JPH01203980A - Circuit testing instrument - Google Patents

Abstract

PURPOSE:To remarkably simplify the structure of a measuring terminal and to realize its miniaturization by constituting the measuring terminal arranged on a test plate main body with a projection part whose sectional shape is made up in a chevron shape, together with constituting the test plate main body with a flexible print plate whose surface shape is changed freely. CONSTITUTION:A mask 30 produced with a material onto which the solder is not stuck, is arranged in a close adhesion state on a circuit pattern 11 of a test plate 10. Besides, at this time, the center of a projection part forming hole 31 which is installed at the mask 30, is positioned at a position to be formed a projection 1. Next, a solder ball 1a to be the solder formed granularly is put in the projection part forming hole 31. Continuously, the solder ball 1a put in the projection part forming hole 31, is melted for instance the reflow bonding etc., means. By melting of this solder ball 1a, a solder bump whose sectional shape is the chevron shape, namely the projection 1 is formed in the projection part forming hole 31.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a test device used for circuit testing of printed circuit boards, and in particular provides a circuit testing device with a simplified structure of measurement terminals that are brought into contact with the measurement target portion of the printed board. The test plate main body is composed of a flexible printed board whose surface shape can freely change, and the measurement terminals arranged on the test plate main body are composed of protrusions having a chevron-shaped cross section.

[Industrial application field]

The present invention relates to a test device used for circuit testing of printed boards.

[Conventional technology]

As shown in the basic configuration diagram of FIG. 5, the conventional circuit testing apparatus has a structure including a test board main body 35 and a contact probe 40 erected on the test board main body 35. In the figure, reference numeral 41 is a measurement terminal provided to be slidable in the vertical direction (direction of arrow A-A') within the contact probe 40, reference numeral 43 is a spring that biases the measurement terminal 41 in the direction of arrow A, and reference numeral 42 is a contact. A test cable 50 electrically connects the probe 40 and a testing device (not shown), and is a mounting component mounted on the printed board 15 under test.

This circuit testing device brings the printed board 15 under test and the test board main body 35 close to each other by means such as vacuum suction, and connects the measurement terminal 41 of the contact probe 40 to the printed board 15 under test.
The circuit of the printed board 15 to be tested is tested by bringing it into contact with the through-hole portion 16 of No. 5.

[Problem to be solved by the invention]

However, as described above, the conventional circuit testing apparatus uses the contact probe 40 which has a complicated structure and requires high accuracy, and therefore has the following problems.

(1) Since the contact probe 40 is expensive,
If a large number of these devices are used, the total cost of the circuit testing device becomes extremely high.

(2) Since recent printed circuit boards are packaged with high density, it is necessary to downsize the contact probes 40 and increase their arrangement density. However, this contact probe 4
If 0 is made extremely small, the measurement terminal 41 becomes brittle and may bend or break, reducing the reliability of measurement.

(3) It is not easy to ensure the positional accuracy of the contact probe 40.

The present invention has been made to solve the above problems.

[Means to solve the problem]

As shown in the principle diagram of FIG. 1, the circuit testing device according to the present invention includes a test board main body 10 made of a flexible printed board whose surface shape can freely change, and a circuit pattern 11 formed on the test board main body 10. The basic configuration includes a projection l having a chevron-shaped cross-sectional shape.

[For production]

By configuring the circuit test device in this way, the structure of the measurement terminal can be significantly simplified and it can be made smaller, so it can be fully adapted to high-density mounted printed circuit boards, and it is also inexpensive. A circuit testing device is realized.

〔Example〕

EMBODIMENT OF THE INVENTION The present invention will be described in detail below based on embodiment figures.

Figures 2(a) and (bl are side sectional views of essential parts showing one example of forming the protrusion, Figure 3 is a side sectional view of essential parts showing another example of forming the protrusions, and Figures 4(al and (bl) are b) is a side view and a sectional side view of a main part showing one embodiment of the present invention;
The same parts as those in the figure are given the same reference numerals.

First, the case where the protrusion is formed with a solder bump (protrusion made of solder) will be explained using FIGS. 2A and 2B.

(2) A mask 30 made of a material to which solder does not adhere is placed in close contact with the circuit pattern 11 of the test board IO. At this time, the center of the protrusion forming hole 31 provided in the mask 30 is positioned at the position where the protrusion 1 is to be formed.

(2) Into the protrusion forming hole 31, insert a solder ball la made of granular solder.

(2) The solder ball la placed in the protrusion forming hole 31 is melted by means such as flow bonding. By melting this solder ball la, the protrusion forming hole 3
Inside 1 is a solder bump with a chevron-shaped cross section.

That is, a protrusion 1 is formed; the reason why the protrusion 1 is chevron-shaped is because the mask 30 is made of a material to which solder does not adhere.

FIG. 3 shows an example in which the protrusions 1 are formed by press working from the back surface of the test board main body 10, but in this example, the protrusions 1 are formed using the circuit pattern 11.

Next, an embodiment of the present invention will be described using FIG. 4 (al and mountain). Note that FIG. 4(a) is a side view of the main part showing the state before the start of the test, and FIG. 4(b) is a side sectional view of the main part showing the state during the test.

As shown in FIGS. 4(al) and (b), the circuit testing device of the present invention is supported by a base plate 60 equipped with the test plate main body 10 on the upper surface and a hinge 65 so as to be openable and closable in the direction of arrows c-c'. In the figure, 90 is a cavity formed in the upper guide 70, 8o is an airtight sheet arranged around the cavity 9o, and 75 is a cavity inside the cavity 90. An air suction port that sucks out air in the direction of the arrow; 61 is a positioning pin for the printed board 15 to be tested disposed on the base plate 60; 71 is a support for the printed board 15 to be tested so that it is not distorted during the test. It is a protrusion.

The operation of the circuit testing apparatus according to the present invention will be explained below.

(2) Place the printed board 15 to be tested on the test board main body 10 along the positioning pins 61 as shown in FIG. 3 (11).

(2) Close the upper guide 70 in the direction of arrow C. As a result, the cavity 90 is connected to the upper guide 70 and the test plate main body 1.
The airtight state is achieved by the action of the airtight seal (80) placed between the two.

(2) The air inside the cavity 90 is exhausted in the direction of the arrow by a vacuum device (not shown), and the inside of the cavity 90 is brought into a reduced pressure state.

(2) As a result, the test board main body IO is attracted toward the upper guide 70 and approaches the printed board 15 under test.

Then, the protruding portions 1 of the 10 test board bodies and the through-hole portions 16 of the 15 printed boards to be tested come into contact with each other, creating electrical continuity between them.

Note that the size of the protrusion 1 can be freely adjusted by, for example, changing the size of the solder ball 1a, so if the measurement target position is close to each other, the size of the solder ball 1a may be reduced. mutual contact can be avoided.

〔Effect of the invention〕

As is clear from the above description, the present invention has a significant industrial effect in that it can be applied to printed boards with high density, and a circuit testing device can be provided at low cost.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of the main part for explaining the present invention in detail, FIGS. Fig. 4 (al and (1)) is a side sectional view of the main part showing an embodiment of the present invention, and Fig. 5 is a conventional circuit test. FIG. 2 is a side cross-sectional view of main parts showing the basic configuration of the device. In the figure, 1 is a protrusion, 1a is a solder ball, 10 is a test board body, 11 is a circuit pattern, 15 is a printed board to be tested, 16 is a through-hole part, 30 is a mask, 31 is a protrusion formation hole, 40 is a A contact probe, 60 is a base plate, 65 is a hinge, 70 is an upper guide, 71 is a protrusion, 75 is an air outlet, 80 is an airtight sheet, and 90 is a cavity. 4 shots elf, principle diagram Figure 1 IQ) bl Figure 2 Figure 3 (Q) (b) No≦(9≦light,, -1-way saliva crazy υr coral Figure 4)

Claims (1)

[Claims] A circuit testing device that tests a printed board under test (15) by bringing a test board body (10) equipped with measurement terminals into contact with the printed board under test (15) in a facing state. In the configuration, the test plate (10) is made of a flexible printed board whose surface shape can freely change, and the test plate (10)
A circuit testing device characterized in that the measurement terminal arranged above is constituted by a protrusion (1) having a chevron-shaped cross section.