JPH01171024U - - Google Patents
Info
- Publication number
- JPH01171024U JPH01171024U JP6660488U JP6660488U JPH01171024U JP H01171024 U JPH01171024 U JP H01171024U JP 6660488 U JP6660488 U JP 6660488U JP 6660488 U JP6660488 U JP 6660488U JP H01171024 U JPH01171024 U JP H01171024U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- circuit board
- printed circuit
- immersed
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6660488U JPH01171024U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6660488U JPH01171024U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-20 | 1988-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171024U true JPH01171024U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-12-04 |
Family
ID=31292003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6660488U Pending JPH01171024U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-20 | 1988-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171024U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010272637A (ja) * | 2009-05-20 | 2010-12-02 | Cosel Co Ltd | 電子部品の取付構造とその取付方法 |
| JP2013105893A (ja) * | 2011-11-14 | 2013-05-30 | Shindengen Electric Mfg Co Ltd | 電子部品実装モジュールの製造方法および電子部品実装モジュール |
| JPWO2012098573A1 (ja) * | 2011-01-18 | 2014-06-09 | 三菱電機株式会社 | プリント基板および加速度検出装置 |
| US9730334B2 (en) | 2015-04-28 | 2017-08-08 | Fanuc Corporation | Mounting structure of leaded electronic component which reduces occurrence of blow hole |
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58456B2 (ja) * | 1974-08-30 | 1983-01-06 | ジェイエスアール株式会社 | ナンネンセイタイシヨウゲキセイジユシ ノ セイゾウホウホウ |
| JPS583031B2 (ja) * | 1980-10-14 | 1983-01-19 | 工業技術院長 | ホウ化物被覆金属の製造方法 |
| JPS6237960B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1982-04-08 | 1987-08-14 | Toyo Boseki |
-
1988
- 1988-05-20 JP JP6660488U patent/JPH01171024U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58456B2 (ja) * | 1974-08-30 | 1983-01-06 | ジェイエスアール株式会社 | ナンネンセイタイシヨウゲキセイジユシ ノ セイゾウホウホウ |
| JPS583031B2 (ja) * | 1980-10-14 | 1983-01-19 | 工業技術院長 | ホウ化物被覆金属の製造方法 |
| JPS6237960B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1982-04-08 | 1987-08-14 | Toyo Boseki |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010272637A (ja) * | 2009-05-20 | 2010-12-02 | Cosel Co Ltd | 電子部品の取付構造とその取付方法 |
| JPWO2012098573A1 (ja) * | 2011-01-18 | 2014-06-09 | 三菱電機株式会社 | プリント基板および加速度検出装置 |
| JP2013105893A (ja) * | 2011-11-14 | 2013-05-30 | Shindengen Electric Mfg Co Ltd | 電子部品実装モジュールの製造方法および電子部品実装モジュール |
| US9730334B2 (en) | 2015-04-28 | 2017-08-08 | Fanuc Corporation | Mounting structure of leaded electronic component which reduces occurrence of blow hole |
| DE102016107597B4 (de) * | 2015-04-28 | 2019-08-14 | Fanuc Corporation | Aufbau zur Anbringung einer mit Leitungen versehenen elektronischen Komponente |
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
| US10984949B2 (en) | 2017-11-21 | 2021-04-20 | Fanuc Corporation | Resin molded substrate and mounting structure for capacitor |