CA1289681C - Multipurpose socket - Google Patents
Multipurpose socketInfo
- Publication number
- CA1289681C CA1289681C CA000577091A CA577091A CA1289681C CA 1289681 C CA1289681 C CA 1289681C CA 000577091 A CA000577091 A CA 000577091A CA 577091 A CA577091 A CA 577091A CA 1289681 C CA1289681 C CA 1289681C
- Authority
- CA
- Canada
- Prior art keywords
- tape
- contact
- connector
- area
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Abstract of the Disclosure A test socket for testing chips and chips on tape wherein the test socket is formed on a heat resistant dielectric film having contact pads and connector pads joined by metallic circuit traces and which film is wrapped on a compliant pad. The connector end of the tape is joined to a circuit board by a conductive tape and maintained in contact by the compliant pad. A frame registers the chip with the contact area of the tape.
Description
~2~9~
MULTIPURPOSE SOCKET
Backqround of the Invention 1. Field of the Invention This invention relates to an improvement in devices for electrically testing high performance integrated circuit devices or chips, and in one aspect to an improved test socket for supporting the chip, whether on tape or not, ~ree of detrimental effect on the device or tape and affording rapid facile positive electrical connection with the contact points of said device.
MULTIPURPOSE SOCKET
Backqround of the Invention 1. Field of the Invention This invention relates to an improvement in devices for electrically testing high performance integrated circuit devices or chips, and in one aspect to an improved test socket for supporting the chip, whether on tape or not, ~ree of detrimental effect on the device or tape and affording rapid facile positive electrical connection with the contact points of said device.
2. _scription of the Prior Art ~ .s the development of integrated circuit devices continues, i.e. "chips", to provide in a single chip more and more capability, they result in more, and more, and more closely spaced contact points for electrically connecting circuits to a chip. It is always a step in the manufacture to test the chips. Performance of a chip is tested by placing each chip in a test fixture or test socket and connec~ing all of the contact points electrically to the test fixture such that a series of tests may be run on each of the modes of operation to determine the quality of the chip. As the contact points become located closer and closer together it has become increasingly difficult to desi~n a test socket which has hard wired contacts close enough together to assure contact with the individual contact points of the chip, and such test sockets are not suitable for testing integrated circuit devices packaged on a tape. Examples of such test sockets are present in U.S.A. patents Nos. 3,551,878;
3,914,007; 4,130,327; 4,508,~03; 4,541,676, and 4,639,058.
ThUs, With the development of technologies for chip-on-tape manufacture it was necessary to also be able to test the chips on the tape ~;~
~, :
., requiring registration with and surface contact to each of the contact points of suc~ chips. To do this requires high density terminals in the test socket which were no~ easily afforded by the mechanical fixturing of the test sockets. The requirements for chip-on-tape ~es~ing of chips having high density contact poin~s required the carrier tape handling capability, a hot test capability, an intelligen~ op~ra~or interface, qui~k load and unload of tape and flexibllit~ as to the set up for diiferent chip-on-tape formats.
The present invention provides a manual tape test station having strip or tape handling capability or individual chip handling capability, hot test capability~ an intelligent operator interface which provides ~or the location of the chip, quick load and unload of ~he chip and adapted for change from one chip format to another.
.
Summar~ of the Invention The present invention provides a temporary electronic circuit socket connector which can be utilized to effectively connect integrated cirauit deviaes or chips, which are carried on a tape durlng manufacture, to a clrcult a~d which may be ~or the purpose of testing the devlce or chip. The conneator is suitahle as a test ~ixture ~or chips and compri~es a single metal layer beam tape whlch has been etched to deiine contaat area por~ions and aonnector area portion3 joined by circuit traces.
Speaiflaally, the invention provides a socket connector for use in test and burn-in of integrated clrault devlaes having contact points, said conneator comprlsing: a conductive metal , ~ ' ' :
,:
layer beam tape having a central portian and end portlons, said central portion o f said beam tape definlng a contact area havinq contact portions to contact the contact polnts of an integrated circuit device and a connector area at said end por~ions haviny spaced connector portions for connection to correspondingly spaced contacts on a circuit board, said beam tape havin~ reglstration holes selectlvely posltio~ed in relationship to said contact poin~ ancl said conne~tor portions, and said beam tape being folded between sald contact area and said connector area, a compllant elastomeric pad dlsposed between said contact area and sald connector area for supporting said contact area and said connector area, frame means for supporting said pad and locating said connector area with said spaced connector portions positioned opposite to the contacts of a said printed circuit board and ~or locating an integrated circuit device to place the contac* points on the contact por~ions of said contact area, said frame means including registra~ion pins extending throu~h saicl registration holes, and means for pressing a said integrated circuit device onto said contact area with the contact points e~gagin4 said contact portions against the resilieDt support of said elasto~eric pad.
Pre~erably contact pads are ~ormed on one surface of a dielectria backi.ng, and conductive columns extend therethrough to circuit traces formed ~rom a conducttve metal coatin~ on the opposite surface. The pads are crown~ formed in the contact area to insure good contact to the contac~ points o~ the ahip. The contact pads in the contact portion of the beam tape are connected ~2896~L
60~57-3494 by the circult traces to the connector pads in the connector portion. The beam tape contact portion and the connector portions are disposed in vertically spaced relation with each of the same being outwardly e~posed and the circui~ traces being positioned inwardly. The frame me~ber which is adapted to be precisely located on the surface o~ a circuit board forming the test device or at least a portlon thereo~. The ~rame member is then iixed to ~he circuit board hy suitable fastening elements. ~lignmen~ means on the frame member afford registration of the frame mem~er with the printed circuit board and with the beam tape whereby the connectQr pads of the tape are properly aligned with pads on the circuit board and sections of the tape carrying the chip are properly aligned over the contac~ portions o~ the beam tape. A
covex member supported on the frame affords the means for temporarily pressing the chip-on-tape segment or chip against the contact portion of the beam tape against the resilience of the elastomer pad. This pressure member may be latched in place ~or continuous contact by a readily releasable latch ~eans. The pad between the locating brace and the printed circuit board presses the connector pads against contacts on the printed circuit board to maintain contact during the burn-in and/or testlng. Thus the ,socke~t, beam tape and elastomer pad may be readily chancJed ~or te~tiny other chip ~ormats utilizing the same printed cir~uit board.
Alternatively, the connector portion of the beam tape is adhered in registration with the contacts o~ a printed circuit board by the u6e of a double sided pressure-se~sitive adheslve 3a '~
',' ~
, , . . '' 96~3~
coated electrlcally conductive tape which is conductlve orlly transversely throuyh the tape and affords the electrical connection between the connector pads on the beam tape and the opposed contacts on the printed circuit board. The ~rame member is also ~astened to the printed circuit board to maintaln it stable for chip chanyes. Separate housings, regis~rable with the prin~ed clrcult 3b :
,:
"
~8~36~3~
_4 board, may be used with other beam tapes, but the adhesive should be removed as the sockets are changed.
Brief Description of the Drawing The present invention will be further described with reference to the accompanying drawing wherein:
Figure 1 is an exploded view of the chip test socket formed according to tha present invention;
Figure 2 is a plan view oP a strip of the beam tape;
~igure 3 is a schematic sectional view of the beam tape;
Figure 4 is a side view of the chip te~t socket;
and Figure 5 is an enlarged illustrative sectional view showing the relationship of the printed circuit board and the connecting beam tape.
Detailed Description of the Invention Referring to Figure 1, the test sockat of the present invention consists of a frame memb~r having a base 10 adapted for alignment on a printed circuit board 11. A cover plate 12 is hinged to the base ~0. A flexible circuit member comprising a strip of beam tape 15 is folded about an elastomeric pad 16 and a locating brace 37. The brace 37 is ~ 25 provided with alignment means in the form of pins 17 ;~ supported to position and register both the beam tape 15 and a strip of flexible tape 18, the tape 18 supports, in spaced relation therealong, a series of high performance integrated circuit devices or chips 20. Alignment between the connector port~ons of the beam tape 15 and contacts 29 on the printed circuit board 1~ also provided by the pins 17 and maintained by ~asteners, such as bolts 26 to locate the conn~ctor portion~ 63 oE the beam tape 15 with the contacts 2g on the printed circuit board 11 and to urge the contact points on the beam tape into electrical contact with the contacts on the printed circuit board.
The base 10 is generally rectangular in shape and '~
.
: .
~z~
is formed with a centrally located rectangular opening 31.
At one end is a pillar 32 which serves as a hinge support for the cover 12. Opposite the pillar 32 is a projection 34 which cooparates with a spring biased latch member 35 supported on the co~er 12 and pivoted thereto hut biased by a torsion spring into latching engagement with the projection 34 such that the projection 34 will engage a recess 36 which extends transversely of the latch member 35 as shown in Figure~ 1 and 4. The base has a locatinq brace 37 which extends across the opening 31 and is joined to the side memhers of the base forming the opening 3~. The brace 37 supports the pins 17 and the resilient material 16 supporting the beam tape 15.
The cover 12, as mentioned, is pivoted on the pillar 32 by means of a pin 40 extending through legs 41 and 42 projecting parallelly ~rom one end of the cove:r. The cover 12 is hinged by the pin 40 to move from an open position to a closed position mating closely with the base to urge ~he beam tape and the contacts of a chip, whether on ; tape or on a carrier r into contact with each other.
Positioned generally centrally of the cover 12 is an opening 45 to avoid pressure directly to a chip. Registration is made between a beam tape of 15 and the contact portions of the tape 1~ as the cover is closed. This alignment and registration i~ afforded by alignment or positioning means such as the square pins 17 which are provided on the base 10 and ~it in the edge sprocket holes 50 of the tape 18.
Alternatively, a chip carrier may be registered on the pins 30 17 to locate a chip on the beam tape 15. The tape 18 i9 ~ormed according to U.S. patent No. 3/832,769, issued September 3, 1974.
The beam tape 15, a~ illustrated in Figures 1, 2, and 3 compri~ee a contact portion and a connector portion.
As i-lustrated in Figures 2 and 3, the contact portion 47 o~
the tape 15 i~ generally centrally located with respect to the illustrated strip and comprises a plurality o~ contacts `~' , .
60 which form in the illustrated embodiment a generally rectangular outline with a plurality of the contacts 60 in each of four rows thereof about the center of the strip.
These contact portions 60 are joined by conductive material in hol~s through the tape to circuit traces 61 which electrically conductively join the contacts 60 to connector pads 63 in the connector portion of the tape strip. The connector pads 63 are similarly formed by conductive columns which extend through the backing and connect to the conductive circuit traces ~1. Aliynment of the connector portion and pads 63 with the contacts in the printed circuit board 11 is a~forded by alignment pins 17 which pass through registration holes 65 positioned adjacent to the contact area of the tape 15 and registration holes 66 positioned through the tape adjacent the connector area of the tape. Tape 15 is a polyamide film backing having a conductive metal coating on one sur~ace. Then by etching or masking processe~ the contact areas and circui~ traces are formed on the surface of the tape. ~ preferred backing for the tape 15 is KaptonTM
polyamide "H" film available from Du Pont of Wilmington, ~` Delaware, U.S.A. As indicated in Figures 3 and 4, the contact~ 60 in the contact portion o~ the tape are slightly embossed from the surface of the tape to provide a hump in the tape at the area of the contact. This humped contact at one end of each circuit trace provides the tape contact and may have a further metal coating on the surface thereof~
When the tape 15 is formed it is wrapped around an elastomeric support pad 16, e.g. a æilicone rubber pad as shown in Figure 1, positioned about the brace 37 which, as shown for illustration i5 out o~ the opening 31 across which 1t i9 positioned. The compliant nature o~ the pad 16 provides a support for the tape material 15 such that contact is maintained between the contacts 60 and the contact points of the chip 20 or a single chip which may be unsupported by khe kape and positioned in a plate set on the pins 17 having an aperture to receive the chip such that tha cover 12, when .' , . :
:
closed will maintain contact between said chip and the opposed crowns.
In this test socket there are no formed or stamped metal contacts or pins between the printed circuit board and the contact points of the chip. The photographically patterned contact areas, circuit traces and connector areas of the beam tape 15 form the circuit path from the chip to the circuit board of the test equipment. The elastomeric pad 16 provides the continued energy necessary to maintain reliable connections with all of the contact points. It is maintained under compression with the printed circuit board by the fasteners 26. When the cover 12 is latched in the mating position against the base 10 contact is maintained between the chip and contact pads 60 by the pad 16 for reliable connection during the test cycles.
Typically chips to be tested afford 1 to 1 > x < contact points 60 about the center of the contact portion of the tape 15 to which then are connected to 1 to 1 > x < connector points for connection to the printed circuit board. When the connector end portions of the tape, as illustrated in Figure 2, are Eolded about opposed ends of the pad 16, as illustrated in Figures 4 and 5, the pins 17 align the contact points with the base 10 and align the connector pads with the base. The pins 17 on the brace 37 fit into holes 19 formed in the printed circuit board 11 outside the area o~ the contacts 29 to then align the tape 15 and connector pads to the contacts 29. The abutting ends of the tape }5 and the connector pads and the contacts 29 can be maintained in position by the use of a conductive adhesive tape 25 positioned against the exposed connector pads 63. The tape 25 is a layer o~ pressure sensitive adhesive which is formed to be conductive by conductive particles being disposed in the layer o~ adhesive as disclosed in U.S. Patent No. 4,606,962, issued August lg, 1986. ~his adhesive tape is :' , . - :
~. ~ . , : .
conductive only in a path between the opposite surfaces and thus this tape w~ll join the connectors 63 to the contacts on the printed circuit board 11. An example of such conductive tape is C 3100X and C 4100X available from Minnesota Mining and Manufacturing Company of St. Paul, Minnesota, U.S.~.
Alignment, as above noted, is established by the alignment or locating pins 17 fitting in the printed circuit board and holes 65 and 66 in the tape 15.
Alignment of the chips is maintained through the pins 17, and when the cover 12 is opened, the chip is advanced by moviny the tape 1~ forward to regist:er openings 50 along the marginal edges on pins 17 to locate a second chip aligned with the contacts of the beam tape 15. The cover is then swung to the closed position and the latch plate 35 engages the projection 34. There is compression on the pad 16 amounting to 17 to 29 grams per contact in the illustrated socket. The registration is thus established and the chip is located in the opening. The tape 15 is registered by the pins 17 passing through the holes 65 and 66l and contact is made with the printed circuit board contacts through the tape 25 on the Z-axis and compressed pad 16 under the force of the fasteners 26, or solely through the compressive contact between the pads 63 and the contacts 29.
This system affords reliability in testing, permits the circuit to be changed readily to match different formats for the chips, and the selections of tape permit testing over a wide range of elevated temperatures.
' .
ThUs, With the development of technologies for chip-on-tape manufacture it was necessary to also be able to test the chips on the tape ~;~
~, :
., requiring registration with and surface contact to each of the contact points of suc~ chips. To do this requires high density terminals in the test socket which were no~ easily afforded by the mechanical fixturing of the test sockets. The requirements for chip-on-tape ~es~ing of chips having high density contact poin~s required the carrier tape handling capability, a hot test capability, an intelligen~ op~ra~or interface, qui~k load and unload of tape and flexibllit~ as to the set up for diiferent chip-on-tape formats.
The present invention provides a manual tape test station having strip or tape handling capability or individual chip handling capability, hot test capability~ an intelligent operator interface which provides ~or the location of the chip, quick load and unload of ~he chip and adapted for change from one chip format to another.
.
Summar~ of the Invention The present invention provides a temporary electronic circuit socket connector which can be utilized to effectively connect integrated cirauit deviaes or chips, which are carried on a tape durlng manufacture, to a clrcult a~d which may be ~or the purpose of testing the devlce or chip. The conneator is suitahle as a test ~ixture ~or chips and compri~es a single metal layer beam tape whlch has been etched to deiine contaat area por~ions and aonnector area portion3 joined by circuit traces.
Speaiflaally, the invention provides a socket connector for use in test and burn-in of integrated clrault devlaes having contact points, said conneator comprlsing: a conductive metal , ~ ' ' :
,:
layer beam tape having a central portian and end portlons, said central portion o f said beam tape definlng a contact area havinq contact portions to contact the contact polnts of an integrated circuit device and a connector area at said end por~ions haviny spaced connector portions for connection to correspondingly spaced contacts on a circuit board, said beam tape havin~ reglstration holes selectlvely posltio~ed in relationship to said contact poin~ ancl said conne~tor portions, and said beam tape being folded between sald contact area and said connector area, a compllant elastomeric pad dlsposed between said contact area and sald connector area for supporting said contact area and said connector area, frame means for supporting said pad and locating said connector area with said spaced connector portions positioned opposite to the contacts of a said printed circuit board and ~or locating an integrated circuit device to place the contac* points on the contact por~ions of said contact area, said frame means including registra~ion pins extending throu~h saicl registration holes, and means for pressing a said integrated circuit device onto said contact area with the contact points e~gagin4 said contact portions against the resilieDt support of said elasto~eric pad.
Pre~erably contact pads are ~ormed on one surface of a dielectria backi.ng, and conductive columns extend therethrough to circuit traces formed ~rom a conducttve metal coatin~ on the opposite surface. The pads are crown~ formed in the contact area to insure good contact to the contac~ points o~ the ahip. The contact pads in the contact portion of the beam tape are connected ~2896~L
60~57-3494 by the circult traces to the connector pads in the connector portion. The beam tape contact portion and the connector portions are disposed in vertically spaced relation with each of the same being outwardly e~posed and the circui~ traces being positioned inwardly. The frame me~ber which is adapted to be precisely located on the surface o~ a circuit board forming the test device or at least a portlon thereo~. The ~rame member is then iixed to ~he circuit board hy suitable fastening elements. ~lignmen~ means on the frame member afford registration of the frame mem~er with the printed circuit board and with the beam tape whereby the connectQr pads of the tape are properly aligned with pads on the circuit board and sections of the tape carrying the chip are properly aligned over the contac~ portions o~ the beam tape. A
covex member supported on the frame affords the means for temporarily pressing the chip-on-tape segment or chip against the contact portion of the beam tape against the resilience of the elastomer pad. This pressure member may be latched in place ~or continuous contact by a readily releasable latch ~eans. The pad between the locating brace and the printed circuit board presses the connector pads against contacts on the printed circuit board to maintain contact during the burn-in and/or testlng. Thus the ,socke~t, beam tape and elastomer pad may be readily chancJed ~or te~tiny other chip ~ormats utilizing the same printed cir~uit board.
Alternatively, the connector portion of the beam tape is adhered in registration with the contacts o~ a printed circuit board by the u6e of a double sided pressure-se~sitive adheslve 3a '~
',' ~
, , . . '' 96~3~
coated electrlcally conductive tape which is conductlve orlly transversely throuyh the tape and affords the electrical connection between the connector pads on the beam tape and the opposed contacts on the printed circuit board. The ~rame member is also ~astened to the printed circuit board to maintaln it stable for chip chanyes. Separate housings, regis~rable with the prin~ed clrcult 3b :
,:
"
~8~36~3~
_4 board, may be used with other beam tapes, but the adhesive should be removed as the sockets are changed.
Brief Description of the Drawing The present invention will be further described with reference to the accompanying drawing wherein:
Figure 1 is an exploded view of the chip test socket formed according to tha present invention;
Figure 2 is a plan view oP a strip of the beam tape;
~igure 3 is a schematic sectional view of the beam tape;
Figure 4 is a side view of the chip te~t socket;
and Figure 5 is an enlarged illustrative sectional view showing the relationship of the printed circuit board and the connecting beam tape.
Detailed Description of the Invention Referring to Figure 1, the test sockat of the present invention consists of a frame memb~r having a base 10 adapted for alignment on a printed circuit board 11. A cover plate 12 is hinged to the base ~0. A flexible circuit member comprising a strip of beam tape 15 is folded about an elastomeric pad 16 and a locating brace 37. The brace 37 is ~ 25 provided with alignment means in the form of pins 17 ;~ supported to position and register both the beam tape 15 and a strip of flexible tape 18, the tape 18 supports, in spaced relation therealong, a series of high performance integrated circuit devices or chips 20. Alignment between the connector port~ons of the beam tape 15 and contacts 29 on the printed circuit board 1~ also provided by the pins 17 and maintained by ~asteners, such as bolts 26 to locate the conn~ctor portion~ 63 oE the beam tape 15 with the contacts 2g on the printed circuit board 11 and to urge the contact points on the beam tape into electrical contact with the contacts on the printed circuit board.
The base 10 is generally rectangular in shape and '~
.
: .
~z~
is formed with a centrally located rectangular opening 31.
At one end is a pillar 32 which serves as a hinge support for the cover 12. Opposite the pillar 32 is a projection 34 which cooparates with a spring biased latch member 35 supported on the co~er 12 and pivoted thereto hut biased by a torsion spring into latching engagement with the projection 34 such that the projection 34 will engage a recess 36 which extends transversely of the latch member 35 as shown in Figure~ 1 and 4. The base has a locatinq brace 37 which extends across the opening 31 and is joined to the side memhers of the base forming the opening 3~. The brace 37 supports the pins 17 and the resilient material 16 supporting the beam tape 15.
The cover 12, as mentioned, is pivoted on the pillar 32 by means of a pin 40 extending through legs 41 and 42 projecting parallelly ~rom one end of the cove:r. The cover 12 is hinged by the pin 40 to move from an open position to a closed position mating closely with the base to urge ~he beam tape and the contacts of a chip, whether on ; tape or on a carrier r into contact with each other.
Positioned generally centrally of the cover 12 is an opening 45 to avoid pressure directly to a chip. Registration is made between a beam tape of 15 and the contact portions of the tape 1~ as the cover is closed. This alignment and registration i~ afforded by alignment or positioning means such as the square pins 17 which are provided on the base 10 and ~it in the edge sprocket holes 50 of the tape 18.
Alternatively, a chip carrier may be registered on the pins 30 17 to locate a chip on the beam tape 15. The tape 18 i9 ~ormed according to U.S. patent No. 3/832,769, issued September 3, 1974.
The beam tape 15, a~ illustrated in Figures 1, 2, and 3 compri~ee a contact portion and a connector portion.
As i-lustrated in Figures 2 and 3, the contact portion 47 o~
the tape 15 i~ generally centrally located with respect to the illustrated strip and comprises a plurality o~ contacts `~' , .
60 which form in the illustrated embodiment a generally rectangular outline with a plurality of the contacts 60 in each of four rows thereof about the center of the strip.
These contact portions 60 are joined by conductive material in hol~s through the tape to circuit traces 61 which electrically conductively join the contacts 60 to connector pads 63 in the connector portion of the tape strip. The connector pads 63 are similarly formed by conductive columns which extend through the backing and connect to the conductive circuit traces ~1. Aliynment of the connector portion and pads 63 with the contacts in the printed circuit board 11 is a~forded by alignment pins 17 which pass through registration holes 65 positioned adjacent to the contact area of the tape 15 and registration holes 66 positioned through the tape adjacent the connector area of the tape. Tape 15 is a polyamide film backing having a conductive metal coating on one sur~ace. Then by etching or masking processe~ the contact areas and circui~ traces are formed on the surface of the tape. ~ preferred backing for the tape 15 is KaptonTM
polyamide "H" film available from Du Pont of Wilmington, ~` Delaware, U.S.A. As indicated in Figures 3 and 4, the contact~ 60 in the contact portion o~ the tape are slightly embossed from the surface of the tape to provide a hump in the tape at the area of the contact. This humped contact at one end of each circuit trace provides the tape contact and may have a further metal coating on the surface thereof~
When the tape 15 is formed it is wrapped around an elastomeric support pad 16, e.g. a æilicone rubber pad as shown in Figure 1, positioned about the brace 37 which, as shown for illustration i5 out o~ the opening 31 across which 1t i9 positioned. The compliant nature o~ the pad 16 provides a support for the tape material 15 such that contact is maintained between the contacts 60 and the contact points of the chip 20 or a single chip which may be unsupported by khe kape and positioned in a plate set on the pins 17 having an aperture to receive the chip such that tha cover 12, when .' , . :
:
closed will maintain contact between said chip and the opposed crowns.
In this test socket there are no formed or stamped metal contacts or pins between the printed circuit board and the contact points of the chip. The photographically patterned contact areas, circuit traces and connector areas of the beam tape 15 form the circuit path from the chip to the circuit board of the test equipment. The elastomeric pad 16 provides the continued energy necessary to maintain reliable connections with all of the contact points. It is maintained under compression with the printed circuit board by the fasteners 26. When the cover 12 is latched in the mating position against the base 10 contact is maintained between the chip and contact pads 60 by the pad 16 for reliable connection during the test cycles.
Typically chips to be tested afford 1 to 1 > x < contact points 60 about the center of the contact portion of the tape 15 to which then are connected to 1 to 1 > x < connector points for connection to the printed circuit board. When the connector end portions of the tape, as illustrated in Figure 2, are Eolded about opposed ends of the pad 16, as illustrated in Figures 4 and 5, the pins 17 align the contact points with the base 10 and align the connector pads with the base. The pins 17 on the brace 37 fit into holes 19 formed in the printed circuit board 11 outside the area o~ the contacts 29 to then align the tape 15 and connector pads to the contacts 29. The abutting ends of the tape }5 and the connector pads and the contacts 29 can be maintained in position by the use of a conductive adhesive tape 25 positioned against the exposed connector pads 63. The tape 25 is a layer o~ pressure sensitive adhesive which is formed to be conductive by conductive particles being disposed in the layer o~ adhesive as disclosed in U.S. Patent No. 4,606,962, issued August lg, 1986. ~his adhesive tape is :' , . - :
~. ~ . , : .
conductive only in a path between the opposite surfaces and thus this tape w~ll join the connectors 63 to the contacts on the printed circuit board 11. An example of such conductive tape is C 3100X and C 4100X available from Minnesota Mining and Manufacturing Company of St. Paul, Minnesota, U.S.~.
Alignment, as above noted, is established by the alignment or locating pins 17 fitting in the printed circuit board and holes 65 and 66 in the tape 15.
Alignment of the chips is maintained through the pins 17, and when the cover 12 is opened, the chip is advanced by moviny the tape 1~ forward to regist:er openings 50 along the marginal edges on pins 17 to locate a second chip aligned with the contacts of the beam tape 15. The cover is then swung to the closed position and the latch plate 35 engages the projection 34. There is compression on the pad 16 amounting to 17 to 29 grams per contact in the illustrated socket. The registration is thus established and the chip is located in the opening. The tape 15 is registered by the pins 17 passing through the holes 65 and 66l and contact is made with the printed circuit board contacts through the tape 25 on the Z-axis and compressed pad 16 under the force of the fasteners 26, or solely through the compressive contact between the pads 63 and the contacts 29.
This system affords reliability in testing, permits the circuit to be changed readily to match different formats for the chips, and the selections of tape permit testing over a wide range of elevated temperatures.
' .
Claims (10)
1. A socket connector for use in test and burn-in of integrated circuit devices having contact points, said connector comprising:
a conductive metal layer beam tape having a central portion and end portions, said central portion of said beam tape defining a contact area having contact portions to contact the contact points of an integrated circuit device and a connector area at said end portions having spaced connector portions for connection to correspondingly spaced contacts on a circuit board, said beam tape having registration holes selectively positioned in relationship to said contact points and said connector portions, and said beam tape being folded between said contact area and said connector area, a compliant elastomeric pad disposed between said contact area and said connector area for supporting said contact area and said connector area, frame means for supporting said pad and locating said connector area with said spaced connector portions positioned opposite to the contacts of a said printed circuit board and for locating an integrated circuit device to place the contact points on the contact portions of said contact area, said frame means including registration pins extending through said registration holes, and means for pressing a said integrated circuit device onto said contact area with the contact points engaging said contact portions against the resilient support of said elastomeric pad.
a conductive metal layer beam tape having a central portion and end portions, said central portion of said beam tape defining a contact area having contact portions to contact the contact points of an integrated circuit device and a connector area at said end portions having spaced connector portions for connection to correspondingly spaced contacts on a circuit board, said beam tape having registration holes selectively positioned in relationship to said contact points and said connector portions, and said beam tape being folded between said contact area and said connector area, a compliant elastomeric pad disposed between said contact area and said connector area for supporting said contact area and said connector area, frame means for supporting said pad and locating said connector area with said spaced connector portions positioned opposite to the contacts of a said printed circuit board and for locating an integrated circuit device to place the contact points on the contact portions of said contact area, said frame means including registration pins extending through said registration holes, and means for pressing a said integrated circuit device onto said contact area with the contact points engaging said contact portions against the resilient support of said elastomeric pad.
2. A socket connector according to claim 1 wherein a strip of tape having opposite surfaces, which is conductive through the tape between said opposite surfaces, is applied over the connector area of said beam tape.
3. A socket connector according to claim 1 or 2 wherein said beam tape comprises a thin dielectric backing and on one surface a pattern of conductive strips defining circuit traces which strips are joined to individual crowns on the opposite surface of the tape defining said contact portions and connector portions.
4. A socket connector according to claim 1 wherein said frame means comprises a plate having a rectangular opening and a brace spanning said opening, said elastomeric pad being positioned about said brace to urge said connector area toward a said circuit board and said contact area toward a said integrated circuit device.
5. A socket connector according to claim 4 wherein said brace has pin means extending from opposite surfaces thereof and through said beam tape adjacent to said contact area and said connector area for registering said beam tape to said frame means.
6. A socket connector according to claim 4 wherein fastening means secure said frame means to a said circuit board with the elastomeric pad pressing said tape connector area toward said circuit board.
7. A socket connector according to claim 5 wherein said pin means includes means for registering said frame means with a said circuit board for registering said connector area with a series of contacts formed on said circuit board.
8. A socket connector according to claim 7 wherein said means for pressing said integrated circuit device onto said contact area comprises a cover hinged to said frame and formed to move from an open position to a closed mating position with said frame to urge said beam tape contact area against said elastomeric pad for urging a said circuit device into intimate electrical contact therewith, and releasable latch means for holding said cover in said mating position.
9. A socket connector according to claim 8 wherein registration means afford alignment of a said circuit device with said contact area of said beam tape for making said electrical contact therewith.
10. A socket according to claim 1 wherein said beam tape comprises a thin dielectric backing and on one surface a pattern of conductive strips defining circuit traces which strips are joined to individual crowns on the opposite surface of the tape defining said contact portions and connector portions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10120387A | 1987-09-25 | 1987-09-25 | |
| US101,203 | 1987-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1289681C true CA1289681C (en) | 1991-09-24 |
Family
ID=22283493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000577091A Expired - Fee Related CA1289681C (en) | 1987-09-25 | 1988-09-12 | Multipurpose socket |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1289681C (en) |
-
1988
- 1988-09-12 CA CA000577091A patent/CA1289681C/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |