JPH01165699U - - Google Patents

Info

Publication number
JPH01165699U
JPH01165699U JP6125188U JP6125188U JPH01165699U JP H01165699 U JPH01165699 U JP H01165699U JP 6125188 U JP6125188 U JP 6125188U JP 6125188 U JP6125188 U JP 6125188U JP H01165699 U JPH01165699 U JP H01165699U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
insulating resin
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6125188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6125188U priority Critical patent/JPH01165699U/ja
Publication of JPH01165699U publication Critical patent/JPH01165699U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の一実施例による混成集積回
路装置の断面図、第2図、第3図はこの考案の他
の実施例を示す断面図、第4図は従来の混成集積
回路装置を示す断面図である。 1……セラミツク基板、2……導電部、3……
電子部品、4……電極、5……絶縁樹脂、6……
導電物質、なお、図中同一符号は同一、又は相当
部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク基板上に電子部品を実装半田付し電
    極を備え、絶縁樹脂コートされた混成集積回路装
    置に於て、上記絶縁樹脂コート上に導電物質でコ
    ートしたことを特徴とする混成集積回路装置。
JP6125188U 1988-05-09 1988-05-09 Pending JPH01165699U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6125188U JPH01165699U (ja) 1988-05-09 1988-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6125188U JPH01165699U (ja) 1988-05-09 1988-05-09

Publications (1)

Publication Number Publication Date
JPH01165699U true JPH01165699U (ja) 1989-11-20

Family

ID=31286926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6125188U Pending JPH01165699U (ja) 1988-05-09 1988-05-09

Country Status (1)

Country Link
JP (1) JPH01165699U (ja)

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