JPH01165641U - - Google Patents
Info
- Publication number
- JPH01165641U JPH01165641U JP1988061374U JP6137488U JPH01165641U JP H01165641 U JPH01165641 U JP H01165641U JP 1988061374 U JP1988061374 U JP 1988061374U JP 6137488 U JP6137488 U JP 6137488U JP H01165641 U JPH01165641 U JP H01165641U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- face
- bumps
- down bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061374U JPH01165641U (enExample) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061374U JPH01165641U (enExample) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165641U true JPH01165641U (enExample) | 1989-11-20 |
Family
ID=31287047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061374U Pending JPH01165641U (enExample) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165641U (enExample) |
-
1988
- 1988-05-10 JP JP1988061374U patent/JPH01165641U/ja active Pending