第一実施例である。
FIG. 1 shows a first embodiment in which processing is performed by irradiating a laser beam so that the surface to be processed is focused.

同図において、■は被加工物である哺乳びん用乳首、2
は上面が平坦な伸張用治具、3はレーザ光、4は集光レ
ンズ、5はレーザ光焦点である。伸張用治具2の外径と
乳首の内径との比(すなわち伸張比)は、被加工物の伸
張時における加工孔の寸法と定常時の寸法すなわち所望
の開口寸法との比により決定され、そして上記伸張比に
よってレーザ光の出力、マスクパターンの大きさが定ま
る。したがって所望の開口寸法が微細かつ精度の高いも
のほど大きく伸張される。ただし上記伸張比は被加工物
の強度による上限が存在する。
In the same figure, ■ is a nipple for a baby bottle which is a workpiece, and 2
3 is a stretching jig with a flat top surface, 3 is a laser beam, 4 is a condensing lens, and 5 is a laser beam focal point. The ratio of the outer diameter of the stretching jig 2 to the inner diameter of the nipple (i.e., the stretching ratio) is determined by the ratio of the dimension of the machined hole when the workpiece is stretched and the dimension at steady state, that is, the desired opening dimension, The output of the laser beam and the size of the mask pattern are determined by the stretching ratio. Therefore, the finer and more precise the desired opening size, the larger the expansion. However, the above elongation ratio has an upper limit depending on the strength of the workpiece.

そして加工に際しては、先ず乳首1を伸張用治具に伸張
させながら冠着する。すると、乳首頭部は上述の伸張比
で伸張される。次に集光レンズ4で集光されたレーザ光
3を、その焦点5の位置を被加工面に設定して照射する
。その結果孔が乳首頭部に加工される。加工形状がスリ
ットの場合には上記焦点位置をそのままに維持した状態
でレーザ光もしくは被加工物を被加工面内で所望の方向
に(例えば同図二点鎖線方向に)移動させるならば所望
の形状のスリットを形成できる。このようにして加工さ
れた乳首1を伸張用治具から取り外すと、乳首はその伸
縮性により原寸(定常寸法)に収縮復帰し、したがって
孔・スリット部も収縮して所望の寸法・精度の孔・スj
        リットを得ることができる。
In processing, first, the nipple 1 is stretched and attached to a stretching jig. The nipple head is then stretched at the stretching ratio described above. Next, the laser beam 3 condensed by the condenser lens 4 is irradiated with the focal point 5 set on the surface to be processed. As a result, a hole is machined into the nipple head. When the processing shape is a slit, if the laser beam or the workpiece is moved in the desired direction within the processing surface (for example, in the direction of the two-dot chain line in the same figure) while maintaining the focal position as described above, the desired result can be obtained. Can form shaped slits. When the nipple 1 processed in this way is removed from the stretching jig, the nipple shrinks and returns to its original size (steady size) due to its elasticity, and the hole/slit also shrinks to form a hole of the desired size and accuracy.・Suj
You can get lit.

次に第二実施例としてマスクパターンを使用する場合を
第2図に示す。本実施例によれば、レーザ光の焦点を被
加工面に設定するという手間が省けると共に、焦点位置
の精度による加工寸法の差というものがなくなるという
利点がある。
Next, FIG. 2 shows a second embodiment in which a mask pattern is used. According to this embodiment, there is an advantage that the effort of setting the focus of the laser beam on the surface to be processed can be saved, and there is no difference in processing dimensions due to the accuracy of the focus position.

第2図において、すでに従来例で説明したマスクパター
ンと同様のマスクパターン7が被加工物である乳首1の
頭部の上に接して配されている。ただしこのマスクパタ
ーン7の透過孔8の寸法は従来のものの場合に比して、
伸張比倍だけ拡大されておりまた精度はその分だけ低い
ものでよい。またレーザ光3の焦点5はマスクパターン
7と集光レンズ4との間に結ばれており、レーザ光3は
マスクパターン7の透過孔8の全域を照射するようにな
っている。したがってマスクパターン7の透過孔8を透
過したレーザ光が透過孔と同一形状・寸法のスリットを
加工することとなる。
In FIG. 2, a mask pattern 7 similar to the mask pattern already explained in the conventional example is arranged on and in contact with the head of the nipple 1, which is the workpiece. However, the dimensions of the transparent holes 8 of this mask pattern 7 are smaller than those of the conventional mask pattern.
It is expanded by the expansion ratio, and the accuracy may be lower by that amount. Further, the focal point 5 of the laser beam 3 is connected between the mask pattern 7 and the condensing lens 4, so that the laser beam 3 irradiates the entire area of the transmission hole 8 of the mask pattern 7. Therefore, the laser beam transmitted through the transmission hole 8 of the mask pattern 7 processes a slit having the same shape and size as the transmission hole.

加工後乳首1を伸張治具2より取り外せば、前実施例の
場合と同様の製品を得る。
After processing, the nipple 1 is removed from the stretching jig 2 to obtain a product similar to that of the previous example.

また、同様にマスクパターンを使用する場合でも被加工
物の形状によっては、マスクパターンを被加工物から離
して焦点の通過前または第3図に第三実施例として示す
ように集光レンズを用いずにそのままマスクパターンに
照射する方法も原理的には何ら変化はないがレーザ光の
回折による加工精度を考えると被加工物にマスクパター
ンを近接する方が好ま、しい。
Similarly, even if a mask pattern is used, depending on the shape of the workpiece, the mask pattern may be moved away from the workpiece and a condenser lens may be used before the focus passes or as shown in the third embodiment in FIG. Although there is no change in principle in the method of directly irradiating the mask pattern without laser beams, it is preferable to place the mask pattern close to the workpiece when considering processing accuracy due to diffraction of the laser beam.

(3)発明の効果 本発明は以上の被加工物を伸張した状態で孔、スリット
の加工をし、加工後原寸に収縮復帰させることとしたの
で次のような効果を得る。
(3) Effects of the Invention According to the present invention, holes and slits are formed in the workpiece in a stretched state, and the workpiece is contracted and returned to its original size after processing, so that the following effects can be obtained.

■ 従来レーザ光の回折及び熱影響によって決定されて
いた限界加ニスリット幅を、被加工物の原寸復帰によっ
てさらに小さくすることができるようになった。
■ The limit slit width, which was conventionally determined by laser beam diffraction and thermal effects, can now be made even smaller by restoring the workpiece to its original size.

■ マスクパターンを使用する場合には、その透過孔の
寸法を比較的大きくすることができるので製作が容易と
なりまた耐久性も向上する。
(2) When a mask pattern is used, the size of the through hole can be made relatively large, which facilitates manufacturing and improves durability.

■ 加工時において被加工物の肉厚が薄くなるため、加
工が容易となりしたがって加工精度も向上することがで
きる。
■ Since the wall thickness of the workpiece becomes thinner during machining, machining becomes easier and machining accuracy can also be improved.

■ スリット加工においては、その加工幅は極めて小さ
いが溝加工であるので、スリット面での癒着もなくなり
、またスリット端部に丸味をもたせれば亀裂を生ずるこ
ともなくなる。
(2) In slit processing, the processing width is extremely small, but since it is a groove processing, there will be no adhesion on the slit surface, and if the slit ends are rounded, no cracks will occur.

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第3図は本発明の実施例を示すもので、第
1図は第一実施例を示す概要断面図、第2図は第二実施
例を示す概要断面図、第3図は第三実施例を示す概要断
面図、第4図及び第5図はそれぞれ異なる従来例を示す
概要断面図、第6図は第5図の例において用いられるマ
スクパターンの斜視図である。 l・・・・・・・・・被加工物(乳首)3・・・・・・
・・・レーザ光 5・・・・・・・・・焦点 7・・・・・・・・・マスクパターン 8・・・・・・・・・透過孔 特許出願人       ビジョン株式会社島田理化工
業株式会社 代 理 人  弁理士  藤  岡   徹を 第1図   第2図
1 to 3 show embodiments of the present invention, FIG. 1 is a schematic sectional view showing the first embodiment, FIG. 2 is a schematic sectional view showing the second embodiment, and FIG. 3 is a schematic sectional view showing the second embodiment. FIGS. 4 and 5 are schematic sectional views showing different conventional examples, and FIG. 6 is a perspective view of a mask pattern used in the example of FIG. 5. l... Workpiece (nipple) 3...
...Laser beam 5...Focus 7...Mask pattern 8...Transmission hole patent applicant Vision Co., Ltd. Shimada Rika Kogyo Co., Ltd. Company Agent Patent Attorney Toru Fujioka Figure 1 Figure 2

Claims (3)

【特許請求の範囲】[Claims] (1)伸縮性を有する被加工物をその被加工面内で伸張
させた状態で、焦点位置が上記被加工物の加工位置に設
定されたレーザ光を被加工面に交叉する方向から照射す
ることを特徴とする伸縮部材への孔またはスリット加工
方法。
(1) While a stretchable workpiece is stretched within its workpiece surface, a laser beam whose focus position is set at the processing position of the workpiece is irradiated from a direction intersecting the workpiece surface. A method for forming holes or slits in a telescopic member, characterized in that:
(2)レーザ光と被加工物の位置を被加工面内で所望の
方向に相対移動させることを特徴とする特許請求の範囲
第(1)項記載の伸縮部材への孔またはスリット加工方
法。
(2) A method for forming holes or slits in a telescopic member according to claim (1), characterized in that the positions of the laser beam and the workpiece are relatively moved in a desired direction within the workpiece surface.
(3)伸縮性を有する被加工物をその被加工面内で伸張
させた状態で、被加工面とレーザ光発振装置との間に所
望の加工形状と相似形の透過孔を有するマスクパターン
を配し、レーザ光を上記透過孔を透過して被加工面に照
射することを特徴とする伸縮部材への孔またはスリット
加工方法。
(3) With the workpiece having elasticity stretched within the workpiece surface, a mask pattern having a transmission hole similar to the desired processing shape is placed between the workpiece surface and the laser beam oscillation device. A method for machining holes or slits in an elastic member, characterized in that the laser beam is transmitted through the transmission hole and irradiated onto the surface to be machined.
JP59218263A 1984-10-19 1984-10-19 Hole or slit working method onto elastic member Pending JPS6199593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59218263A JPS6199593A (en) 1984-10-19 1984-10-19 Hole or slit working method onto elastic member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59218263A JPS6199593A (en) 1984-10-19 1984-10-19 Hole or slit working method onto elastic member

Publications (1)

Publication Number Publication Date
JPS6199593A true JPS6199593A (en) 1986-05-17

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ID=16717128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59218263A Pending JPS6199593A (en) 1984-10-19 1984-10-19 Hole or slit working method onto elastic member

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Country Link
JP (1) JPS6199593A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367270A (en) * 1986-09-08 1988-03-26 大日本印刷株式会社 Packaging bag housing aromatic, deoxidizer, etc.
JP2007245415A (en) * 2006-03-14 2007-09-27 Mkv Platech Co Ltd Manufacturing method of drilled tube
KR20190109907A (en) * 2018-03-19 2019-09-27 두산중공업 주식회사 Protecting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367270A (en) * 1986-09-08 1988-03-26 大日本印刷株式会社 Packaging bag housing aromatic, deoxidizer, etc.
JP2007245415A (en) * 2006-03-14 2007-09-27 Mkv Platech Co Ltd Manufacturing method of drilled tube
KR20190109907A (en) * 2018-03-19 2019-09-27 두산중공업 주식회사 Protecting device

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