JPH04107961U - Contact linear image sensor device - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field] The present invention relates to a two-dimensional image input device.

[Summary of the idea]

The present invention uses a positive substrate for an image sensor, which is an image input device, so that a reading element, a circuit element, and an insert type connector can be attached to the image sensor.

[Conventional technology]

2. Description of the Related Art Conventionally, image sensor devices have been known that use ceramic substrates that are less likely to warp or deform in order to ensure the accuracy of the bonding position of a reading element.

[The problem that the idea attempts to solve]

In image sensor devices that use conventional ceramic substrates, the conductor of the substrate is made by firing a paste mainly composed of silver-palladium or silver-platinum, so the solderability of circuit elements is poor and the ceramic Due to its brittleness, it had the disadvantage that insert-type connectors could not be joined. Furthermore, due to the above-mentioned drawbacks, it was necessary to separately manufacture a board for joining connectors and circuit elements.

Therefore, the purpose of this invention is to solve these conventional drawbacks and to obtain a close-contact linear image sensor in which a reading element, a circuit element, and an insert type connector are bonded onto a single substrate.

[Means to solve the problem]

In order to solve the above problems, this idea uses a composite board of ceramic and epoxy resin as the board material, ensuring the positional accuracy of the reading element and improving the solderability of circuit elements, making it possible to attach an insert type connector. This made it possible to integrate the board.

[Effect]

According to the structure of the contact image sensor described above, the composite substrate has a coefficient of thermal expansion close to that of a silicon chip, so even if a silicon reading element is mounted, the substrate is less likely to warp or deform, and the reading element is less likely to warp or deform. Positional accuracy can be ensured. Also, since the conductors of the composite board are made of copper foil, it is easy to solder circuit elements, and the composite layer of ceramic and resin is covered with a glass cloth reinforcing layer on the surface, so insert type connectors can be joined. Embodiment] An embodiment of this invention will be described below based on the drawings. In FIG. 1, a conductor pattern 5 (only a portion is shown) is formed on a composite substrate 1, and a reading element 2 and a circuit element 3 are bonded. An insert type connector 4 is inserted into the composite board 1 and soldered. As shown in FIG. 2, a composite substrate 1 on which a reading element 2, a circuit element 3, and a connector 4 are bonded is fixed to a chassis 9 of an image sensor. The chassis 9 includes a rod lens array 7.
The light source 6 and the protective glass 8 are also fixed, forming a contact type image sensor device. Original 10 with light source 6
The anti-shielded light passes through the rod lens array 7 and is received by the reading element 2. Since the composite board 1 is a composite board of epoxy resin and ceramic (trade name: Ceracom), it can be drilled and has high toughness, making it possible to insert and solder an insert-type connector.

As shown in FIG. 3, the composite substrate has a central resin composite layer 11, the outer side of which is covered with a glass cloth reinforcing layer 12. Furthermore, the structure is such that a conductor layer 13 of copper foil is coated on the outside. The coefficient of thermal expansion of this composite substrate is close to that of single crystal silicon, which is the material of the reading element, so even if the reading element is bonded to the composite substrate using adhesive, warping of the substrate due to the difference in coefficient of thermal expansion will hardly occur. It will disappear. Furthermore, since the composite substrate is integrated, it is advantageous for downsizing the contact linear image sensor device.

〔Effect of the invention〕

As explained above, this idea uses a composite material of ceramic and epoxy resin for the board material, which allows the reading element, circuit element, and insert type connector to be mounted together, and prevents the board from warping. This has the effect of providing a highly accurate and compact contact linear image sensor device.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a substrate of a contact linear image sensor device according to the present invention, FIG. 2 is a sectional view of an embodiment of the present invention, and FIG. 3 is a sectional view showing the structure of a composite substrate. 1...Composite board, 2...Reading element, 4
...Connector, 13...Conductor layer.

Claims (2)

[Scope of utility model registration request] 1. A close-contact linear image sensor in which a plurality of reading elements are arranged in a straight line or in a staggered manner at required intervals, and the reflected light of light irradiated onto a document is read through a rod lens, the reading element, the circuit element, A close-contact linear image sensor device characterized by an integrated board to which a connector is joined. 2. The contact linear image sensor device according to claim 1, wherein the substrate is made of a composite substrate of epoxy resin and ceramic.