JPH01208837A - Arm device and bonding device using the same - Google Patents

Abstract

PURPOSE:To prevent the rocking and vibrations of an arm with the transfer of an arm device, and to obviate the damage of an article to be bonded by installing a locking device fixing the arm during movement to the arm having a balance holding means. CONSTITUTION:The double-end weight of an arm 26 holds a balanced state by a balancer 28, and the arm 26 is brought to an unstable state in which it is easy to be rocked by inertia force and vibrations with movement. An electromagnet device 41 is conducted and excited at that time, a magnetic substance 42 projected at the rear end section of the arm 26 through a leaf spring 43 is attracted and held to the electromagnet device 41, and the arm 26 is fixed to a frame 39 to which the electromagnet device 41 is attached rigidly. Accordingly, when the arm 26 is fastened to the frame 39 through the electromagnet device 41 and the magnetic substance 42, the rocking and vibrations of the arm 26 are prevented during movement, and an article to be bonded is positioned under a safe status in which damage is difficult to be generated.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a bonding technique using an arm device, and in particular to an improved technique for the arm device. Concerning effective techniques that can be used to

[Conventional technology]

In the semiconductor manufacturing process, when bonding a semiconductor element (hereinafter referred to as a pellet) to a subchip, a worker first bonds the subchip by operating a vacuum suction corent while observing the work situation with an optical microscope or monitor TV. After being transferred to the stage, the pellet is bonded to a subchip on the bonding stage.

An example that describes pellet bonding technology is "Introduction to Automatic Assembly of Electronic Components" published by Nikkan Kogyo Shimbun, July 30, 1980, pages 69 to 76.

[Problem to be solved by the invention]

However, such pellet bonding technology has the problem of low productivity because all operations such as adsorption, holding, transport, alignment, and bonding of pellets and subchips are performed manually. This was revealed by the present inventor.

An object of the present invention is to provide a bonding device that can realize automation and an arm device suitable for use therein.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

An overview of typical inventions disclosed in this application is as follows.

That is, a first supply stage that supplies a first object to be bonded, a second supply stage that supplies a second object to be bonded, and a bonding stage that is disposed at an intermediate position between the first supply stage and the second supply stage. It is equipped with a stage and an XY child table installed on either side of the stage group, and on the XY child table is an arm rotatably supported and a balance of movement at the free end of the arm is maintained. The arm device is provided with a balance holding means, the arm is configured to move entirely, and the arm device is provided with a locking device for fixing the arm while the arm is moving. a first holding device configured to hold the first object to be bonded on the first supply stage and transfer it to the bonding stage; and a first visual device for viewing the first supply stage and the bonding stage. and a second arm device configured to hold the second object to be bonded on the second supply stage and bond it onto the first object to be bonded transferred to the bonding stage.
a holding device and a second viewing device for viewing the second supply stage and the bonding stage;
A third visual device is provided between the supply stage and the bonding stage and is configured to recognize the second object to be bonded held by the second holding device.

[Effect]

According to the above-described means, when the first object to be bonded is picked up by the first holding device and when it is transferred to the bonding stage, the first object to be bonded and the bonding stage are detected by the first visual device. Since each can be recognized, the relevant work can be carried out automatically and accurately.

Further, when the second holding device picks up the second bonding object and when bonding it to the first bonding object transferred to the bonding stage, the second visual device picks up the second bonding object. and when recognizing the first bonded object,
By controlling the holding device so that the images of the objects to be bonded in both waves are aligned with each other, the objects to be bonded can be automatically aligned with each other, so that the work can be performed automatically and accurately.

Moreover, by providing a third visual device between the second supply stage and the bonding stage, it is possible to perform pre-alignment for the 2'P & bonding, thereby making it possible to more accurately bond the objects to be bonded to each other. be able to.

Furthermore, since the arm devices used in the first holding device and the second holding device are provided with locking devices for fixing the arms during movement, the arms are prevented from moving when the holding devices are operated. This makes it possible to prevent accidents such as damage to the bonded object due to the free movement of the arm.

(Example) Fig. 1 is a perspective view showing an arm device which is an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view thereof, and Fig. 4 is a line IV-IV of Fig. 3. 5 is an enlarged partial sectional view taken along line V-V in FIG. 3, FIG. 6 is a plan view of FIG. 5, and FIG. 7 is a bonding device in which it is used. FIG. 8 is a schematic front view thereof, and FIG. 9 is an assembled perspective view showing the bonding target.

In this embodiment, this bonding apparatus is used to manufacture a semiconductor by using a pellet 2 as a second object to be bonded.
is formed on the sub-chip 1 as the first bonding object by aligning the pattern 2a formed on the upper surface (hereinafter referred to as the upper surface) with the pattern 1a on the sub-chip side, and bonding the sub-chip l. A first supply stage 3 supplies pellets 2, and a second supply stage 4 supplies pellets 2. Although detailed illustrations and explanations are omitted, the first supply stage 3 and the second supply stage 4 accommodate the subchip 1 and the pellet 2 in the accommodation hole 3b.
, 4b are configured to place trays 3a and 4a each containing one tray, and the first supply stage 3 and the second supply stage 4 are located at positions apart from each other (hereinafter referred to as
Left and right.

) are equipped with each. A pounding stage 5 is installed between both stages 3 and 4, and is arranged approximately in the center between them, and the pounding stage 5 is configured to be able to place and hold the sub-chip l in position. ing. Further, the bonding stage 5 is equipped with a heater 6 for heating the sub-chip 1 for performing bonding by thermocompression bonding.

On one side of the first and second supply stages and the pounding stage (hereinafter referred to as the back and armpit), an
It is equipped to be able to move across the supply stage 3 and the second supply stage 4, and on the XY table 7 there is a first holding device 8 and a first visual device 9 at the left end, and
A second holding device IO and a second visual device 11 are arranged and installed at the right end, respectively. As the first holding device 8, an arm device configured as described later is used, and is configured to hold the sub-chip 1 supplied to the first supply stage 3 and transfer it onto the pounding stage 5. It is configured. An arm device described later is also used as the second holding device 10, and is configured to hold the pellet 2 supplied to the second supply stage 4 and bond it to the subchip 1 supplied onto the bonding stage 5. It is configured.

The first visual device 9 includes an industrial television camera 9a, a lens barrel 9b attached to the camera 9a, and an illumination device 9c attached to the tip of the lens barrel 9b.
The feeding stage 3 and the pumping stage 5 are configured to be visualized in a timely manner. Similarly, the second visual device 1
1 is also an industrial TV camera lla and this camera lla
It is equipped with a lens barrel 11b attached to the lens barrel 11b and an illumination device 11c attached to the tip of the lens barrel 11b, and is configured to visualize the second supply stage 4 and the pounding stage 5 in a timely manner. .

Similarly, between the second supply stage 4 and the pounding stage 5, a third visual device 12, which includes an industrial camera 12a, a lens barrel 12b, and an illumination device 12c, is installed facing upward. , this third visual device 12 is configured to view the bellet 2 held by the second holding device 10 from below, and the television of the first, second and third visual devices 9.11.13 - The cameras are connected to a controller (not shown) consisting of an image processing device, a computer, etc., and the controller controls the XY table 7 and the eleventh and second holding devices 8.10 based on the images from each camera.
It is configured to automatically control the following.

In this embodiment, the arm devices used as the first and second holding devices 8.10 are constructed as shown in FIGS. 1-5. That is, this arm device 20 is equipped with a vertical feed screw shaft 21, and this screw shaft 21 is vertically erected and rotatably supported on the XY table 7, and is connected to a motor installed on the XY table 7. 22 and is configured to be driven in forward and reverse rotation via a suitable transmission mechanism 23. Vertical feed screw shaft 21
A vertically movable block 24 is screwed into the unit so that it can move forward and backward freely.
The vertical movement block 24 is configured to move up and down in accordance with the forward and reverse rotation of the vertical feed screw shaft 24. A receiver 25 is fixed to the vertical movement block 24, and the receiver 25 has a first
The arm 26 is rotatably supported by a support shaft 27 in a vertical plane. The first arm 26 is disposed approximately horizontally so as to protrude toward the stage group.
A balancer 2 serving as a balance maintaining means is fitted to the rear end of the arm 6 so as to be able to adjust its position so as to balance the longitudinal load of the first arm 26 in the horizontal direction. The height position of the first arm 26 is configured to be detected by a position sensor 29, which will be described later.

A rotating shaft 30 is disposed vertically at the front end of the first arm 26 and is rotatably supported.
It is configured to be rotationally driven by a pulse motor 31 installed at 5 via a suitable transmission mechanism 32. A collet 33 is mounted on the rotating shaft 30 in a vertically downward direction, and the collet 33 is connected to a negative pressure supply tube (not shown) or the like to be supplied with negative pressure 34.
It is configured to be able to hold an object by vacuum suction.

A second arm 35 is disposed on the receiver 25 directly above the first arm 26 and is rotatably supported by a support shaft 36 in a vertical plane. is installed. A contact member 38 is arranged vertically downward and protrudes from the front end of the second arm 35, so that the second arm 35 can apply a load to the first arm 26 via this contact member 38. It has become.

Further, a frame 39 is fixed to the receiver 25 so as to be arranged directly above the first arm 26 and protrude rearward.
A load switching eccentric cam device 40 is installed on the frame 39. Although detailed illustrations and explanations are omitted, this cam device 40 switches the engagement position of the second arm 35 with respect to the rear end of the first arm 27 of the second arm 35.
6.

Furthermore, a lock device 7S and a magnetic magnet device 41 are installed on the frame 39, and this magnet device 41 includes a magnetic body 42 which is protruded from the rear end of the first arm 26 via a leaf spring 43. By attracting magnetically,
The first arm 26 can be fixed.

Further, a position sensor 29 is installed on the frame 39, and the position sensor 29 is configured to detect contact with the first arm 26.

Next, the effect will be explained.

When the sub-chips I as the first bonding object are placed on the first supply stage 3 in a tray 3a,
By moving the XY table 7 to the left, the collet 33 of the first holding device 8 and the first visual device 9 are moved to the first position.
Transferred onto supply stage 3. The image of the first group of subchips on the first supply stage 3 is recognized by the first visual device 9. At this time, the magnification of the lens barrel 9b of the first visual device 9 is set low, so that the entire observation is possible. It is made easy to do.

When the subchip 1 to be pink-up is selected by the controller, the XY table 7 sent to the controller is
While being operated to move in the Y force direction, the collet 33 in the first holding device 8 is moved by the motor 22 to the vertical feed screw shaft 21.
, vertical movement block 24, receiver 25, and first arm 26
descended through. At this time, the magnification of the lens barrel 9b of the first visual device 9 can be increased in order to facilitate observation of the main parts.

As a result, when the collet 33 is pressed onto a desired sub-chip 1, negative pressure is supplied to the collet 33, so that the 8-sub-chip 1 is held by the collet 33 by suction. Here, when the collet 33 hits the subchip 1, the first arm 26 is rotated around the support shaft 27, so the collision is detected by the position sensor 29, and based on this detection, the operation of the motor 22 is stopped. This stops the descent.

Furthermore, in order to reduce damage by reducing the load applied to the sub-chip l as much as possible during this big amplification, the tip load of the first arm 26 is suppressed to approximately zero by the balancer 28, and the second arm 35 weight 3
6 and the load switching eccentric cam device 40, an additional load controlled to a very small predetermined value (for example, about 2 to 3 g) is applied via the contact portion tt37.

When the sub-chip 1 is sucked and held by the first holding device 8 on the first supply stage 3, the sub-chip 1 is lifted and picked up by the rising of the holding device, and the picked-up sub-chip 1 is moved in the right direction of the XY table 7. Then, by lowering the holding device, it is transferred and positioned onto the bonding stage 5. The position and orientation of the subchip 1 on the bonding stage 5 are imaged by a visual device and recognized and stored in the controller.

Here, since the weights at both ends of the first arm 26 are maintained in a balanced state by the balancer 28, the inertia force and vibration accompanying the movement of the first holding device 8 result in an unstable state in which it is extremely easy to swing. There is. Under an unstable condition, the subchip 1 held by suction on the collet 33 at the tip of the first arm 26 is in a state where the suction and holding is easily released, and the first arm 2
This means that the robot is placed in a dangerous situation where it is extremely susceptible to damage, such as a state in which it is likely to collide with surrounding obstacles due to the swinging of the vehicle.

Therefore, in this embodiment, the first arm 26 is fixed to the frame 36 by energizing the electromagnetic device 41 while the holding device is moving, and the first arm 26 is fixed to the frame 36.
6 is resolved. That is, when the sub-chip 1 is picked up, the electromagnetic magnet device 41 is energized and excited. Due to this excitation, the magnetic body 42 protruding from the first arm 26 is magnetically held by the electromagnetic magnet device 41, so that the first arm 26 is fixed to the frame 39 to which the electromagnetic magnet device 41 is fixed. become.

In this way, when the first arm 26 is fixed to the frame 39 via the tiff magnet device 41 and the magnetic body 42, the first arm 26 does not swing or vibrate while the first holding device 8 is moving. 1st arm 2
The sub-chip 1, which is held by the collet 33 at the tip of the sub-chip 1, is placed in a safe situation where it is unlikely to be damaged.

On the other hand, when the XY table 7 is moved to the right, the collet 33 of the second holding device IO and the second visual device 11 are transferred onto the second supply stage 4.

In the second supply stage 4, the second group of pellets as the second bonding object is image recognized by the second visual device 11, and the pellets 2 to be picked up are selected by the controller.

When a pellet 2 to be picked up is selected, the pellet 2 is picked up by the second holding device 10 and transferred to directly above the third visual device 12 in accordance with the operation of the first holding device described above. Even during movement of the second holding device 10, the electromagnetic magnet device 41 is excited, as described above, so that the pellet 2 is placed in a safe situation.

In the third visual device 12', the pellet 2 sucked and held by the second holding device 10 is imaged from below, so that its external shape is recognized by the controller. In the controller, the external shape of the pellet 2 and the bonding stage 5 stored in advance as described above are stored in the controller.
The image of the subchip 1 shown above is compared, and based on this comparison, the pulse motor 3 in the second holding device 10 is
1 is activated, the pellet 2 is transferred to the transmission mechanism 32.
, the rotational shaft 30 and the collet 33, the angle with respect to the subchip l is adjusted so as to be aligned.

Subsequently, the pellet 2 held by the second holding device 10 is transferred to the bonding stage 5 by the left movement of the XY table 7, and the collet 33 is moved by the motor 22.
The sub-chip 1 on the bonding stage 5 is pressed by being lowered. When the pellet 2 is pressed against the suffix 1, since the subchip 1 is heated by the heater 6 of the bonding stage 5, the adhesive layer (not shown) interposed between the pressing surfaces of the two
Pellet 2 and subchip 1 will be bonded. At this time, the load switching eccentric cam device 40 adjusts the load to a predetermined value (for example, 1
By increasing the bondability to about 0 g), its bondability is enhanced.

Here, if the second arm 26 remains locked to the frame 39 by the electromagnetic magnet device 41, even if the bonding load is adjusted by the load switching eccentric cam device 40, the desired load will not reach the pellet 2 and the subchip. 1 has no effect.

Therefore, in this embodiment, immediately before the pellet 2 is pressed against the subchip 1 (for example, the interval between the two is 1ff11
1), the locked state of the first arm 26 by the electromagnet device 41 is released. That is, when the electromagnetic magnet device 41 is demagnetized by stopping the energization, the magnetic body 42 is no longer held magnetically by the electromagnetic magnet device 41, so that the first arm 26
The locked state with respect to the frame 39 will be released.

Incidentally, when the magnetization of the magnetic body 42 by the electromagnetic magnet device 41 is released, the temporary spring 43, to which the magnetic body 42 is fixed at the tip, is attached to the electromagnetic magnet device 41 due to its repulsive force.
Since the magnetic body 42 is instantaneously separated against the residual magnetic force, the locked state of the first arm 26 to the frame 39 is instantly released.

When the bonding operation is completed, the second visual device 11 is used to perform a visual inspection, and the first visual device 9 is used to select a pick-up point in the bonded assembly. Subsequently, the safchip 1 with the pellet 2 bonded thereto is held by the first holding device 8.
The pig is held by suction at the pink-up point, and transferred to a predetermined storage section (not shown) by moving the XY table 7.

Thereafter, by repeating the above operations, the bonding work between the sub-chips and the pellets is successively performed.

According to the embodiment described above, the following effects can be obtained.

(1) A holding device that holds a first object to be bonded, a first visual device that views the first supply stage and a bonding stage, and a second visual device that holds a second object to be bonded.
By providing a holding device and a second visual device for viewing the second supply stage and the bonding stage, the objects to be bonded on each supply stage can be recognized by each visual device and automatically held by both holding devices. At the same time, by controlling the holding device so that the images of the two-wave bonded object by both visual devices are aligned with each other, the objects to be bonded can be automatically aligned with each other, making it possible to fully automate the bonding device. Can be done.

(2) Automation can save labor, shorten work time, equalize quality, and improve reliability.

(3) By providing a visual device that recognizes the second object to be bonded between the second supply stage and the bonding stage, pre-alignment for the second object to be bonded can be performed. and the first object to be bonded can be accurately aligned and bonded.

(4) By configuring the holding device so that the pressing force when picking up the bonded object is small, the load on the bonded object can be reduced, thereby preventing damage to the bonded object. Can be done.

(5) The bonding force can be increased by configuring the holding device so that the pressing force when bonding the object to be bonded is large, so the quality and reliability of bonding can be improved. can.

(6) By providing the arm of an arm device equipped with a balance maintaining means with a locking device that fixes the arm during movement, it is possible to prevent swinging, vibration, etc. of the arm due to movement of the arm device. , the arm device can be moved while ensuring a stable state of the arm.

(7) By constructing the locking device using an electromagnetic device, the structure of the locking device and its operation control can be simplified.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the locking device for fixing the arm during movement is not limited to using an electromagnetic magnet device, but may also be configured using a vacuum suction holding device or the like.

As the first holding device and the second holding device, not only the arm device according to the configuration of the above embodiment may be used, but also an arm device having another configuration may be used.

Further, each visual device is not limited to the visual device having the configuration of the above embodiment, but may be a visual device having another configuration.

In the above description, the invention made by the present inventor was mainly applied to a bonding device for bonding a pellet to a sub-chip in the field of semiconductor manufacturing, which is the background of the invention, but the invention is not limited to this. In the manufacture of electronic devices such as transistors, the present invention can be applied to all bonding devices such as pellet bonding, wire bonding, etc. in which pellets are bonded onto a substrate. Further, the arm device is not limited to a bonding device, but can be applied to any arm device that allows an arm to perform a desired work under a balanced state, such as a handler arm device in a sorting device.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

The arm device includes an arm balance holding means and an arm locking device, and includes a holding device for holding a first object to be bonded, a first visual device for viewing the first supply stage and the bonding stage, an arm balance holding means, and an arm locking device. a second holding device comprising an arm device having an arm locking device and holding a second object to be bonded;
By providing a second visual device for viewing the second supply stage and the bonding stage, the objects to be bonded on each supply stage can be recognized by each visual device and automatically held by both holding devices, respectively. By controlling the holding device so that the images of the objects to be bonded using both liquids obtained by both visual devices are aligned with each other, the objects to be bonded can be automatically aligned with each other. Therefore, the bonding device can be fully automated, and ,
Since the arm can be prevented from floating while the holding device is moving, it is possible to prevent damage to the object to be bonded.

[Brief Description of the Drawings] Fig. 1 is a perspective view showing an arm device which is an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a front view thereof, and Fig. 4 is a third drawing. Figure 5 is an enlarged partial cross-sectional view taken along line IV-IV, Figure 6 is a plan view of Figure 5, and Figure 7 shows how it is used. FIG. 8 is a schematic front view of the bonding apparatus, and FIG. 9 is an assembled perspective view showing the bonding device. ■...Subchip (first bonded object), 2...
- Pellet (second bonding material), 3... First supply stage, 4... Second supply stage, 5... Bonding stage, 6... Heater, 7... XY child table 8...・First holding device, 9...First visual device, 1
0... Second holding device, 11... Second visual device, 12
...Third viewing device, 20...Arm device, 21...
・Vertical feed screw shaft, 22...Motor, 23.32...
Transmission mechanism, 24... Vertical movement block, 25... Receiver, 26... First arm, 27... Support shaft, 28...
Balancer, 29... Position sensor, 30... Rotating shaft,
31...Pulse motor, 33...Collet, 34...
...Negative pressure, 35...Second arm, 36...Spindle, 3
7... Weight, 38... Contact member, 39... Frame, 40... Load switching eccentric cam device, 41... Electromagnetic magnet, 42... Magnetic body, 43... Temporary Spring.

Claims (1)

[Claims] 1. An arm that is rotatably supported and a balance maintaining means that maintains the balance of the load at the free end of the arm, such that the arm moves as a whole. 1. An arm device comprising a locking device for fixing the arm during movement of the arm. 2. The arm device according to claim 1, wherein the locking device is constituted by a magnet device that fixes the arm by magnetic force. 3. A bonding apparatus using the arm device according to claim 1, comprising a first supply stage that supplies a first object to be bonded, and a second supply stage that supplies a second object to be bonded. , a bonding stage disposed at an intermediate position between the first supply stage and the second supply stage, and an XY table disposed on the side of the stage group. A first holding device including an arm device and configured to hold the first object to be bonded on the first supply stage and transfer it to the bonding stage; 1 visual device and the arm device, and is configured to hold the second object to be bonded on the second supply stage and bond it onto the first object to be bonded transferred to the bonding stage. 2 holding device and a second viewing stage for viewing the second supply stage and the bonding stage.
A visual device is further provided between the second supply stage and the bonding stage, and a third visual device configured to recognize the second object to be bonded held by the second holding device. A bonding device characterized by being equipped with.