JPH01208804A - Thin-film platinum temperature sensor - Google Patents
Thin-film platinum temperature sensorInfo
- Publication number
- JPH01208804A JPH01208804A JP3424488A JP3424488A JPH01208804A JP H01208804 A JPH01208804 A JP H01208804A JP 3424488 A JP3424488 A JP 3424488A JP 3424488 A JP3424488 A JP 3424488A JP H01208804 A JPH01208804 A JP H01208804A
- Authority
- JP
- Japan
- Prior art keywords
- film
- platinum
- thin
- substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 28
- 239000010409 thin film Substances 0.000 title claims abstract description 24
- 239000010408 film Substances 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 14
- 230000004044 response Effects 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、自動車用、家庭電化製品用、及び工業計器等
に使用される薄膜白金温度センナに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thin film platinum temperature sensor used in automobiles, home appliances, industrial instruments, and the like.
従来の技術
従来の温度センサは、高精度ではあるものの、高価で取
扱いが煩わしいものと、簡便で大量に使用できるものの
、精度が悪いものとに大別でき、用途に応じて、使いわ
けられている。Conventional technology Conventional temperature sensors can be roughly divided into those that have high accuracy but are expensive and cumbersome to handle, and those that are simple and can be used in large quantities but have low accuracy. There is.
しかしながら、最近のエレクトロニクスの急激な進歩に
より、自動車用などの精密温度センサを中心に、堅牢で
大量に使用ができ、かつ高精度な温度センサが要求され
るようになってきた。特に、自動車用については、安価
でかつ小型で精度が高く、温度範囲が広く直線的な抵抗
値変化をし、また振動に対して強く、熱応答性の良いも
のが要求されている。従来より、精密温度センサとして
は、白金側温抵抗体が用いられているが、白金線を使用
するため抵抗値は50Ω、100Ωと低く、そのため周
辺回路が複雑になり、また周辺回路の雑音等の影響を受
けやすいという問題があり、併せて形状も大きく、更に
振動及び衝撃に弱い。さらに、白金線を細くすることに
は限界があるから高価な白金線を相当大量に使用するこ
とになるとともに、白金線を1本ずつセラミックボビン
等に巻きつけて作製していくため大量生産は不可能であ
って相当高価なものとなっていた。However, with recent rapid advances in electronics, there has been a demand for temperature sensors that are robust, can be used in large quantities, and have high accuracy, especially precision temperature sensors for automobiles. In particular, for automobiles, there is a need for something that is inexpensive, compact, highly accurate, has a wide temperature range, exhibits a linear resistance change, is strong against vibrations, and has good thermal responsiveness. Conventionally, a platinum side temperature resistor has been used as a precision temperature sensor, but since the platinum wire is used, the resistance value is low at 50Ω or 100Ω, which makes the peripheral circuit complicated and noise from the peripheral circuit. There is a problem that it is susceptible to the effects of vibration, and it is also large in size and is also susceptible to vibration and shock. Furthermore, since there is a limit to how thin platinum wire can be made, a considerable amount of expensive platinum wire is used, and mass production is difficult because the platinum wire is wound one by one around a ceramic bobbin. This would have been impossible and quite expensive.
このような問題点を解決するために、白金線の代わ9に
白金の厚膜や薄膜を用いた温度センサが開発されている
。しかし、厚膜白金温度センサは、スクリーン印刷技術
によるだめ100μm以下の微細パターンが困難、製造
上のバラツキが大きい等の欠点を有している。In order to solve these problems, temperature sensors have been developed that use thick or thin platinum films instead of platinum wires. However, thick film platinum temperature sensors have drawbacks such as difficulty in forming fine patterns of 100 μm or less using screen printing technology and large manufacturing variations.
一方、薄膜白金温度センサは、パターンの微細化が容易
なため、小型化ができ、また高抵抗化による高感度化を
図れ、更に、機械的強度が強く、ウェハー処理によって
バラツキが小さくでき、量産に適し、低価格化が可能で
ある等の長所を有する。On the other hand, thin-film platinum temperature sensors can be miniaturized because the pattern can be easily made finer, and they can also be made more sensitive due to higher resistance.Furthermore, they have strong mechanical strength, and can be mass-produced by reducing variations through wafer processing. It has advantages such as being suitable for
発明が解決しようとする課題
薄膜白金温度センサの製造方法としては、まず、真空蒸
着法、スパッタリング法等により、絶縁基板上に数千入
膜厚の白金薄膜を付着させ、湿式エツチング法、スパッ
タエツチング法等の方法で微細パターン化し、大気中で
900〜1000℃の高温で熱処理を行う。その後、ト
リミングによる抵抗値調整、リード線取り出し、保護膜
コーティングを行う。この際、絶縁基板としては、アル
ミナ基板等が用いられる。しかし、アルミナ基板上に白
金薄膜の微細パターンを形成するためには、基板表面を
平滑化する必要がある。このためには、高純度の薄膜用
アルミナ基板、もしくは表面研磨処理をしたアルミナ基
板を用いる必要があるため、基板が高価になるという欠
点がある。一方、アルミナ基板上にガラスグレーズをコ
ーティングする方法もあるが、ガラスグレーズの耐熱性
はせいぜい900’Cと低く白金膜中への不純物混入が
心配される。またガラスグレーズ層が10〜30μmと
厚くなり、基板の熱伝導が悪くなるため、センサの熱応
答性が悪くなるという欠点もある。Problems to be Solved by the Invention As a manufacturing method for a thin film platinum temperature sensor, first, a thin platinum film with a thickness of several thousand layers is deposited on an insulating substrate by vacuum evaporation, sputtering, etc., and then wet etching or sputter etching. A fine pattern is formed by a method such as a method such as a method, and heat treatment is performed at a high temperature of 900 to 1000° C. in the atmosphere. After that, the resistance value is adjusted by trimming, the lead wire is taken out, and a protective film is coated. At this time, an alumina substrate or the like is used as the insulating substrate. However, in order to form a fine pattern of platinum thin film on an alumina substrate, it is necessary to smooth the substrate surface. For this purpose, it is necessary to use a high-purity alumina substrate for thin films or an alumina substrate whose surface has been polished, which has the disadvantage that the substrate becomes expensive. On the other hand, there is a method of coating an alumina substrate with a glass glaze, but the heat resistance of the glass glaze is at most 900'C, which is low and there is concern that impurities may be mixed into the platinum film. Moreover, the glass glaze layer is thick, 10 to 30 μm, and the heat conduction of the substrate is poor, so there is also a drawback that the thermal response of the sensor is poor.
以上のように、従来の基板材料では多くの問題があった
。As mentioned above, conventional substrate materials have many problems.
本発明は、これらの問題点を解決するもので、熱応答速
度が速く、耐熱性が良く、信頼性に優れた薄膜白金温度
センサを安価で提供することを目的とするものである。The present invention solves these problems, and aims to provide a thin film platinum temperature sensor that has a fast thermal response speed, good heat resistance, and excellent reliability at a low cost.
課題を解決するための手段
これらの問題を解決するため本発明は、基板上に金属ア
ルコキシドを主成分とする電気絶縁性の焼成膜を形成し
、その上に白金抵抗薄膜と電極を形成したことを特徴と
するものである。Means for Solving the Problems In order to solve these problems, the present invention forms an electrically insulating fired film containing a metal alkoxide as a main component on a substrate, and forms a platinum resistive thin film and an electrode thereon. It is characterized by:
作用
本発明は上記した金属アルコキシド焼成膜を形成するこ
とにより、平滑な基板表面が得られ白金薄膜の微細パタ
ーンが形成でき、熱伝導が良く、耐熱性が高く、化学的
に安定であり、白金薄膜への不純物混入が少なくなり、
基板価格、熱応答性、耐熱性、信頼性等の問題が解決さ
れる。Function: By forming the above-mentioned metal alkoxide fired film, a smooth substrate surface can be obtained, a fine pattern of platinum thin film can be formed, and the platinum film has good thermal conductivity, high heat resistance, and chemical stability. The amount of impurities mixed into the thin film is reduced,
Problems such as board price, thermal response, heat resistance, and reliability are resolved.
実施例
以下、本発明の一実施例を添付の図面にもとづいて説明
する。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
図において、1は幅3M、長さ10M、厚さ0.65
MMのアルミナ基板であり、2はこのアルミナ基板1上
に金属アルコキシドを主成分とする溶液を塗布し160
’C温度で焼成することにより形成された約1μm厚の
5in2及びム1203の混合膜からなる電気絶縁性の
焼成膜である。さらに、3はスパッタリング法によりp
t を約0.5μm着膜し、スパッタエツチング法に
よりパターン形成された白金抵抗薄膜、4はこの白金抵
抗薄膜3と接続されるリード線引き出し用の電極、6は
白金抵抗薄膜を被覆する5in2からなる保護膜である
。In the figure, 1 has a width of 3M, a length of 10M, and a thickness of 0.65
MM is an alumina substrate, and 2 is alumina substrate 1 coated with a solution containing metal alkoxide as a main component.
This is an electrically insulating fired film made of a mixed film of 5in2 and Mu 1203 with a thickness of about 1 μm formed by firing at a temperature of 120°C. Furthermore, 3 was made with p by sputtering method.
A platinum resistive thin film is deposited with a thickness of about 0.5 μm and patterned by sputter etching, 4 is an electrode for leading out a lead wire connected to this platinum resistive thin film 3, and 6 is a 5in2 electrode that covers the platinum resistive thin film. It is a protective film.
また6は電極4に接続されるリード線である。Further, 6 is a lead wire connected to the electrode 4.
本実施例で用いたアルミナ基板は、96俤の純度で一般
的に用いられている低価格の材質のもので、表面粗さは
2〜3μmの凹凸がある。しかし、金属アルコキシドを
塗布、焼成したあとの基板の表面粗さは0.2μm以下
であり、高価格である純度が99.51%の薄膜用アル
ミナ基板と同レベルの平滑な表面が得られた。The alumina substrate used in this example is made of a commonly used, low-cost material with a purity of 96 yen, and has an uneven surface roughness of 2 to 3 μm. However, after coating and firing the metal alkoxide, the surface roughness of the substrate was less than 0.2 μm, which was the same level of smooth surface as an expensive alumina substrate for thin films with a purity of 99.51%. .
さらに、金属アルコキシド焼成膜は、無機質で均一な膜
厚の薄膜が形成できるため、耐熱性に優れ白金膜への不
純物の混入が少なく、更に熱伝導性が良好である。本実
施例における温度センサの熱時定数として、温度センサ
を20℃から100℃の雰囲気に移したときの20℃と
100’Cの温度差との63.2 %に相当する抵抗値
に達するまでの時間を測定したところ、約0.8116
0とガラスグレーズをコーティングしたアルミナ基板を
用いたものに比べ約1/2となり、熱応答性が大幅に改
善された。Furthermore, since the fired metal alkoxide film is inorganic and can form a thin film with a uniform thickness, it has excellent heat resistance, reduces the amount of impurities mixed into the platinum film, and has good thermal conductivity. The thermal time constant of the temperature sensor in this example is until it reaches a resistance value equivalent to 63.2% of the temperature difference between 20°C and 100'C when the temperature sensor is moved from 20°C to 100°C. When I measured the time, it was about 0.8116
The thermal response was approximately 1/2 that of the one using an alumina substrate coated with 0 and glass glaze, and the thermal response was significantly improved.
なお、本実施例の金属アルコキシド焼成膜としては、5
102とム1205の混合膜を用いたが、人1203単
独でもまた他の金属アルコキシド焼成膜でも使用可能で
ある。The fired metal alkoxide film of this example was 5.
Although a mixed film of 102 and 1205 was used, it is also possible to use 1203 alone or other fired films of metal alkoxides.
また、基板としてはアルミナ以外でも良く、金属等電気
絶縁性のないものでも使用可能である。Further, the substrate may be made of materials other than alumina, and materials without electrical insulation such as metal can also be used.
発明の効果
以上のように本発明によれば、基板上に電気絶縁膜とし
て金属アルコキシド焼成膜を用いたので薄膜白金温度セ
ンサとしては、
(1)熱応答性が良い
(2)耐熱性に優れる
(3)信頼性に優れる
(4)低価格である
等の効果が得られる。Effects of the Invention As described above, according to the present invention, since a fired metal alkoxide film is used as an electrical insulating film on a substrate, a thin film platinum temperature sensor has the following properties: (1) Good thermal response (2) Excellent heat resistance (3) Excellent reliability (4) Low cost and other effects can be obtained.
図は本発明の一実施例による薄膜白金温度センサの断面
図である。
1・・・・・・アルミナ基板、2・・・・・・焼成膜、
3・・・・・・白金薄膜、4・・・・・・電極、6・旧
・・保護膜、6・旧・・リード線。The figure is a sectional view of a thin film platinum temperature sensor according to an embodiment of the present invention. 1... Alumina substrate, 2... Fired film,
3...Platinum thin film, 4...Electrode, 6.Old...Protective film, 6.Old...Lead wire.
Claims (1)
焼成することにより電気絶縁性の焼成膜を形成し、この
焼成膜上に白金抵抗薄膜と電極とを形成したことを特徴
とする薄膜白金温度センサ。A thin film platinum temperature film characterized in that an electrically insulating fired film is formed by applying a solution containing a metal alkoxide as a main component onto a substrate and firing it, and a platinum resistive thin film and an electrode are formed on this fired film. sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3424488A JPH01208804A (en) | 1988-02-17 | 1988-02-17 | Thin-film platinum temperature sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3424488A JPH01208804A (en) | 1988-02-17 | 1988-02-17 | Thin-film platinum temperature sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01208804A true JPH01208804A (en) | 1989-08-22 |
Family
ID=12408749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3424488A Pending JPH01208804A (en) | 1988-02-17 | 1988-02-17 | Thin-film platinum temperature sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01208804A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109462094A (en) * | 2018-10-30 | 2019-03-12 | 阮鑫 | A kind of television set anti-leakage plug |
-
1988
- 1988-02-17 JP JP3424488A patent/JPH01208804A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109462094A (en) * | 2018-10-30 | 2019-03-12 | 阮鑫 | A kind of television set anti-leakage plug |
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