JPH0122986B2 - - Google Patents

Info

Publication number
JPH0122986B2
JPH0122986B2 JP58081887A JP8188783A JPH0122986B2 JP H0122986 B2 JPH0122986 B2 JP H0122986B2 JP 58081887 A JP58081887 A JP 58081887A JP 8188783 A JP8188783 A JP 8188783A JP H0122986 B2 JPH0122986 B2 JP H0122986B2
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating sheet
flat semiconductor
insulating
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58081887A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59205742A (ja
Inventor
Masahiro Tsuruta
Kyoshi Kasahara
Yuzuru Yonehata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8188783A priority Critical patent/JPS59205742A/ja
Publication of JPS59205742A publication Critical patent/JPS59205742A/ja
Publication of JPH0122986B2 publication Critical patent/JPH0122986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8188783A 1983-05-09 1983-05-09 半導体冷却装置 Granted JPS59205742A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8188783A JPS59205742A (ja) 1983-05-09 1983-05-09 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8188783A JPS59205742A (ja) 1983-05-09 1983-05-09 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS59205742A JPS59205742A (ja) 1984-11-21
JPH0122986B2 true JPH0122986B2 (enrdf_load_html_response) 1989-04-28

Family

ID=13758953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8188783A Granted JPS59205742A (ja) 1983-05-09 1983-05-09 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS59205742A (enrdf_load_html_response)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5355981A (en) * 1976-10-30 1978-05-20 Shinetsu Chemical Co Method of heat sinking for electric circuit
JPS5722244U (enrdf_load_html_response) * 1980-07-10 1982-02-04

Also Published As

Publication number Publication date
JPS59205742A (ja) 1984-11-21

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