JPS61108983U - - Google Patents

Info

Publication number
JPS61108983U
JPS61108983U JP19291384U JP19291384U JPS61108983U JP S61108983 U JPS61108983 U JP S61108983U JP 19291384 U JP19291384 U JP 19291384U JP 19291384 U JP19291384 U JP 19291384U JP S61108983 U JPS61108983 U JP S61108983U
Authority
JP
Japan
Prior art keywords
probe
thin
lead
contact
spring elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19291384U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19291384U priority Critical patent/JPS61108983U/ja
Publication of JPS61108983U publication Critical patent/JPS61108983U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は薄形ICの一例の斜視図、第2図は従
来のポゴピンの断面図、第3図は本考案のプロー
ブの一例を模式的に描いた説明図、第4図は本考
案の導通装置の一実施例の斜視図、第5図は第4
図のV部の拡大図である。 1……薄形ICのパツケージ、2……同リード
、3……ポゴピン、3a……ガイド孔、3b……
ホルダ、3c……コンタクトピン、3d……スプ
リング、4……プローブ、4a,4a′……プロ
ーブの先端部、5……ホルダ、6……ベースプレ
ート、7……電線、8……プローブホルダ、8a
……開口、9……昇降ベース、10……ガイド柱
Fig. 1 is a perspective view of an example of a thin IC, Fig. 2 is a sectional view of a conventional pogo pin, Fig. 3 is a schematic illustration of an example of the probe of the present invention, and Fig. 4 is a diagram of the probe of the present invention. A perspective view of one embodiment of the conduction device, FIG.
It is an enlarged view of the V section of the figure. 1... Thin IC package cage, 2... Same lead, 3... Pogo pin, 3a... Guide hole, 3b...
Holder, 3c... Contact pin, 3d... Spring, 4... Probe, 4a, 4a'... Probe tip, 5... Holder, 6... Base plate, 7... Electric wire, 8... Probe holder, 8a
...Opening, 9...Elevating base, 10...Guide pillar.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄形ICに設けられた複数個のリードをそれぞ
れ測定回路に導通せしめる装置において、バネ弾
性を有する細い杆状の金属部材の先端付近を折り
曲げると共に最先端を尖らせてプローブを構成し
、複数個のプローブの最先端をそれぞれ薄形IC
のリードに対してほぼ直角に当接せしめるように
該プローブの中央乃至根元付近を支承し、上記の
支承部分を駆動して最先端部をリードに当接せし
め、プローブのバネ弾性によつて押し付け得るよ
うに構成したことを特徴とする薄形ICのリード
導通装置。
In a device that connects a plurality of leads provided on a thin IC to a measurement circuit, a probe is constructed by bending the tip of a thin rod-shaped metal member with spring elasticity and sharpening the leading edge. The cutting edge of each probe is connected to a thin IC.
The center or base of the probe is supported so as to be in contact with the lead at almost right angles, and the supporting portion is driven to bring the tip end into contact with the lead, and the probe is pressed by the spring elasticity of the probe. 1. A lead conduction device for a thin IC, characterized in that it is configured to obtain a lead conduction device for a thin IC.
JP19291384U 1984-12-21 1984-12-21 Pending JPS61108983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19291384U JPS61108983U (en) 1984-12-21 1984-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19291384U JPS61108983U (en) 1984-12-21 1984-12-21

Publications (1)

Publication Number Publication Date
JPS61108983U true JPS61108983U (en) 1986-07-10

Family

ID=30750325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19291384U Pending JPS61108983U (en) 1984-12-21 1984-12-21

Country Status (1)

Country Link
JP (1) JPS61108983U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227078A (en) * 1988-03-07 1989-09-11 Tokyo Electron Ltd Inspecting device for glass substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443354A (en) * 1977-09-09 1979-04-05 Sanyo Electric Co Ltd Apparatus for controlling capacity of multi-type refrigerating machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5443354A (en) * 1977-09-09 1979-04-05 Sanyo Electric Co Ltd Apparatus for controlling capacity of multi-type refrigerating machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227078A (en) * 1988-03-07 1989-09-11 Tokyo Electron Ltd Inspecting device for glass substrate

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