JPH01218807A - Semi-conductor seal molding device - Google Patents

Abstract

PURPOSE:To prevent resin flowing out from a molding section through an air vent from flowing out into unrequisite sections, increase productivity of seal molding, enhance the quality and reduce the cost by pressure welding a projected section to a lead frame between a top force and a bottom force in a manner to bite therein. CONSTITUTION:Projected sections 41 and 42 are provided along the both sides of an air vent 3 of a top force 4. Said projected sections 41 and 42 are provided with sharp ends and are pressure filled to a lead frame 61 in a manner to bite therein. Resin is prevented from leaking out of the air vent by the action of said projected sections 41 and 42 without being affected by press punching drop. A molding device is not required to be of large size to increase the clamping capacity, nor required to reduce in the number of molding sections to increase the clamping capacity per one molding section by carrying out said arrangement, and resin flashes are prevented from being generated by resin leakage from the air vent 3 and adhered to a lead section to turn into a product to eliminate the necessity of removing works for the same, increase the productivity of seal molding, enhance the quality and reduce the cost.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention relates to a semiconductor encapsulation molding apparatus used for encapsulating a semiconductor molded article (referred to as a frame) with a curable resin. .

(Prior Art) Conventionally, a structure in which the frame is sealed and molded with a thermosetting resin is as shown in FIGS. 2 and 3. FIG. 2 is a molding state diagram in the sealing molding apparatus, and FIG. 3 is a partial sectional view thereof. However, in FIG. 2, most of the upper mold for sealing molding is removed to clearly show the frame.

That is, in the sealing molding structure, the thermosetting resin heated to an arbitrary temperature and made into a molten state is filled into the molding part 2 through the channel port 1 provided in the sealing molding apparatus. In order to prevent the resin molding part 2 from being unfilled and to prevent air bubbles, the sealing molding device has a molding part 2.
It has a structure in which a horizontally concave groove (referred to as an air pen) 3 is provided in an upper die 4 for sealing molding. 5 is a lower plate, 6 is a lead frame, and a 6° beam.

(Problems to be Solved by the Invention) In general, the lead frame 6 that is formed by punching out plastic Vs has frame punching sag (R is formed on the edge of the frame, and the edge of the frame is not punched out accurately perpendicularly and is rounded. In many cases, it is not possible to obtain a smooth part on the lead surface due to the molding part 2 and the shear pen 3. The resin leaked out from part 3 to the side (resin particles) and adhered to the lead part that would become the product. Therefore, in order to obtain a smooth lead surface portion of the lead frame 6, it is necessary to increase the size of the molding device to increase the mold clamping capacity for sealing molding, or to reduce the number of holes in the molding section 2 so that one molding section can be used. It was necessary to improve the mold clamping ability of the mold. Furthermore, if the resin that has flowed out of the air pen 3 adheres to the lead portion that will become the product, a step is required to remove the adhered resin after soil molding.

An object of the present invention is to obtain a structure in which the molding resin does not flow out from the air bend to important parts of the cine without being affected by the sagging of the lead frame, and to improve the above-mentioned conventional problems.

[Structure of the invention]

(Means and effects for solving the problem) The present invention provides a semiconductor encapsulation molding apparatus that has an upper mold and a lower mold for encapsulation molding and encapsulates a conductor molded product with a thermosetting resin. It has a groove for discharging the gas filled in the molding part during sealing molding and the thermosetting resin in a molten state, and G is provided on both sides of the groove.
This is a semiconductor encapsulation molding device characterized by having a convex portion.

That is, in the present invention, the convex portion presses into the lead frame between the upper mold and the lower mold so that the resin flows out from the molding part through the shear pen and into the air pen.
It has a structure that does not leak to unnecessary locations, and prevents the generation of unnecessary resin particles, thereby improving productivity and quality of sealing molding, and reducing costs.

(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of the main part of the same embodiment, but since this is an example in which it corresponds to that of the conventional example, corresponding parts are given the same reference numerals and explanations are omitted, and the features are as follows. Let me explain the points. The feature of this embodiment is that, as shown in FIG.
1*'f is provided. This convex part (projection) 4.
．． 4° has a sharp tip and is pressed into contact with the lead frame 6 so as to sink into it.

With this configuration, the effect of the convex portion '1m't can prevent the resin from leaking through the air bend without being affected by the press-pull sag of the lead frame. Therefore, there is no need to increase the mold clamping capacity by increasing the size of the molding device, or to reduce the number of molding units 2 to increase the mold clamping capacity per molding unit. This prevents resin from leaking and causing resin particles to adhere to the lead parts of the product, and eliminates the need for removal work.

Note that the present invention is not limited to the above-mentioned embodiments, and can be applied in various ways. For example, in the embodiment, the convex portion on the side of the air bend is provided on the upper mold 4, but the air bend and the convex portion may be provided on the lower mold 5 or on both the upper mold and the lower mold.

〔Effect of the invention〕

As explained above, according to the present invention, since resin leakage can be prevented, it is possible to improve the productivity, quality, and cost reduction of sealing molding.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a main part showing an embodiment of the present invention, FIG. 2 is a molding state diagram in a conventional sealing molding apparatus, and FIG. 3 is a sectional view of the main part. 1... Channel opening, 2... Molding part, 3... Air bend (groove), 4... Upper mold, '1eG... Convex part (projection)
, 5...lower W, l! i...Lead frame, 6.・
...Lead.

Claims (2)

[Claims] (1) In a semiconductor encapsulation molding device that has an upper mold and a lower mold for encapsulation molding and encapsulates a semiconductor molded product with a thermosetting resin, gas or melt that fills the molding part during encapsulation molding is used. 1. A semiconductor encapsulation molding apparatus, comprising a groove for discharging a thermosetting resin, and a convex portion along both sides of the groove. (2) The groove and the convex portion are provided on the upper mold and/or the lower mold for sealing molding, and the convex portion is provided on both sides of the groove in the upper mold,
2. The semiconductor encapsulation molding apparatus according to claim 1, wherein the semiconductor encapsulation molding apparatus is configured to be pressed into contact with the lead frame between the lower molds to prevent leakage of the resin.