JPH01218807A - Semi-conductor seal molding device - Google Patents

Semi-conductor seal molding device

Info

Publication number
JPH01218807A
JPH01218807A JP4679888A JP4679888A JPH01218807A JP H01218807 A JPH01218807 A JP H01218807A JP 4679888 A JP4679888 A JP 4679888A JP 4679888 A JP4679888 A JP 4679888A JP H01218807 A JPH01218807 A JP H01218807A
Authority
JP
Japan
Prior art keywords
molding
resin
sections
increase
air vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4679888A
Other languages
Japanese (ja)
Other versions
JPH057172B2 (en
Inventor
Shoji Obara
小原 省治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4679888A priority Critical patent/JPH01218807A/en
Publication of JPH01218807A publication Critical patent/JPH01218807A/en
Publication of JPH057172B2 publication Critical patent/JPH057172B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent resin flowing out from a molding section through an air vent from flowing out into unrequisite sections, increase productivity of seal molding, enhance the quality and reduce the cost by pressure welding a projected section to a lead frame between a top force and a bottom force in a manner to bite therein. CONSTITUTION:Projected sections 41 and 42 are provided along the both sides of an air vent 3 of a top force 4. Said projected sections 41 and 42 are provided with sharp ends and are pressure filled to a lead frame 61 in a manner to bite therein. Resin is prevented from leaking out of the air vent by the action of said projected sections 41 and 42 without being affected by press punching drop. A molding device is not required to be of large size to increase the clamping capacity, nor required to reduce in the number of molding sections to increase the clamping capacity per one molding section by carrying out said arrangement, and resin flashes are prevented from being generated by resin leakage from the air vent 3 and adhered to a lead section to turn into a product to eliminate the necessity of removing works for the same, increase the productivity of seal molding, enhance the quality and reduce the cost.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、半導体被成形品(フレームという)−〜硬化
性樹脂で封止成形するために用いる半導体封止成形装置
に関する。
Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention relates to a semiconductor encapsulation molding apparatus used for encapsulating a semiconductor molded article (referred to as a frame) with a curable resin. .

(従来の技術) 従来、上記フレームを熱硬化性樹脂で封止成形する構造
は第2図、第3図に示される如きものである。第2図は
封止成形装置における成形状態図、第3図はその一部断
面図である。ただし第2図では、フレームを明示するた
め、封止成形用上型の大部分を削除したような形で画か
れている。
(Prior Art) Conventionally, a structure in which the frame is sealed and molded with a thermosetting resin is as shown in FIGS. 2 and 3. FIG. 2 is a molding state diagram in the sealing molding apparatus, and FIG. 3 is a partial sectional view thereof. However, in FIG. 2, most of the upper mold for sealing molding is removed to clearly show the frame.

即ち封止成形構造において任意の温度に加熱され溶融状
態にされた熱硬化性樹脂は、封止成形装置に設けられた
流路口1を介して成形部2に充填される。封止成形装置
には樹脂成形部2の未充填、気泡を防ぐため、成形部2
よシ凹状の溝(エアーペンドという)3を封止成形用上
型4に設けた構造である。5は下盤、6はリードフレー
ム、6゜はり−とである。
That is, in the sealing molding structure, the thermosetting resin heated to an arbitrary temperature and made into a molten state is filled into the molding part 2 through the channel port 1 provided in the sealing molding apparatus. In order to prevent the resin molding part 2 from being unfilled and to prevent air bubbles, the sealing molding device has a molding part 2.
It has a structure in which a horizontally concave groove (referred to as an air pen) 3 is provided in an upper die 4 for sealing molding. 5 is a lower plate, 6 is a lead frame, and a 6° beam.

(発明が解決しようとする課題) 一般にプVス抜きで成形されたリードフレーム6は、フ
レーム抜きだれ(フレーム縁部にRがついてしまうこと
、つまシフレーム縁部が正確に垂直に抜かれず丸みを帯
びること)により、リード面の平滑部を得られていない
ことが多く、リードフレーム6を用いて封止成形を行な
った場合、成形部2よシェアーペンド3を介して流出し
た樹脂は、エアーペンド部3からその側方に流出しく樹
脂パリ)、製品となるリード部に付着する状態であった
。そのためリードフレーム6のリード面平滑部を得るの
に、成形装置を大形化して封止成形用型締能力を上げる
か、もしくは成形部2の取シ数を削減して成形部1個当
シの型締能力を上けたシする必要があった。またエアー
ペンド3よシ流出した樹脂が、製品となるリード部に付
着した場合、対土成形後にこの付着した樹脂の取り除き
工程が必要となっていた。
(Problems to be Solved by the Invention) In general, the lead frame 6 that is formed by punching out plastic Vs has frame punching sag (R is formed on the edge of the frame, and the edge of the frame is not punched out accurately perpendicularly and is rounded. In many cases, it is not possible to obtain a smooth part on the lead surface due to the molding part 2 and the shear pen 3. The resin leaked out from part 3 to the side (resin particles) and adhered to the lead part that would become the product. Therefore, in order to obtain a smooth lead surface portion of the lead frame 6, it is necessary to increase the size of the molding device to increase the mold clamping capacity for sealing molding, or to reduce the number of holes in the molding section 2 so that one molding section can be used. It was necessary to improve the mold clamping ability of the mold. Furthermore, if the resin that has flowed out of the air pen 3 adheres to the lead portion that will become the product, a step is required to remove the adhered resin after soil molding.

本発明の目的は、リードフレームの抜きだれに影響され
ることなくエアーベンドよシネ要個所へ成形樹脂が流出
しない構成を得、前記従来の問題点を改善することにあ
る。
An object of the present invention is to obtain a structure in which the molding resin does not flow out from the air bend to important parts of the cine without being affected by the sagging of the lead frame, and to improve the above-mentioned conventional problems.

〔発明の構成〕[Structure of the invention]

(課題を解決するための手段と作用) 本発明は、 封止成形用上型、下型を有し、牛導体被成形品を熱硬化
性樹脂で封止成形する半導体封止成形装置において、封
止成形時に成形部に充満されたガスや溶融状態にされた
熱硬化性樹脂を排田する溝を有し、該溝の両側部にG 
って凸部を有することを特徴とする半導体封止成形装置
である。
(Means and effects for solving the problem) The present invention provides a semiconductor encapsulation molding apparatus that has an upper mold and a lower mold for encapsulation molding and encapsulates a conductor molded product with a thermosetting resin. It has a groove for discharging the gas filled in the molding part during sealing molding and the thermosetting resin in a molten state, and G is provided on both sides of the groove.
This is a semiconductor encapsulation molding device characterized by having a convex portion.

即ち本発明は、上記凸部が上記上型、下型間のリードフ
レームにくい込む如く圧接することで、成形部よシェア
ーペンドを介して流出した樹脂が、エアーペンド内よ)
不要個所へ流出しない構成とし、不要樹脂パリ等の発生
を防止して封止成形の生産性及び品質の向上、コスト低
減化を図ったものである。
That is, in the present invention, the convex portion presses into the lead frame between the upper mold and the lower mold so that the resin flows out from the molding part through the shear pen and into the air pen.
It has a structure that does not leak to unnecessary locations, and prevents the generation of unnecessary resin particles, thereby improving productivity and quality of sealing molding, and reducing costs.

(実施例) 以下図面を参照して本発明の一実施例を説明する。第1
図は同実施例の要部断面図であるが、これは前記従来例
のものと対応させた場合の例であるから、対応個所には
同一符号を付して説明を省略し、特徴とする点の説明を
行なう。本実施例の特徴は、第1図に示される如く上型
4のエアーベンド3の両側部に沿って凸部(突条) ’
1*’fを設けたことである。この凸部(突条) 4.
.4゜は先端側が鋭く、リードフレーム6、にくい込む
ように圧接される。
(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of the main part of the same embodiment, but since this is an example in which it corresponds to that of the conventional example, corresponding parts are given the same reference numerals and explanations are omitted, and the features are as follows. Let me explain the points. The feature of this embodiment is that, as shown in FIG.
1*'f is provided. This convex part (projection) 4.
.. 4° has a sharp tip and is pressed into contact with the lead frame 6 so as to sink into it.

このような構成であれば、凸部’1m’tの作用で、リ
ードフレームのプレス抜きだれζこ影響されることなく
、エアーベンドよシ樹脂が洩れるのを防止できる。この
ため成形装置を大型化して型締能力を上けたシ、成形部
2の取多数を削減して成形部1個当りの型締能力を上げ
たシする必要もなくなシ、またエアーベンド3よシ樹脂
洩れして、製品となるリード部に付着する樹脂パリ発生
が防止でき、その除去作業が不要化された。
With this configuration, the effect of the convex portion '1m't can prevent the resin from leaking through the air bend without being affected by the press-pull sag of the lead frame. Therefore, there is no need to increase the mold clamping capacity by increasing the size of the molding device, or to reduce the number of molding units 2 to increase the mold clamping capacity per molding unit. This prevents resin from leaking and causing resin particles to adhere to the lead parts of the product, and eliminates the need for removal work.

なお本発明は上記実施例のみに限られず種々の応用が可
能である。例えば実施例ではエアーペンド側部の凸部を
上型4に設けたが、エアーベンド及び凸部を下型5の方
へ設けても、上型と下型の両方に設けてもよい。
Note that the present invention is not limited to the above-mentioned embodiments, and can be applied in various ways. For example, in the embodiment, the convex portion on the side of the air bend is provided on the upper mold 4, but the air bend and the convex portion may be provided on the lower mold 5 or on both the upper mold and the lower mold.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く本発明によれば、樹脂洩れを防止でき
るから、封止成形の生産性、品質向上、コスト低減化が
可能となるものである。
As explained above, according to the present invention, since resin leakage can be prevented, it is possible to improve the productivity, quality, and cost reduction of sealing molding.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す要部断面図、第2図は
従来の封止成形装置における成形状態図、第3図は同要
部断面図である。 1・・・流路口、2・・・成形部、3・・・エアーベン
ド(溝)、4・・・上型、’1eG・・・凸部(突条)
、5・・・下W、l!i・・・リードフレーム、6.・
・・リード。
FIG. 1 is a sectional view of a main part showing an embodiment of the present invention, FIG. 2 is a molding state diagram in a conventional sealing molding apparatus, and FIG. 3 is a sectional view of the main part. 1... Channel opening, 2... Molding part, 3... Air bend (groove), 4... Upper mold, '1eG... Convex part (projection)
, 5...lower W, l! i...Lead frame, 6.・
...Lead.

Claims (2)

【特許請求の範囲】[Claims] (1)封止成形用上型、下型を有し、半導体被成形品を
熱硬化性樹脂で封止成形する半導体封止成形装置におい
て、封止成形時に成形部に充満されたガスや溶融状態に
された熱硬化性樹脂を排出する溝を有し、該溝の両側部
に沿って凸部を有することを特徴とする半導体封止成形
装置。
(1) In a semiconductor encapsulation molding device that has an upper mold and a lower mold for encapsulation molding and encapsulates a semiconductor molded product with a thermosetting resin, gas or melt that fills the molding part during encapsulation molding is used. 1. A semiconductor encapsulation molding apparatus, comprising a groove for discharging a thermosetting resin, and a convex portion along both sides of the groove.
(2)前記溝及び凸部は前記封止成形用上型及びまたは
下型に設けられ、前記凸部は前記溝の両側で前記上型、
下型間のリードフレームにくい込む如く圧接されて前記
樹脂の洩れを防止する構成であることを特徴とする請求
項1に記載の半導体封止成形装置。
(2) The groove and the convex portion are provided on the upper mold and/or the lower mold for sealing molding, and the convex portion is provided on both sides of the groove in the upper mold,
2. The semiconductor encapsulation molding apparatus according to claim 1, wherein the semiconductor encapsulation molding apparatus is configured to be pressed into contact with the lead frame between the lower molds to prevent leakage of the resin.
JP4679888A 1988-02-29 1988-02-29 Semi-conductor seal molding device Granted JPH01218807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4679888A JPH01218807A (en) 1988-02-29 1988-02-29 Semi-conductor seal molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4679888A JPH01218807A (en) 1988-02-29 1988-02-29 Semi-conductor seal molding device

Publications (2)

Publication Number Publication Date
JPH01218807A true JPH01218807A (en) 1989-09-01
JPH057172B2 JPH057172B2 (en) 1993-01-28

Family

ID=12757352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4679888A Granted JPH01218807A (en) 1988-02-29 1988-02-29 Semi-conductor seal molding device

Country Status (1)

Country Link
JP (1) JPH01218807A (en)

Also Published As

Publication number Publication date
JPH057172B2 (en) 1993-01-28

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