JPH01165649U - - Google Patents
Info
- Publication number
- JPH01165649U JPH01165649U JP1988063106U JP6310688U JPH01165649U JP H01165649 U JPH01165649 U JP H01165649U JP 1988063106 U JP1988063106 U JP 1988063106U JP 6310688 U JP6310688 U JP 6310688U JP H01165649 U JPH01165649 U JP H01165649U
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- sealing
- insulator
- package
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063106U JPH01165649U (de) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063106U JPH01165649U (de) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165649U true JPH01165649U (de) | 1989-11-20 |
Family
ID=31288635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063106U Pending JPH01165649U (de) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165649U (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758232A (ja) * | 1993-08-12 | 1995-03-03 | Nec Corp | ガラス封止型ｉｃパッケージ |
| JPH09199622A (ja) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | 電子部品パッケージ用金属製リッド基板、金属製リッド及びその製造方法 |
| WO2007094284A1 (ja) * | 2006-02-15 | 2007-08-23 | Neomax Materials Co., Ltd. | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |
| JP2015073027A (ja) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |
-
1988
- 1988-05-12 JP JP1988063106U patent/JPH01165649U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758232A (ja) * | 1993-08-12 | 1995-03-03 | Nec Corp | ガラス封止型ｉｃパッケージ |
| JPH09199622A (ja) * | 1996-01-18 | 1997-07-31 | Ngk Spark Plug Co Ltd | 電子部品パッケージ用金属製リッド基板、金属製リッド及びその製造方法 |
| WO2007094284A1 (ja) * | 2006-02-15 | 2007-08-23 | Neomax Materials Co., Ltd. | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |
| JPWO2007094284A1 (ja) * | 2006-02-15 | 2009-07-09 | 株式会社Ｎｅｏｍａｘマテリアル | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |
| US7790988B2 (en) | 2006-02-15 | 2010-09-07 | Neomax Materials Co., Ltd. | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap |
| JP4630338B2 (ja) * | 2006-02-15 | 2011-02-09 | 株式会社Ｎｅｏｍａｘマテリアル | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |
| JP2015073027A (ja) * | 2013-10-03 | 2015-04-16 | 日立金属株式会社 | 気密封止用キャップ、電子部品収納用パッケージおよび気密封止用キャップの製造方法 |