JPS62218587A - Selective etching method utilizing laser - Google Patents
Selective etching method utilizing laserInfo
- Publication number
- JPS62218587A JPS62218587A JP5931786A JP5931786A JPS62218587A JP S62218587 A JPS62218587 A JP S62218587A JP 5931786 A JP5931786 A JP 5931786A JP 5931786 A JP5931786 A JP 5931786A JP S62218587 A JPS62218587 A JP S62218587A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- laser
- corrosion
- processing
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 12
- 230000007797 corrosion Effects 0.000 claims abstract description 23
- 238000005260 corrosion Methods 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 5
- 238000003754 machining Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明は、各種部材の高精度微細加工に適するレーザ
を利用した選択的エツチング方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a selective etching method using a laser suitable for high-precision micromachining of various members.
（従来の技ｍ）
部材を高精度微細加工する方法として、従来よりダイヤ
モンド工具などのマイクロツールを用いて機械的に加工
する方法がある。しかし、この機械的加工方法は、工具
の大きさに制限があるため、孔あけ加工などの場合、そ
の加工に限界がある。(Conventional Technique M) As a method for high-precision micromachining of a member, there is a conventional method of mechanical machining using a microtool such as a diamond tool. However, this mechanical processing method is limited in the size of the tool, so there is a limit to the processing in cases such as drilling.
また加工能率も低い。Also, processing efficiency is low.
これに対し、レーザ加工は、機械加工より、より微細な
加工が可能であり、また、加工能率もよいが、加熱によ
るダメージ領域ができたり、加工時に発生する溶融飛散
物が付着して、加工形状を悪化するなどの問題がある。On the other hand, laser processing allows for finer processing than mechanical processing, and has good processing efficiency, but it also creates damaged areas due to heating and adheres to molten particles generated during processing. There are problems such as deterioration of the shape.
また、高精度微細加工の他の方法として、被加工物に感
光性樹脂からなる耐食性被膜を形成し、露光、現像など
をおこなってこの被膜に所定のパターンを形成したのち
にエツチングする方法がある。しかしながら、この化学
的な加工方法は、所要の深さ方向のエツチングと同時に
サイドエツチングが進行するため１幅が狭く深さ方向に
深い加工が困難であるという問題点がある。Another method for high-precision microfabrication is to form a corrosion-resistant film made of photosensitive resin on the workpiece, perform exposure, development, etc. to form a predetermined pattern on this film, and then etch it. . However, this chemical processing method has a problem in that side etching progresses at the same time as etching in the required depth direction, making it difficult to perform deep processing in the depth direction because the width is narrow.
（発明が解決しようとする問題点）
上記のように従来の加工技術は、それぞれ問題点があり
、＃にレーザ単独の加工では、加熱によるダメージや溶
融飛散物の付着による形状悪化などがおこり、また、エ
ツチングによる加工では、サイドエツチングのために、
所定形状の深さ加工が困難であるなどの問題点がある。(Problems to be Solved by the Invention) As mentioned above, each of the conventional processing techniques has its own problems, and processing using a laser alone causes damage due to heating and deterioration of shape due to adhesion of molten particles. In addition, in etching processing, due to side etching,
There are problems such as difficulty in machining a predetermined shape to a depth.
この発明は、かかる問題点を解決して、所定形状の加工
を容易におこなうことができるようにすることを目的と
する。It is an object of the present invention to solve these problems and make it possible to easily process a predetermined shape.
（問題点を解決するための手段）
この発明は、レーザ加工とエツチング加工とを組合せ、
被加工物に耐食性被膜を形成したのち、レーザ光を照射
して所定部分上の耐食性被膜を除去するとともに、その
下部に被加工物の溶融凝固層を形成し、ついでこの溶融
凝固層をエツチングすることにより、被加工物を加工す
る方法である。(Means for solving the problem) This invention combines laser processing and etching processing,
After forming a corrosion-resistant coating on the workpiece, laser light is irradiated to remove the corrosion-resistant coating on a predetermined portion, and a melted and solidified layer of the workpiece is formed below, and then this melted and solidified layer is etched. This is a method of processing a workpiece.
（作 用）
被加工物の所要部分に溶融凝固層を形成してエツチング
加工すると、この溶融凝固層は、他の部分よりエツチン
グ速度が速く、かつ他の部分は、耐食性被膜で覆われて
いるので、所定形状の加工を容易におこなうことができ
る。(Function) When a molten solidified layer is formed on the required part of the workpiece and etched, this molten solidified layer has a faster etching speed than other parts, and the other parts are covered with a corrosion-resistant film. Therefore, processing into a predetermined shape can be easily performed.
（実施例）
以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.
まず、第２図（Ａ）図に示すように、被加工物たとえば
金属板（１）の両面に後述するエツチング液に対して耐
食性を有する耐食性被膜（２）を形成する。この被膜（
２）は、通常のフォトエツチングに用いられる感光性樹
脂で形成してよい。First, as shown in FIG. 2(A), a corrosion-resistant coating (2) having corrosion resistance against an etching solution to be described later is formed on both sides of a workpiece, such as a metal plate (1). This film (
2) may be formed from a photosensitive resin used in ordinary photoetching.
つぎに、この耐食性被膜（２）の形成された金属板（１
）を、第１図に示すようにＸ−Ｙテーブル（４）に搭載
し、ＱスイッチＹＡＧレーザなどのレーザ発振器（５）
から放出されたレーザ光（６）を、その前面に設置され
た反射鏡（７）で反射させ、集光レンズ（８）で集光し
て、上記金属板（１）に照射するとともに、Ｘ−Ｙテー
ブル（４）を制御部から送出される指令に基づいて駆動
して、このＸ−Ｙテーブル（４）に搭載された金属板（
１）を所定のパターンで走査させる。（９）は、その走
査パターンの一例である。Next, the metal plate (1) on which this corrosion-resistant coating (2) is formed is applied.
) is mounted on an X-Y table (4) as shown in Figure 1, and a laser oscillator (5) such as a Q-switch YAG laser
The laser beam (6) emitted from the - The metal plate (
1) Scan in a predetermined pattern. (9) is an example of the scanning pattern.
このレーザ光の走査により、第２図（Ｂ）図に示すよう
に、金属板（１）の走査部は、少くともレーザ照射側の
耐食性被膜（２）が除去され、同時にその下部に、金属
溶融飛散により容積が縮小した溶融凝固層（１０）が形
成される。By scanning with this laser beam, as shown in FIG. 2(B), at least the corrosion-resistant coating (2) on the laser irradiation side of the scanning part of the metal plate (1) is removed, and at the same time, the metal A molten solidified layer (10) with a reduced volume is formed by melting and scattering.
つぎに、この溶融凝固層（１０）の形成された金属板（
１）を、第２図（Ｃ）図に示すように、エツチング液（
１２）中に浸漬してエツチングをおこなう。この場合、
溶融凝固層（］Ｏ）は、金属板（１）を構成する成分元
素、不純物などの偏析や、レーザ加熱によって発生した
残留応力などにより、金属板（１）の他部分（母材）よ
り腐蝕されやすく、一方、金属板（１）の他部分は耐食
性被膜（２）で被覆されてエツチングされないようにな
っているので、溶融凝固層（１０）が選択的にエツチン
グされる。Next, the metal plate (
1) with an etching solution (as shown in Figure 2(C)).
12) Perform etching by immersing it in the liquid. in this case,
The molten solidified layer (]O) corrodes more than other parts (base material) of the metal plate (1) due to segregation of component elements, impurities, etc. that make up the metal plate (1), and residual stress generated by laser heating. On the other hand, since the other parts of the metal plate (1) are covered with a corrosion-resistant coating (2) to prevent etching, the molten solidified layer (10) is selectively etched.
所要の金属板（１）は、このエツチング終了後、第２図
（Ｄ）図に示すように、表裏両面を被着する耐食性被膜
（２）を剥離することにより得られる。After this etching is completed, the required metal plate (1) is obtained by peeling off the corrosion-resistant coating (2) covering both the front and back surfaces, as shown in FIG. 2(D).
ところで、上記のようにレーザ加工とエツチング加工を
組合せ、特にレーザ照射部に溶融凝固層（１０）が形成
されるようにレーザ発振を制御してレーザ加工すると、
レーザ加工およびエツチング加工単独の場合の欠点を相
殺して、所望の加工を施すことができる。すなわち、こ
の例に示したように、金属板（１）に所定パターン（９
）の溝加工をおこなう場合、これをレーザ加工のみでお
こなうと。By the way, when laser processing and etching processing are combined as described above, and in particular, laser processing is performed by controlling laser oscillation so that a molten solidified layer (10) is formed in the laser irradiated area,
Desired processing can be performed by offsetting the disadvantages of laser processing and etching processing alone. That is, as shown in this example, a predetermined pattern (9
), it is best to use only laser processing.
このとき必要なパワー密度の高いレーザ光のために、加
工部のまわりに溶融飛散物が付着して加工形状を悪くす
る。またエツチング加工のみでおこなうと、サイドエツ
チングが大きく、所定幅の溝を形成することがいちじる
しく困難となるが、上記のように金属板（１）に耐食性
被膜（２）を形成したのち、レーザ光を照射して、その
所定部分の耐食性被膜（２）を除去するとともに、その
下部に溶融凝固層（１０）を形成してエツチングすると
、レーザ加工における溶融飛散物の付着が少く、また、
溶融凝固層（１０）が腐蝕されやすく、かつ他の母材部
分が耐食性被膜（２）で覆われていることがら、容易に
所定形状の加工をおこなうことができるようになる。Because of the high power density laser light required at this time, melted debris adheres around the processed portion, impairing the processed shape. Furthermore, if etching is performed only, side etching will be large and it will be extremely difficult to form grooves of a predetermined width. However, after forming the corrosion-resistant coating (2) on the metal plate (1) as described above, laser beam When the corrosion-resistant coating (2) is removed from a predetermined portion by irradiation with the corrosion-resistant coating (2), and a molten solidified layer (10) is formed under the etching layer, the adhesion of melted particles during laser processing is reduced, and
Since the molten solidified layer (10) is easily corroded and the other base material portions are covered with the corrosion-resistant coating (2), processing into a predetermined shape can be easily performed.
なお、上記実施例では、レーザ加工したのち、金属板を
エツチング液中に浸漬してエツチング加工したが、この
エツチング加工は、エツチング液をスプレーするなど他
の方法でおこなってもよい。In the above embodiment, after laser processing, the metal plate was immersed in an etching solution for etching, but this etching may be performed by other methods such as spraying the etching solution.
なおまた、」二記実施例は、金属板の加工について述べ
たがこの発明は、他の部材の加工にも適用できる。Furthermore, although the second embodiment describes the processing of metal plates, the present invention can also be applied to the processing of other members.
レーザ加工とエツチング加工を組合せ、被加工物に耐食
性被膜を形成し、この耐食性被膜の形成された被加工部
にレーザ光を照射して、所要部分上の耐食性被膜を除去
するとともに、所要部分に溶融凝固層を形成してエツチ
ングすると、溶融凝固層が選択にエツチングされること
から、容易に所定形状の加工をおこなうことができる。By combining laser processing and etching processing, a corrosion-resistant film is formed on the workpiece, and a laser beam is irradiated onto the workpiece on which this corrosion-resistant film has been formed to remove the corrosion-resistant film on the required part and to remove the corrosion-resistant film on the required part. When a molten solidified layer is formed and etched, the molten solidified layer is selectively etched, so that processing into a predetermined shape can be easily performed.
第１−図および第２図は、この発明の詳細な説明するた
めの図で、第１図は金属板にレーザ光を照射する方法の
説明図、第２図（Ａ）ないしくＤ）図はそれぞれ金属板
の加工工程説明図である。
（１）・・・金属板、 （２）・・・耐食性
被膜。
（４）・・・Ｘ−Ｙテーブル、 （５）・・・レーザ
発振器、（６）・・・レーザ光、 （１０）・
・・溶融凝固層、（１２）・・・エツチング液。Figures 1 and 2 are diagrams for explaining the invention in detail, with Figure 1 being an explanatory diagram of a method of irradiating a metal plate with a laser beam, and Figures 2 (A) to D). are respectively explanatory diagrams of the processing steps of the metal plate. (1)...Metal plate, (2)...Corrosion-resistant coating. (4)...X-Y table, (5)...laser oscillator, (6)...laser light, (10)...
...Melted solidified layer, (12)...Etching liquid.
Claims (1)
膜の形成された被加工物にレーザ光を照射してこの被加
工物の所定部分上の耐食性被膜を除去するとともに上記
所定部分に被加工物の溶融凝固層を形成する工程と、こ
の溶融凝固層の形成された被加工物をエッチング液に接
触させて上記溶融凝固層を選択的にエッチングする工程
とからなることを特徴とするレーザを利用した選択的エ
ッチング方法。A process of forming a corrosion-resistant coating on a workpiece, and irradiating the workpiece on which the corrosion-resistant coating is formed with a laser beam to remove the corrosion-resistant coating on a predetermined portion of the workpiece, and processing the predetermined portion of the workpiece. A laser characterized by comprising a step of forming a melted solidified layer of an object, and a step of selectively etching the melted solidified layer by bringing the workpiece on which the melted solidified layer is formed into contact with an etching solution. Selective etching method utilized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931786A JPS62218587A (en) | 1986-03-19 | 1986-03-19 | Selective etching method utilizing laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931786A JPS62218587A (en) | 1986-03-19 | 1986-03-19 | Selective etching method utilizing laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62218587A true JPS62218587A (en) | 1987-09-25 |
Family
ID=13109861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5931786A Pending JPS62218587A (en) | 1986-03-19 | 1986-03-19 | Selective etching method utilizing laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62218587A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5185295A (en) * | 1990-05-16 | 1993-02-09 | Kabushiki Kaisha Toshiba | Method for dicing semiconductor substrates using a laser scribing and dual etch process |
| WO1994024705A1 (en) * | 1993-04-14 | 1994-10-27 | Hitachi Construction Machinery Co., Ltd. | Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device |
| JP2006156842A (en) * | 2004-11-30 | 2006-06-15 | Seiko Epson Corp | Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device |
| JP2007335256A (en) * | 2006-06-15 | 2007-12-27 | Dainippon Printing Co Ltd | Sheet-like member for fuel cell, manufacturing method of sheet-like member, sheet-like member for membrane filter, manufacturing method of sheet-like member for membrane filter, metallic sheet-like member having pores formed therein, and manufacturing method of metallic sheet-like member having pores formed therein |
-
1986
- 1986-03-19 JP JP5931786A patent/JPS62218587A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5185295A (en) * | 1990-05-16 | 1993-02-09 | Kabushiki Kaisha Toshiba | Method for dicing semiconductor substrates using a laser scribing and dual etch process |
| WO1994024705A1 (en) * | 1993-04-14 | 1994-10-27 | Hitachi Construction Machinery Co., Ltd. | Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device |
| US5580466A (en) * | 1993-04-14 | 1996-12-03 | Hitachi Construction Machinery Co., Ltd. | Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device |
| JP2006156842A (en) * | 2004-11-30 | 2006-06-15 | Seiko Epson Corp | Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device |
| JP2007335256A (en) * | 2006-06-15 | 2007-12-27 | Dainippon Printing Co Ltd | Sheet-like member for fuel cell, manufacturing method of sheet-like member, sheet-like member for membrane filter, manufacturing method of sheet-like member for membrane filter, metallic sheet-like member having pores formed therein, and manufacturing method of metallic sheet-like member having pores formed therein |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1938837B (en) | Method of forming a scribe line on a ceramic substrate | |
| US5178725A (en) | Method for working ceramic material | |
| US5221422A (en) | Lithographic technique using laser scanning for fabrication of electronic components and the like | |
| JP2000071086A (en) | Method and device for shape processing by laser light | |
| EP0427737B1 (en) | Method of micro-working the surface of a workpiece while using a laser beam | |
| JPS62218587A (en) | Selective etching method utilizing laser | |
| US5509556A (en) | Process for forming apertures in a metallic sheet | |
| US20020102745A1 (en) | Process for modifying chip assembly substrates | |
| JP2008119735A (en) | Method of working high-hardness material | |
| JPS59104287A (en) | Laser working method | |
| US20230249290A1 (en) | Laser deburring and chamfering method and system | |
| JPH07185875A (en) | Material processing method by pulse laser | |
| CN108747010B (en) | SMT ladder template and manufacturing method thereof | |
| JPH04344887A (en) | Laser beam machining method | |
| JP2000202664A (en) | Lasder drilling method | |
| JPH08187588A (en) | Laser beam processing method | |
| Nammi et al. | Hybrid laser scribing and chemical etching technique using pulsed Nd 3+: YAG laser to fabricate controlled micro channel profile | |
| Sadegh Amalnik | An intelligent knowledge based system for CO2 laser beam machining for optimization of design and manufacturing | |
| JPH0238587A (en) | Laser beam machining and wet etching method | |
| JP2022139923A (en) | Method for manufacturing workpiece | |
| JP2004074211A (en) | Laser beam machining method | |
| JPH08269764A (en) | Precision electroforming method | |
| JPH0428490A (en) | Laser beam hole machining method for ceramics | |
| Rutt | Applying Industrial Lasers for Improved Manufacturing Productivity | |
| JPH03291185A (en) | Working method for ceramics |