JPH01212064A - Leng size connection image sensor - Google Patents

Abstract

PURPOSE:To unify the thickness of the protective resin of a sensor part by disposing a protective glass on the upper surface of a sensor part. CONSTITUTION:On sensor substrates 103 provided in parallel with each other on a supporting plate 101, the piece of protective glass 114 made of 7059 glass of Coaning Corporation long in the longitudinal direction of the plate 101 is so disposed as to cover the whole sensor part through a protective resin 200. The glass 114 is provided so that the sensor part 105 not deteriorate because of external factors such as humidity, etc. Also, by the existence of the glass 114, the protective resin 200 can be prevented from protruding at the connecting of the sensor substrates 103, and thus the resin 200 can be unified in its thickness.

Description

[Detailed Description of the Invention] (Industrial Application Field) ゛The present invention relates to a close-contact image sensor that reads an image by coming into almost close contact with a document, and in which the sensor part is elongated in order to read particularly large documents. The present invention relates to a long connected image sensor.

(Prior Art) In a contact type image sensor, a photoelectric conversion portion having approximately the same width as a document is formed of amorphous silicon (a-Si) or the like. Therefore, when reading an image drawn on a document, the document and the photoelectric conversion unit can be used in close contact with each other, making it possible to use it as a large-area device that does not require a reduction optical system, and making the reading device more compact. It is attracting attention because it can be realized.

For example, the top view of the contact type image sensor is shown in FIG.
As shown in FIG. 5, a cross-sectional view taken along the line N-IV' in FIG. External connection wiring 41 for supplying control signals etc. to the chip 31
It is composed of

The sensor section 21 is formed by forming a plurality of chromium patterns as the lower electrodes 22 on the insulating substrate 11 by depositing a Cr film and using a photolithography process, and forming an amorphous silicon layer pattern as the photoelectric conversion layer 23 so as to cover these. A plurality of sandwich type sensors are arranged in parallel, each having an indium oxide layer pattern formed as an upper electrode 24 so as to cover this optical conversion layer 23.

A plurality of IC chips 31 for driving the sensor section 21 are mounted on the insulating substrate 11, and external connection wiring 41 consisting of clock wiring, sensor output wiring, etc. is formed. The external connection wiring 41 connects the IC chip 31
are connected to input terminals or output terminals corresponding to the respective external connection wiring lines 41 via bonding wires 51, respectively. Further, the sensor section 21
The ends of the plurality of lower electrodes 22 are also connected to the bonding wires 51.
are respectively connected to the IC chip 31 via.

When manufacturing the above-mentioned contact type image sensor, the maximum length of the insulating substrate 11 on which the IC chip 31 can be mounted is approximately 300 mm due to equipment constraints. had its limits.

Therefore, in order to manufacture a contact image sensor that reads particularly large manuscripts such as drawings (e.g. Japanese Industrial Standards Column A, No. 0), multiple contact image sensors must be connected to a long sheet several times the length of the insulating substrate. It was necessary to provide a connected sensor consisting of interconnected sensors arranged on a substrate.

(Problem to be Solved by the Invention) When manufacturing a connected sensor, a protective resin is applied to the top surface of the sensor part formed on the plurality of contact image sensors in order to protect it from external factors such as moisture. ing.

However, since the portion to which the protective resin is applied is long, the upper surface of the protective resin becomes undulating, resulting in a problem in that a highly accurate connected sensor cannot be obtained. In addition, the protective resin bulges due to surface tension at the connecting parts of each close-contact image sensor, resulting in a film thickness difference in the sensor part, which changes the optical path difference and blurs the image obtained by the sensor part. There was a problem.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a long connected image sensor with high precision in the connecting portion of the sensor portion by making the film thickness of the sensor portion uniform.

(Means for Solving the Problems) In order to solve the problems of the conventional example, the long connected image sensor according to the present invention includes a support plate that supports the connected sensor,
A long base glass provided on this support plate, a plurality of sensor substrates connected to each other on this long base glass, and each sensor part formed on the top surface of the plurality of sensor substrates are covered with a protective resin. Consists of a single piece of protective glass that is covered through.

(Function) According to the present invention, since the protective glass is disposed on the upper surface of the sensor section, it is possible to ensure uniform thickness of the protective resin on the sensor section.

(Example) An example of the present invention will be described with reference to the drawings.

This long connected image sensor is shown in Fig. 1 as a plan view and in Fig. 2 as a plan view.
As shown in the cross-sectional view taken along the line 1-1' in FIG. 1, the sensor is constructed on a support plate 101 having a length of about 1 m to support the connected sensor.

On this support plate 101, a long base glass 102 having almost the same length as the support plate 101 and made of 7059 glass manufactured by Corning Corporation is arranged. A plurality of sensor substrates 103 are provided.

The sensor substrate 103 includes a sensor section 10 in which a photoelectric conversion section is formed on an insulating substrate 104 made of 7059 glass manufactured by Corning Inc.
5, a glass epoxy substrate 107 on which a plurality of IC chips 106 for driving the sensor section 105 are arranged, and a base glass 108 for disposing the glass epoxy substrate 107 on the side of the sensor section 105.

The base glass 108 is made of 7059 glass manufactured by Corning, which is the same material as the long base glass 102. An insulating substrate 104 on which the sensor section 105 is formed is bonded to the center of the base glass 108, and the glass is attached so as to sandwich the sensor section 105. An epoxy board 107 is arranged. External connection wiring for supplying various signals to the IC chip 106 is formed on the glass epoxy substrate 107 . Further, on one side of the glass epoxy substrate 107, openings 109 and flexible necks 110 are formed alternately in the longitudinal direction, and slits 111 are formed to allow the openings 109 and the sides of the glass epoxy substrate 107 to communicate. This slit 11
A rectangular IC chip mounting portion 112 is formed between them. Then, a plurality of IC chips 106 are mounted on this IC chip mounting section 112. By bonding only the lower surface of the IC chip mounting section 112 to the base glass 108, the glass epoxy substrate 107 is positioned on both sides of the sensor section 105.An opening 109, a neck section 110, etc. are formed in the glass epoxy substrate 107 as described above. The reason why the glass epoxy resin was provided only on the lower surface of the IC chip mounting part 112 was because the thermal expansion coefficients of the glass insulating substrate 104 on which the sensor part 105 was formed and the glass epoxy substrate 107 were different. This is to absorb the stress that occurs between the two.

A pad portion on the sensor side of the IC chip 106 is connected to the sensor portion 105 via a bonding wire 113a, and a pad portion on the outside of the IC chip 106 is connected to the glass epoxy substrate 10 via a bonding wire 113b.
The sensor 1105 is driven by being connected to the external connection wiring formed in 7.

A piece of protective glass 114 made of Corning 7059 glass and long in the longitudinal direction of the support plate 101 is attached to the sensor substrates 103 arranged in parallel on the support plate 101 so as to cover all the sensor parts 105. It is arranged with a protective resin 200 interposed therebetween. The protective glass 114 is provided to prevent the sensor section 105 from deteriorating due to external factors such as moisture. Further, the presence of the protective glass 114 prevents the protective resin 200 from becoming convex at the joint portion of the sensor substrate 103, thereby making the film thickness of the protective resin 200 uniform. As a result, even though a plurality of sensor substrates 103 are connected to form a long sensor section 105, it is possible to obtain a sensor section in which the resolution does not deteriorate even at the connection section.

Further, an IC protection resin 115 for protecting the IC chip 106 is mounted on the IC chip 106, and a sensor protection resin 116 is mounted on the sensor section 105.

Glass epoxy substrate 1 arranged on both sides of sensor section 105
07, square-shaped Sl rubber 11 are spaced apart from each other.
7, and press the Sl rubber 117 in the direction of the support plate 101 using a stainless steel press plate 119 whose one end is fixed to the support plate 101 with a stopper 118 to press the long base glass 102 to the support plate 101. I'm letting you do it.

Next, the manufacturing process of the long connected image sensor according to the present invention will be explained with reference to FIGS.

After a thin chromium film is deposited by vapor deposition on an insulating substrate 104 made of Corning 7059 glass shown in FIG. 3(a), a plurality of lower electrodes arranged in two rows are formed by a photolithography process. A Cr pattern 22 is formed (FIG. 3(b)).

Both ends of the surface on which the Cr pattern is formed on the insulating substrate 104 cannot be microfabricated when manufacturing the sensor. A scribe groove 120 is provided in a cemented carbide roll used in the manufacturing process (FIG. 3(c)).

Next, a photoelectric conversion layer is formed by depositing an amorphous silicon film so as to cover the lower electrode 22, and a transparent upper electrode is formed using indium oxide to cover the photoelectric conversion layer and correspond to the lower electrode 22. - Formed by tin film deposition and photolithography process. Then, the insulating substrate 104 is divided to obtain a sensor section 105 having a size to be adhered to the base glass 108 (FIG. 3(d)').

The rectangular sensor portion 105 obtained as described above is adhered onto a rectangular base glass 108 made of Corning 7059 glass by UV curing. When bonding, the scribe groove 12 provided in the insulating substrate 104
The portion marked 0 is located outside both ends of the base glass 108 (FIG. 3(e)).

On the base glass 108 on both sides of the sensor section 105, attach the glass epoxy substrate 107 with thermosetting double-sided tape.
Glue. Base glass 108 and glass epoxy substrate 1
As described above, the bonding surface of 07 is only the lower surface of the IC chip mounting portion 112 of the glass epoxy substrate 107, so that the stress generated in the glass epoxy substrate 107 can be absorbed by the opening 109 (Fig. )).

Next, the IC chip mounting portion 1 of the glass epoxy substrate 107 is
A plurality of IC chips 106 are mounted on 12 and arranged in parallel. Then, bonding wires are used to connect between the lower electrode 22 drawn out near the end of the insulating substrate i04 and the pads of the IC chip 106, and between the external connection wiring of the glass epoxy substrate 107 and the pads of the IC chip 106. 106 and bonding wire with IC protection resin 1
15 (Fig. 3(g)).

The scribe grooves 120 are formed on both ends of the insulating substrate 104 so that there are no "burrs" protruding from the upper surface of the sensor section 105.
Cut along. Through the above process, the sensor substrate 103 that forms one piece of the long connected image sensor is obtained (
Figure 3 (h)).

The four sensor substrates 103 obtained in this way are placed on a long base glass 102 made of Corning 7059 glass so that the upper surface of the sensor part 105 is continuous.
Adhesion is performed by a curing method (Fig. 3(i)).

A silicone resin is poured onto the upper surface of the long and continuous sensor section 105, and a protective glass 114 made of Corning 7059 glass is placed on top of the silicone resin, and the sensor section 105 and the protective glass 114 are bonded together.

Then, the long base glass 102 to which the sensor substrate 103 is adhered is placed on the support plate 101 made of aluminum to obtain a connected sensor (FIG. 3(j)). The elongated base glass 102 and the support plate 101 are not bonded together, but the St rubber 117 provided on the glass epoxy substrate 107 of the sensor substrate 103 is replaced by a presser plate 1 made of stainless steel.
By pressing with 19, the elongated base glass 102 is pressed against the support plate 101.

Therefore, even when the elongated base glass 102 expands and contracts with respect to the support plate 101 formed of aluminum due to a temperature change, the elongated base glass 102 slides on the support plate 101, so that no stress or warpage occurs.

Furthermore, in this embodiment, the long base glass 102, the sensor substrate 102, the base glass 108, and the protective glass 114 are all made of the same material, Corning 7059 glass, so that the long base glass 1
02 and the like expand in the same way, stress will not be concentrated on the connection portion of the sensor substrate 103, and the end pixels of the sensor portion 105 will not be damaged.

(Effects of the Invention) As described above, the present invention is a connected sensor in which a plurality of sensor substrates are connected and placed on a support plate, and a protective glass is placed on the upper surface of the sensor portion formed on the sensor substrate, so that the protective resin film is not removed. The thickness can be made uniform.

Therefore, it is possible to maintain the same characteristics as the sensor part in the vicinity of the connection part, and it is possible to obtain a highly accurate and precise long connected image sensor.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a long connected image sensor according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line 1-1' in FIG. 1, and FIG.
a) to (J) are explanatory diagrams of the manufacturing process of the long connection image sensor of the embodiment, FIG. 4 is a plan view showing a conventional contact type image sensor, and FIG. 5 is a line IV-IV' in FIG. 4. FIG. 101... Support plate 102... Long base glass 103... Sensor substrate 107... Glass epoxy substrate 108...
...Base glass 114...Protective glass 117...Si rubber 119...Press plate 200...Protective resin Fig. 3

Claims (1)

[Claims] a support plate; a long base glass provided on the support plate;
A plurality of sensor substrates connected to each other and disposed on the elongated base glass, and a single protective glass that covers each sensor portion formed on the upper surface of the plurality of sensor substrates via a protective resin. A long connected image sensor.