JPH01173995U - - Google Patents
Info
- Publication number
- JPH01173995U JPH01173995U JP7010388U JP7010388U JPH01173995U JP H01173995 U JPH01173995 U JP H01173995U JP 7010388 U JP7010388 U JP 7010388U JP 7010388 U JP7010388 U JP 7010388U JP H01173995 U JPH01173995 U JP H01173995U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- connection mechanism
- parallel wiring
- parallel
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａはこの考案の電子機器の冷却装置を示
す平面図、第１図ｂはその部分拡大平面図、第２
図ａは従来の電子機器の冷却装置を示す平面図、
第２図ｂはその部分拡大平面図である。
なお図中１は筐体、３は電子部品、４は接続機
構、４ｂは形状記憶合金板、６は冷起空気、イ，
ロは配線板群である。その他図中同一符号は同一
部分を示すものとする。
FIG. 1a is a plan view showing the cooling device for electronic equipment of this invention, FIG. 1b is a partially enlarged plan view thereof, and FIG.
Figure a is a plan view showing a conventional cooling device for electronic equipment;
FIG. 2b is a partially enlarged plan view thereof. In the figure, 1 is a housing, 3 is an electronic component, 4 is a connection mechanism, 4b is a shape memory alloy plate, 6 is a refrigerated air, A,
B is a group of wiring boards. In other figures, the same reference numerals indicate the same parts.
Claims (1)
通る強制冷却空気の流れ方向に多段状態に当該筐
体内に設け、これら両並設配線板群の間に双方の
通風路の接続機構を介在させたものにおいて、上
記接続機構をその入口側空気温度に応じてそれぞ
れ独自に変形する並設形状記憶合金板の組合わせ
で構成したことを特徴とする電子機器の冷却装置
。 A group of parallel wiring boards with electronic components mounted thereon is provided in the housing in a multi-tiered manner in the flow direction of forced cooling air passing through the housing, and a connection mechanism for both ventilation paths is provided between these two parallel wiring board groups. A cooling device for an electronic device, characterized in that the connection mechanism is constructed by a combination of parallel shape memory alloy plates each deforming independently according to the temperature of the air on the inlet side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7010388U JPH01173995U (en) | 1988-05-27 | 1988-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7010388U JPH01173995U (en) | 1988-05-27 | 1988-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173995U true JPH01173995U (en) | 1989-12-11 |
Family
ID=31295362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7010388U Pending JPH01173995U (en) | 1988-05-27 | 1988-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173995U (en) |
-
1988
- 1988-05-27 JP JP7010388U patent/JPH01173995U/ja active Pending
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