JPH01201996A - Manufacture of multi-layer ceramic printed-circuit board - Google Patents
Manufacture of multi-layer ceramic printed-circuit boardInfo
- Publication number
- JPH01201996A JPH01201996A JP2590688A JP2590688A JPH01201996A JP H01201996 A JPH01201996 A JP H01201996A JP 2590688 A JP2590688 A JP 2590688A JP 2590688 A JP2590688 A JP 2590688A JP H01201996 A JPH01201996 A JP H01201996A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- circuit board
- crystal
- printed circuit
- forming member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000004020 conductor Substances 0.000 claims abstract description 46
- 239000013078 crystal Substances 0.000 claims abstract description 42
- 239000011148 porous material Substances 0.000 claims abstract description 18
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000003112 inhibitor Substances 0.000 claims abstract description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000004898 kneading Methods 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 9
- 230000002159 abnormal effect Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000011230 binding agent Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 4
- 238000010304 firing Methods 0.000 description 13
- 238000007796 conventional method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000012212 insulator Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003966 growth inhibitor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
多層セラミックプリント基板の製造方法に関し、プリン
ト基板形成部材の焼成時に導電体を結合する結晶粒が異
常成長してクローズドポアが発生するのを防止するのを
目的とし、
アルミナとガラス粉末を有機溶媒で混練後、シート状に
成形した絶縁シートにスルーホールを設け、該スルーホ
ール内に導電体ペーストを充填するとともに、前記絶縁
シート上に導電体ペーストを塗布して所定の導電体パタ
ーンを形成したプリント基板形成部材を多層構造に積層
後、焼成する多層セラミックプリント基板の製造に於い
て、前記プリント基板形成部材の焼成時で、前記導電体
の結晶粒か結合する麗に発生ずるクローズドポアの発生
防止剤を、前記導電体ペーストに予め添加することで構
成する。[Detailed Description of the Invention] [Summary] Regarding a method for manufacturing a multilayer ceramic printed circuit board, the present invention relates to a method for manufacturing a multilayer ceramic printed circuit board, which prevents the generation of closed pores due to abnormal growth of crystal grains that bond conductors during firing of a printed circuit board forming member. For the purpose, after kneading alumina and glass powder with an organic solvent, a through hole is formed in an insulating sheet formed into a sheet shape, and a conductive paste is filled in the through hole, and the conductive paste is applied on the insulating sheet. In manufacturing a multilayer ceramic printed circuit board in which printed circuit board forming members on which a predetermined conductive pattern is formed are laminated into a multilayer structure and then fired, crystal grains of the conductive material are removed during firing of the printed circuit board forming member. An agent for preventing the formation of closed pores, which can be easily bonded, is added to the conductive paste in advance.
本発明は多層セラミックプリント基板の製造方法に関す
る。The present invention relates to a method for manufacturing a multilayer ceramic printed circuit board.
セラミンクと溶融せるガラスとを主成分とした絶縁シー
ｌ−にスルーホールを設け、該スルーホール内および絶
縁シート上に導電体を形成したプリント基板形成部材を
多層構造に積層後、焼成して形成する多層セラミックプ
リント基板は、その絶縁抵抗か従来用いられているエポ
キシ樹脂を基材として用いたプリント基板に比して高抵
抗であるので、大電力素子を搭載し、大型電算機の電子
回路を形成するプリント基板に用いられている。A through hole is provided in an insulating sheet l- whose main components are ceramic and meltable glass, and a printed circuit board forming member with a conductor formed inside the through hole and on the insulating sheet is laminated in a multilayer structure and then fired. The multilayer ceramic printed circuit board has a higher insulation resistance than the conventional printed circuit board using epoxy resin as a base material, so it is suitable for mounting high-power elements and electronic circuits of large computers. It is used to form printed circuit boards.
従来の多層セラミックプリント基板の製造方法りこ付い
て述へる。A conventional method for manufacturing a multilayer ceramic printed circuit board will be described in detail.
第２図に示すように硼珪酸ガラス粉末とアルミナとを有
機溶媒に混練して泥状にし、この泥状の材料を成形して
シート状にしてグリーンシート１に形成する。更にこの
グリーンシート１にスルーホール２を形成した後、銅粉
末と有機材料よりなるバインダーに混練した導電性ペー
スト３を、スルーボール１内に充填するとともに、印刷
法によりグリーンシート上に前記導電性ペース１−を塗
布することで導電体パターン４を形成してセラミックプ
リント基板の形成部制５を形成する。As shown in FIG. 2, borosilicate glass powder and alumina are kneaded in an organic solvent to form a slurry, and this slurry material is molded into a sheet to form the green sheet 1. Further, after forming through holes 2 in this green sheet 1, a conductive paste 3 kneaded with a binder made of copper powder and an organic material is filled into the through balls 1, and the conductive paste 3 is formed on the green sheet by a printing method. A conductor pattern 4 is formed by applying paste 1-, and a forming part 5 of a ceramic printed circuit board is formed.
次いてこの形成部材５を多層構造に焼成治具上に積層し
た後、第３図に示すような温度プロフィル６にて窒素ガ
ス等の不活性ガス雰囲気内で加熱焼成を行っている。Next, this forming member 5 is laminated in a multilayer structure on a firing jig, and then heated and fired in an atmosphere of an inert gas such as nitrogen gas at a temperature profile 6 as shown in FIG.
この加熱温度プロフィル６を説明すると、プリント基板
形成部材を加熱炉内に導入した後、導電体ペースト３よ
りペースト中の有機物よりなるバインダーが逃散して除
去されるとともに、導電体が収縮する４００°Ｃ迄の温
度に到達する時間は約１０時間程度にし、更に４００°
Ｃの温度て約６時間保った後、更に最終焼成温度の１０
００″Ｃまでに到達させるのに、７５°Ｃ／ｌｈｒの温
度」二昇速度で加熱焼成している。To explain this heating temperature profile 6, after the printed circuit board forming member is introduced into the heating furnace, the binder made of organic matter in the paste escapes and is removed from the conductor paste 3, and the conductor contracts at 400°. It takes about 10 hours to reach the temperature of C, and then the temperature is increased to 400°.
After maintaining the temperature at C for about 6 hours, the final firing temperature was increased to 10
In order to reach the temperature up to 00"C, heating and baking were carried out at a temperature increase rate of 75°C/lhr.
（発明か解決しようとする問題点〕
ところで従来の方法で形成する以前のプリント基板形成
部材の導電体の領域を電子顕微鏡で観察した状態は第４
回に示すように導電体を構成する結晶粒７か路間−の大
きさの状態であり、またグリーンシー１の絶縁体領域を
電子顕微鏡で観察した状態は第６図に示すように、アル
ミナよりなる粒子８にガラス粉末よりなる液相形成物質
の粒子９か混合した状態である。(Problem to be solved by the invention) By the way, the state of the conductive region of the printed circuit board forming member before it was formed by the conventional method when observed with an electron microscope is as follows.
As shown in Fig. 6, the crystal grains 7 constituting the conductor are in a state of the size of 1-2, and as shown in Fig. 6, the insulator region of Green Sea 1 is observed with an electron microscope. This is a state in which particles 8 of a liquid phase forming substance made of glass powder are mixed with particles 9 of a liquid phase forming substance made of glass powder.
このプリント基板形成部材を従来の方法で焼成した場合
、前記した第４図の導電体領域は第５図に示すようにな
り、異常成長した導電体結晶粒１０と微小成長した導電
体結晶粒１１との混合状態となり、また前記した第６図
に示す絶縁体領域は第７図に示すように、溶融した液相
領域１２内にアルミナの結晶粒子８が混合した状態に成
っている。When this printed circuit board forming member is fired by the conventional method, the conductor region shown in FIG. 4 becomes as shown in FIG. 5, with abnormally grown conductor crystal grains 10 and finely grown conductor crystal grains 11. Furthermore, the insulator region shown in FIG. 6 described above is in a state where alumina crystal particles 8 are mixed in the molten liquid phase region 12, as shown in FIG.
第５図に示すように、導電体領域に異常成長した導電体
結晶粒１０と微小成長した導電体結晶粒１１との間に形
成される空洞状の空孔をクローズドポア１２と称してお
り、このクローズドポア１２が発生すると導電体領域の
抵抗か上昇し、所定の電気的特性を有するプリント基板
か形成されない問題がある。As shown in FIG. 5, the hollow pores formed between the conductor crystal grains 10 that have grown abnormally in the conductor region and the conductor crystal grains 11 that have grown microscopically are called closed pores 12. When the closed pores 12 occur, the resistance of the conductor region increases, resulting in a problem that a printed circuit board having predetermined electrical characteristics cannot be formed.
このようなりローズドボアの発生原因は、プリント基板
を焼成する際、グリーンシートの絶縁体領域に歪や、ボ
ア等が発生しないような条件で焼成しているため、導電
体領域が過焼成に成って前記したクローズドポアが発生
するとされている。The cause of this kind of rose bore is that when baking printed circuit boards, the conductor area is overfired because it is fired under conditions that do not cause distortion or bores in the insulator area of the green sheet. The closed pores described above are said to occur.
本発明は上記した問題点を解決し、導電体にクローズド
ポアが発生しないようにした多層セラミックプリント基
板の製造方法の提供を目的とする。An object of the present invention is to solve the above-mentioned problems and provide a method for manufacturing a multilayer ceramic printed circuit board in which closed pores are not generated in the conductor.
上記目的を達成するための本発明の多層セラミックプリ
ント基板の製造方法は、アルミナとガラス粉末を混合溶
融後、加熱してシート状に成形した絶縁シートにスルー
ホールを設け、該スルーホール内に導電体を充填すると
ともに、前記絶縁シ−ト上に所定の導電体パターンを形
成したプリント基板形成部材を多層構造に積層後、焼成
する多層セラミックプリント基板の製造に於いて、前記
プリント基板形成部材の焼成時に、前記導電体の結晶粒
が結合する際のクローズドポア発生防止剤を、予め前記
導電体の形成材料に添加する。In order to achieve the above object, the method for manufacturing a multilayer ceramic printed circuit board of the present invention is to provide a through hole in an insulating sheet formed by mixing and melting alumina and glass powder, heating it and forming it into a sheet, and conductive in the through hole. In the production of a multilayer ceramic printed circuit board, in which the printed circuit board forming members, each having a predetermined conductive pattern formed on the insulating sheet, are laminated in a multilayer structure and fired. An agent for preventing the formation of closed pores when the crystal grains of the conductor are combined during firing is added in advance to the material for forming the conductor.
本発明の方法はプリンＩ・基板形成部材の焼成時に、導
電体結晶粒の周囲の表面に粒状に付着することで、形成
される導電体結晶粒の表面エネルギーを低下させ、結晶
粒の成長を抑制する結晶成長防止剤を導電体形成材料に
予め添加することで結晶粒の異常成長を防止し、それに
よって異常成長した結晶粒と微小成長した結晶粒の間の
空隙に形成されるクローズドポアの発生を防止する。The method of the present invention lowers the surface energy of the formed conductor crystal grains by adhering them in granular form to the surface around the conductor crystal grains during firing of the pudding I/substrate forming member, thereby inhibiting the growth of the crystal grains. Abnormal growth of crystal grains is prevented by adding a suppressing crystal growth inhibitor to the conductor-forming material in advance, thereby preventing closed pores formed in the voids between abnormally grown crystal grains and minutely grown crystal grains. Prevent occurrence.
以下、図面を用いて本発明の実施例につき詳細に説明す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
本発明の方法が従来の方法と異なる点は、セラミック基
板形成部材の焼成時に導電体領域の結晶粒子か異常成長
するのを抑制する防止剤としての酸化マグネシウム（Ｍ
ｇＯ）を金属銅の粉末と有機樹脂よりなるバインダーと
を混練した導電体ペースＩ・の中に、前記金属銅に対し
て１〜２重量％程度の割合で予め混合しておく。The method of the present invention differs from conventional methods in that magnesium oxide (M2) is used as an inhibitor to suppress abnormal growth of crystal grains in the conductive region during firing of the ceramic substrate forming member.
gO) is mixed in advance in conductor paste I, which is a mixture of metallic copper powder and a binder made of an organic resin, at a ratio of about 1 to 2% by weight based on the metallic copper.
このトｇＯの結晶の大きさは、導電体の結晶粒の大きさ
に比して小さく、導電体結晶の焼成時に導電体結晶の周
囲表面に付着する。The size of this gO crystal is smaller than the crystal grain size of the conductor, and it adheres to the surrounding surface of the conductor crystal when the conductor crystal is fired.
このようにすれば、第１図に示すようにプリント基板形
成部材の焼成時に、導電体結晶粒２１の周囲にＭｇＯの
結晶２２が付着し、このとｇｏの結晶２２によって導電
体結晶粒２１の表面エネルキーが低下して成長が抑制さ
れ、従来のように導電体の結晶粒の異常成長が発生せず
、従ってクローズドポアが発生しない。If this is done, as shown in FIG. 1, MgO crystals 22 will adhere around the conductor crystal grains 21 during firing of the printed circuit board forming member, and the MgO crystals 22 will form the conductor crystal grains 21. The surface energy is lowered and growth is suppressed, so that abnormal growth of crystal grains of the conductor does not occur as in the conventional case, and therefore closed pores do not occur.
尚、本実施例では異常結晶粒の成長抑制剤としてＭｇＯ
を用いたが、その他アルミニウム、或いはカルシウム等
の周期律表で第■族、或いは第■族の金属元素の化合物
を用いても良い。In this example, MgO was used as a growth inhibitor for abnormal crystal grains.
However, compounds of metal elements of Group 1 or Group 2 of the periodic table, such as aluminum or calcium, may also be used.
このようにして形成した導電体ペーストを用いて導電体
層を形成後、前記した第３図に示す温度プロフィルによ
ってプリント基板形成部材を焼成したところ、クローズ
ドポアの発生が見られない高品質の多層セラミックプリ
ント基板が得られた。After forming a conductive layer using the conductive paste thus formed, a printed circuit board forming member was fired according to the temperature profile shown in Fig. 3, and a high-quality multilayer film was obtained in which no closed pores were observed. A ceramic printed circuit board was obtained.
そしてカラス粉末が溶融してガラスの溶融体が形成され
る７００°Ｃの温度より高い１０００″Ｃの温度でセラ
ミック基板形成部材を焼成させると、均一にガラス粉末
が溶融し、焼成されたガラス層の内部にアルミナが均一
に混合された絶縁体層が得られ、かつ導電体層にもクロ
ーズドポアが発生し難い高品位の多層セラミックプリン
ト基板が得られる。Then, when the ceramic substrate forming member is fired at a temperature of 1000"C, which is higher than the temperature of 700"C at which the glass powder is melted and a molten glass body is formed, the glass powder is uniformly melted and a fired glass layer is formed. An insulating layer in which alumina is uniformly mixed can be obtained, and a high-quality multilayer ceramic printed circuit board in which closed pores are less likely to occur in the conductive layer can also be obtained.
（発明の効果〕
以」−の説明から明らかなように本発明によれば、導電
体層にクローズドポアが発生しない高品位な多層セラミ
ックプリント基板が得られる効果がある。(Effects of the Invention) As is clear from the explanation below, the present invention has the effect of providing a high-quality multilayer ceramic printed circuit board in which closed pores do not occur in the conductor layer.
第１図は本発明の方法による導電体の結晶の状態図、
第２図は多層セラミック基板の断面図、第３図は従来の
方法の焼成炉の温度プロフィル図、
第４図は焼成前の導電体の状態図、
第５図は従来の方法に於ける焼成後の導電体の状態図、
第６図は焼成前の絶縁体層の状態図、
第７図は従来の方法に於ける焼成後の絶縁体層の状態図
である。
図において、
１はグリーンシート、２はスルーボール、３は導電体ペ
ースト、４は導電体パターン、５はプリント基板形成部
材、２１は導電体結晶粒、２２はＭｇＯ結晶を示す。
ち−
編
錫
や
増Fig. 1 is a state diagram of a conductor crystal produced by the method of the present invention, Fig. 2 is a cross-sectional view of a multilayer ceramic substrate, Fig. 3 is a temperature profile diagram of a firing furnace of a conventional method, and Fig. 4 is a diagram of the state before firing. Figure 5 is a diagram of the state of the conductor after firing in the conventional method. Figure 6 is the diagram of the state of the insulator layer before firing. Figure 7 is the diagram of the state of the conductor after firing in the conventional method. FIG. 3 is a state diagram of a subsequent insulator layer. In the figure, 1 is a green sheet, 2 is a through ball, 3 is a conductor paste, 4 is a conductor pattern, 5 is a printed circuit board forming member, 21 is a conductor crystal grain, and 22 is an MgO crystal. Chi-editinyamasu
Claims (2)
ト状に成形した絶縁シート（１）にスルーホール（２）
を設け、該スルーホール（２）内に導電体ペースト（３
）を充填するとともに、前記絶縁シート（１）上に導電
体ペーストを塗布して所定の導電体パターン（４）を形
成したプリント基板形成部材（５）を多層構造に積層後
、焼成する多層セラミックプリント基板の製造に於いて
、 前記プリント基板形成部材（５）の焼成時に、前記導電
体の結晶粒（２１）が結合する際に発生するクローズド
ポアの発生防止剤（２２）を、前記導電体ペースト（３
）中に予め添加することを特徴とする多層セラミックプ
リント基板の製造方法。(1) Through holes (2) are formed in an insulating sheet (1) formed into a sheet after kneading alumina and glass powder with an organic solvent.
A conductive paste (3) is provided in the through hole (2).
), and a printed circuit board forming member (5) in which a conductive paste is applied on the insulating sheet (1) to form a predetermined conductive pattern (4) is laminated in a multilayer structure and then fired. In the production of a printed circuit board, when the printed circuit board forming member (5) is fired, an agent (22) for preventing the occurrence of closed pores, which is generated when the crystal grains (21) of the conductor are combined, is added to the conductor. Paste (3
) A method for producing a multilayer ceramic printed circuit board, characterized in that the material is added in advance.
マグネシウム、或いは周期律表で第II族、および第III
族の金属元素の化合物であることを特徴とする特許請求
の範囲第１項に記載の多層セラミックプリント基板の製
造方法。(2) The closed pore generation inhibitor (22) is magnesium oxide, or a group II or III group in the periodic table.
2. The method for manufacturing a multilayer ceramic printed circuit board according to claim 1, wherein the multilayer ceramic printed circuit board is a compound of a group metal element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2590688A JPH01201996A (en) | 1988-02-05 | 1988-02-05 | Manufacture of multi-layer ceramic printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2590688A JPH01201996A (en) | 1988-02-05 | 1988-02-05 | Manufacture of multi-layer ceramic printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01201996A true JPH01201996A (en) | 1989-08-14 |
Family
ID=12178827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2590688A Pending JPH01201996A (en) | 1988-02-05 | 1988-02-05 | Manufacture of multi-layer ceramic printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01201996A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5287620A (en) * | 1991-06-18 | 1994-02-22 | Fujitsu Limited | Process of producing multiple-layer glass-ceramic circuit board |
| JP2002261411A (en) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | Ceramic wiring board and method of manufacturing the same |
-
1988
- 1988-02-05 JP JP2590688A patent/JPH01201996A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5287620A (en) * | 1991-06-18 | 1994-02-22 | Fujitsu Limited | Process of producing multiple-layer glass-ceramic circuit board |
| JP2002261411A (en) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | Ceramic wiring board and method of manufacturing the same |
| JP4627903B2 (en) * | 2001-02-27 | 2011-02-09 | 京セラ株式会社 | Ceramic wiring board and manufacturing method thereof |
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