JPH01214145A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To package in high density various chips of multiple function including an EPROM by coating and mounting the EPROM and a flip-chip with a soldering bump with a water-vaporproof insulating resin into an integrated structure. CONSTITUTION:The title hybrid integrated circuit device includes a laminate ceramic substrate 1 having therein a connecting conductor pattern, an EPROM chip 2 mounted on a principal surface thereof adjoining to said substrate, a flip-chip 3 with a soldering bump, a water-vaporproof insulating resin film 4 for coating the chip 2 excepting the top surface of a ultraviolet erasing window 4, a thin film resistor 6 placed on the other principal surface of the substrate 1, and an external connecting lead terminal 7. The EPROM 2 shares the substrate 1 between it and other chip parts (except for the window 4), and is coated with the film 5, thereby achieving high density and high function.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device equipped with a programmable E'FROM chip.

[Conventional technology]

Conventionally, hybrid integrated circuit devices are made by mounting and connecting packaged semiconductor chips and passive chip components on printed circuit boards or ceramic substrates, respectively.
When installing a ROM chip for writing programs,
When there is no need to change the program, a one-time FROM chip that can be written to only once is used, and when it is necessary to change the program, an EPROM chip that can be erased by ultraviolet light is used. In this case, electrically erasable EEFROM is not generally used because it has a smaller storage capacity than EPROM and is disadvantageous for high-density packaging. The chips and other chips are once mounted on separate boards, and then collected and mounted on a single common board.

[Problem to be solved by the invention]

However, conventional hybrid integrated circuit devices assembled by such means not only require complicated assembly work, but also have difficulty in obtaining high-density, high-performance circuit devices.
This method has the disadvantage that it is impossible to avoid increasing the size of the entire device, and therefore, it is not possible to sufficiently meet the demands for lower cost and smaller size of electronic equipment.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a hybrid integrated circuit device in which various multifunctional chips including a programmable EFROM can be mounted at high density.

[Means to solve the problem]

According to the present invention, a hybrid integrated circuit device includes at least a programmable EPROM chip erased by ultraviolet rays and a flip chip having solder bumps, except for the upper surface of the ultraviolet ray erasing window of the EPROM chip. The structure includes covering all parts with a moisture-resistant insulating resin film.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a sectional view of a hybrid integrated circuit device according to an embodiment of the invention. A multilayer ceramic substrate 1, a flip chip 3 having a rewritable programmable EPROM chip, a knob 2 and a solder bump mounted adjacently on one main surface of the contact layer ceramic substrate 1, and an EPROM chip 2. A moisture-resistant insulating resin (e.g., epoxy resin) film 5 covering all parts except the top surface of the ultraviolet erasing window 4, and an internal connecting conductor pattern placed on the other main surface of the laminated ceramic substrate 1. a thin film resistor 6 electrically connected to the programmable EPROM chip 2 or a flip chip 3 having solder bumps through the wafer and an external connection lead terminal 7, where 8 protects the flip chip 3; As is clear from this embodiment, in the hybrid integrated circuit device of the present invention, the programmable EPROM chip 2 is made of silicone pre-coated material, and the programmable EPROM chip 2 is made of silicone pre-coated material. Since a single laminated ceramic substrate 1 is shared and coated with a moisture-resistant insulating resin film 5, the density is high.

High functionality can be easily achieved. The structure of the above embodiment can be easily manufactured by the following method.

FIGS. 2(a) to 2(b) are one-step flowcharts showing the manufacturing method of the above embodiment. First, as shown in Figure 2(a),
A first photosensitive polyimide material is coated on the first surface of the multilayer ceramic substrate 1, which has a thin film resistor formed on the back surface and a connection conductor pattern 9 inside, and is dried.Next, a predetermined pattern is formed Remove unnecessary polyimide material by exposure and etching. Next, this polyimide material is dried and cured to obtain a first polyimide film 10 having a thickness of 10 μm, and a thin film conductor is further formed on the first polyimide film 10 by a sputtering method. Similarly, this is exposed and etched into a predetermined pattern to form, for example, a thin film conductor pattern 11 for mounting the flip chip 3, and this is selectively covered with a second polyimide film 12 to form a flip chip. Only the electrode 13 for mounting the chip 3F is exposed. This work is similarly performed on the mounting surface of the EPROM chip 2.Next, as shown in FIG. 2(b), after laser trimming the thin film resistor on the back surface to a predetermined value to form the thin film resistor 6 Solder cream is applied to each predetermined position on the mounting surface of the chips 2 and 3 to be mounted, and the EPRO is housed in a leadless chip carrier having an ultraviolet erasing window 4.
Flip chip 3 with M2 and solder bumps 14 formed thereon
is placed at a predetermined position on each f5g1 surface. Here, after the substrate 1 is preheated on a hot plate at a temperature of 150° C., the solder is further heated and melted on a hot plate at a temperature of 230° C., and each chip portion is connected by soldering.

Next, the lead frame is connected to the terminals around the board by laser soldering, and the flip chip 3 is coated with a silicone precoat material 8 for stress relaxation, and then the EPROM is
Only the ultraviolet ray erasing window 4 of the chip 2 is shielded and then molded and exteriorized with, for example, epoxy resin 5. i & After forming the lead frame and forming the external connection lead terminal 7, the high density of the present invention with only the ultraviolet erasing window exposed;
A highly functional hybrid integrated circuit device can be obtained.

〔Effect of the invention〕

As described in detail above, according to the present invention, an EPROM housed in a package having an ultraviolet erasing window and a flip chip and other chip components having solder bumps are insulated with moisture resistance and shared on one substrate. Since it can be coated and mounted on an integrated structure with a resin film, rewritable E
A high-density, high-performance hybrid integrated circuit device equipped with FROM can be easily provided.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a hybrid integrated circuit device showing one embodiment of the present invention, and FIGS. 2(a) to 2(b) are one-step sequential diagrams showing the manufacturing method of the above-mentioned embodiment. DESCRIPTION OF SYMBOLS 1... Top layer ceramic substrate, 2... Programmable EPROM chip, 3... Flip chip having solder bumps, 4... Window for ultraviolet erasure, 5
...Moisture-resistant insulating resin film (epoxy resin), 6...Thin film resistor, 7...External connection/connection lead terminal, 8...° silicone precoat material, 9...F8 common conductor pattern, DESCRIPTION OF SYMBOLS 10... First polyimide film, 11... Thin film conductor pattern, 12... Second polyimide film, 13...
Electrode for flip chip mounting, 14...Solder bump.

Claims (1)

[Claims] Program-writable E that is erased by ultraviolet light
1. A hybrid integrated circuit device comprising at least a PROM chip and a flip chip having solder bumps, and wherein all parts of the EPROM chip except for the top surface of an ultraviolet erasing window are covered with a moisture-resistant insulating resin film.