JPH01227078A - Inspecting device for glass substrate - Google Patents

Abstract

PURPOSE:To facilitate checking for continuity of a lead pattern, by arranging an electrode body being in a package contact with one end of a lead pattern on a glass substrate and an electrode terminal independently being in contact with the other end thereof. CONSTITUTION:After picked out with a pincette 12 from a carrier A at a conveying section 9 for a pre-matching on a base 13, a substrate 2 yet to be inspected is placed on a base 15 at an inspector section 8. Ends 7a and 7b of a lead pattern of the substrate 2 are set at positions facing a train of probes 17 of a probe card 18 and a copper plate 19 of an electrode body 16. The base 15 is lifted until it gets in surface contact with a wire end 7a concentrating on an IC chip setting position 6 of the lead pattern and the copper plate 19 of the electrode body 16 while the probe 17 is brought into contact with the other end 7b thereof independently and moreover, the electrode body 16 is lowered to produce an even pressing force. Thus, a continuity test of a pattern is performed with a tester 23 thereby achieving a higher reliability facilitating inspection with accurate contact.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a glass substrate inspection device.

(Prior Art) As a display device that displays characters, numbers, figures, images, etc. using electrical means, for example, an LCD (Liquid
Crystal Display (liquid crystal display) devices are in practical use.

Generally, the liquid crystal display section of an LCD device uses a linear electrode simple matrix high time division driving method or a thin film transistor (thin film transistor) for each pixel.
The display unit is formed using an active matrix method with an additional TPT (TPT), and displays such a display section by driving a driver, that is, a drive IC. This drive I
Chip-on-glass mounting, in which the drive IC is mounted directly on a glass substrate, is a popular choice for C mounting, as the number of connection terminals is rapidly increasing as liquid crystal display elements become larger and the display capacity increases, and high-density mounting is required. The implementation has been put into practical use.

This chip-on-glass mounting is one in which bumps are formed all over the element area of the drive IC, face-down bonded onto electrodes formed on a glass substrate via a conductive adhesive, and then resin-sealed. .

(Problem to be Solved by the Invention) However, when mounting a drive IC on a glass substrate as described above, there are many electrodes formed on the sides of the liquid crystal display section to the mounting position of the drive IC. It is necessary to draw out the conductive wiring, and at this time, the wiring pitch of the drawn out wiring is, for example, about 401 (20 lines, 20 spaces). Here, if a break occurs in a part of each lead wiring, even if a drive IC is mounted, the desired result cannot be obtained and the drive IC is often wasted, resulting in a decrease in yield. There was a problem in that it led to

This invention was made in response to the above-mentioned problem, and by performing a continuity check on the conductive wiring from the many electrodes formed in the liquid crystal display section of the glass substrate to the position where the drive IC is mounted in advance, An object of the present invention is to provide a glass substrate inspection device that can improve quality and yield, and can also achieve high reliability.

[Structure of the invention]

(Means for Solving the Problems) The present invention is characterized by comprising an electrode body that collectively contacts one end of a plurality of lead patterns, and an electrode terminal that contacts the other end of each lead pattern independently. shall be.

(Function and effect) By providing electrode terminals that contact the other ends of each turn independently, it becomes possible to easily check the continuity of the lead pattern, which improves the quality and yield of glass substrates, resulting in higher This has the effect of increasing reliability.

(Example) Next, an example in which the apparatus of the present invention is applied to an LCD probe apparatus for inspecting an LCD board will be described with reference to the drawings.

LCDC, which is the object to be inspected in the LCD probe device ■
D substrate strip For example, two glass substrates ■ as shown in Figure 3.
Liquid crystal is injected into a microscopic space where two are placed facing each other, and scanning signal and data signal lines (a) are formed in a grid pattern on the opposing surface.
The intersection points are electrically displayed as pixels. Each of the above lines (A) is connected to an appropriate electrode pad (2), and from each electrode pad (2) to the mounting position 0 of a drive IC chip (driver IC, for example) on the glass substrate (2), conductive conductivity is formed at a pitch of, for example, 40 layers. Lead patterns (3) are formed insulated from each other.

Next, an LCD mounted with the above-mentioned driving IC chip
The configuration of the LCD probe device (2) which performs a continuity check on the lead pattern (2) wired between the electrode pad (2) connected to each line (A) of the D substrate strip to the drive IC chip mounting position M (0) will be explained.

This LCD probe device (2) is mainly composed of an inspection section (2) for performing the above-mentioned continuity check, and a transport section (2) for transporting the LCDCD substrate to this inspection section (8).

The transport section (■) includes a storage section (10) for setting a carrier (A) containing an uninspected LCD board (■), and a storage section (10) for setting a carrier (B) containing an inspected LCD board (■). 11), further comprising the above carrier (
Take out the uninspected LCD board ■ from A) and place it in the inspection section ■
and inspected LCDCD board carrier (B
) vacuum tweezers (12) for transporting the
A pre-alignment stage (13) is provided on which the LCDCD substrate transported by the vacuum tweezers (12) is placed and a predetermined alignment is performed.

The carriers (A) and (B) are partitioned into a number of slots by a number of grooves formed in the side walls, and one LCD/CD board is stored in each slot. An opening is formed on the front surface for extending the LCDCD substrate.

The vacuum tweezers (12) are movable in the horizontal and vertical directions, and are rotatable about the shaft (14). Further, the vacuum tweezers (12) are connected to a vacuum pump (not shown), and the vacuum tweezers (12) are
CDCD substrates can be vacuum-adsorbed.

The pre-alignment stage (13)
The board (1) is placed thereon and is rotatable, allowing the position of the LCD/CD board to be changed in the longitudinal direction. A sensor (not shown) is placed near this pre-alignment stage (13) to recognize the position of the LCD board (■) and
The LCDCD board example is realigned based on this position information.

Next, an inspection section (8) for inspecting the LCDCD substrate transported from the above-mentioned transport section 0 will be explained with reference to FIG.

The inspection section (8) is provided with a mounting table (15) for supporting an LCDCD substrate, for example, by vacuum suction.

This mounting table (15) is arranged in the direction of the orthogonal axis on the mounting surface
It is movable in the axial, Y-axis direction, the Z-axis direction, which is the vertical direction, and the θ direction, which is the circumferential direction of the Z-axis, and alignment can be performed by moving the LCDCD board in the Y and θ directions. At a predetermined position within the movement range of the mounting table (15), an LCD display is placed above the mounting table (15).
D board example: An electrode body (16) that can be electrically contacted by enclosing one end (7a) of the lead pattern ■, which is concentrated in the position ■ where the IC chip is mounted, and other parts of the lead pattern ■. A probe card (18) is provided with a plurality of electrode terminals, such as probe needles (17), each of which individually contacts the end portion (7b). As shown in FIG. 2, the electrode body (16) is provided with an electrically conductive metal such as a copper plate (19) as a so-called solid electrode so as to face the mounting table (15) at the one drive IC chip mounting position ( This copper plate (1
9) In the upward direction, even if the copper plate (19) is tilted or the surface of the LCDCD board is somewhat uneven, the mounting table (15) can be overdriven to make accurate batch contact. Insulating rubber (20), which is an elastic body with cushioning properties, is stacked. Also, this insulating rubber (20)
By providing this, it is possible to protect the LCDCD board when the copper plate (19) is used as an LCDCD board. or,
A support body (21) made of an insulating material such as Delrin (trade name), a fluorine-based resin, is stacked above the insulating rubber (20). The above insulating rubber (20)
A through hole (22) is coaxially provided in the central axis direction of the support (21), and a tester (23) is connected to the upper surface of the support (21) to which this through hole (22) corresponds. A connector (24) is provided. A conductive wire (
25). The electrode body (16) configured in this way is driven by a drive device (2) so that it can be raised and lowered in the vertical direction.
6). Further, a probe card (18) is provided in the lateral direction of the electrode body (16). This probe card (18) has the above lead pattern ■
A plurality of probe needles (17) are attached to the printed circuit board (26) at one end (7b) on the other end side of the IC chip mounting position 0 side (7a) so as to correspond to the arrangement of this one end (7b).
) is installed. The electrode body (16) is connected to the printed circuit board (26) on which the probe needle (17) is attached.
Wired to the tester (23) connected to. Also, the tip of the probe needle (17), that is, the lead pattern ■
and the contact position with one end (7b) of the electrode body (16).
The bottom surface of the copper plate (19), that is, one end of the lead pattern ■ (
The height is adjusted so that the surface in contact with 7a) is substantially on the same plane.

As mentioned above, the LCD in the transport section) and the inspection section (c)
The probe device is equipped with a groove.

Next, the groove operation function of the above-mentioned LCD probe device will be explained.

First, in the transport section 0, place the uninspected LCD board ■ on the carrier (A).
It is carried out using vacuum tweezers (12) and placed on the pre-alignment stage (13). LCDC here
After preliminary alignment with a sensor not shown in the example of the D board,
Using the vacuum tweezers (12) or a separate transport mechanism, place the LCDCD board sample inspection unit (c) on the mounting table (15).
Place it on. After accurate alignment, conduction testing of the lead pattern ■ is performed on the mounting table (1
5) in the predetermined position, that is, each end (7a) (7b) of the LCDCD board pattern (1) is connected to the probe card (18).
) probe needle (17) array and electrode body (16) copper plate (
19) and moves as if it were installed in a position opposite to. Next, raise the mounting table (15) and drive the lead pattern (I).
One end (7
a) and the copper plate (19) of the electrode body (16) are brought into surface contact, and the end (7b) on the other end side of each lead pattern ■
The probe needles (17) are brought into contact with each other independently. At this point, either raise the mounting table (15) further or raise the electrode body (16).
descend and apply overdrive. Then, the contact surface of the copper plate (19) of the electrode body (16) has a uniform pressing force due to the elasticity of the insulating rubber (20), and the contact at each point becomes more accurate. In such a contact state,
The tester (23) performs an electrical continuity test on lead pattern (2). After this test, the mounting table (15) is lowered to release the contact state and perform the next test.

As mentioned above, when performing a continuity test on a large number of lead patterns formed on a glass substrate, the electrode body that contacts one end of the plurality of lead patterns all at once and the lead patterns on the other end are tested individually. By providing electrode terminals that contact each other independently and performing the test, it is possible to easily speed up the test. In particular, by providing the electrode body with elastically deformable insulating rubber, contact with the lead pattern can be made more accurately, resulting in improved quality and yield.

The present invention is not limited to the above-mentioned embodiments. For example, the same effects as in the above-mentioned embodiments can be obtained by using conductive and elastically deformable rubber for the contact surface of the electrode body. or,
The lead pattern formed on the glass substrate is a drive IC
It does not have to be used for mounting chips, it may be used for mounting IC chips for controllers, it may be connected to a TAB, or it may be used when mounting a flat package. Furthermore, in the lead pattern provided on the glass substrate, one end side of the lead pattern provided concentrated at the IC chip mounting position is contacted independently with each probe needle of the probe card, and parallel to the other end side. The inspection may be performed by bringing an electrode body having a rectangular contact surface into contact with the lead pattern provided as a lead pattern. Further, when overdriving is applied by bringing the glass substrate into contact with the probe needle and the electrode body, the glass substrate may be raised, the electrode body may be lowered, or both may be carried out simultaneously.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a glass substrate inspection apparatus for explaining an embodiment of the present invention, FIG. 2 is a configuration diagram of the electrode body of FIG. 1, and FIG. FIG. 4 is an explanatory view of the main parts of a certain LCD board, and is an overall explanatory view of FIG. 1. 1...LCD probe device

Claims (1)

[Claims] In an inspection device that tests the continuity of a large number of lead patterns that are insulated and wired at positions where IC chips are mounted on a glass substrate, an electrode body that contacts one end of a plurality of lead patterns all at once, and a A glass substrate inspection device characterized by comprising electrode terminals that independently contact the other ends.