JPH01167052U - - Google Patents

Info

Publication number
JPH01167052U
JPH01167052U JP1988063301U JP6330188U JPH01167052U JP H01167052 U JPH01167052 U JP H01167052U JP 1988063301 U JP1988063301 U JP 1988063301U JP 6330188 U JP6330188 U JP 6330188U JP H01167052 U JPH01167052 U JP H01167052U
Authority
JP
Japan
Prior art keywords
ceramic substrate
portions
width
end surface
step portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988063301U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451485Y2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063301U priority Critical patent/JPH0451485Y2/ja
Publication of JPH01167052U publication Critical patent/JPH01167052U/ja
Application granted granted Critical
Publication of JPH0451485Y2 publication Critical patent/JPH0451485Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP1988063301U 1988-05-16 1988-05-16 Expired JPH0451485Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (ko) 1988-05-16 1988-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (ko) 1988-05-16 1988-05-16

Publications (2)

Publication Number Publication Date
JPH01167052U true JPH01167052U (ko) 1989-11-22
JPH0451485Y2 JPH0451485Y2 (ko) 1992-12-03

Family

ID=31288809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063301U Expired JPH0451485Y2 (ko) 1988-05-16 1988-05-16

Country Status (1)

Country Link
JP (1) JPH0451485Y2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268447U (ko) * 1988-11-11 1990-05-24
JP2012119533A (ja) * 2010-12-01 2012-06-21 Murata Mfg Co Ltd セラミック多層基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
JPS5750062A (en) * 1980-09-09 1982-03-24 Toshiba Corp Magnetic disk controller

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
JPS5750062A (en) * 1980-09-09 1982-03-24 Toshiba Corp Magnetic disk controller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268447U (ko) * 1988-11-11 1990-05-24
JP2012119533A (ja) * 2010-12-01 2012-06-21 Murata Mfg Co Ltd セラミック多層基板

Also Published As

Publication number Publication date
JPH0451485Y2 (ko) 1992-12-03

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