JPH01165632U - - Google Patents

Info

Publication number
JPH01165632U
JPH01165632U JP6195288U JP6195288U JPH01165632U JP H01165632 U JPH01165632 U JP H01165632U JP 6195288 U JP6195288 U JP 6195288U JP 6195288 U JP6195288 U JP 6195288U JP H01165632 U JPH01165632 U JP H01165632U
Authority
JP
Japan
Prior art keywords
chip
mounts
base surface
stem
mount base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6195288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6195288U priority Critical patent/JPH01165632U/ja
Publication of JPH01165632U publication Critical patent/JPH01165632U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP6195288U 1988-05-11 1988-05-11 Pending JPH01165632U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6195288U JPH01165632U (de) 1988-05-11 1988-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6195288U JPH01165632U (de) 1988-05-11 1988-05-11

Publications (1)

Publication Number Publication Date
JPH01165632U true JPH01165632U (de) 1989-11-20

Family

ID=31287589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6195288U Pending JPH01165632U (de) 1988-05-11 1988-05-11

Country Status (1)

Country Link
JP (1) JPH01165632U (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027841A (ja) * 2008-07-18 2010-02-04 Precise Gauges Co Ltd 電子部品装着装置
CN102858094A (zh) * 2011-06-28 2013-01-02 住友电气工业株式会社 安装方法、安装装置及安装夹具

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027841A (ja) * 2008-07-18 2010-02-04 Precise Gauges Co Ltd 電子部品装着装置
CN102858094A (zh) * 2011-06-28 2013-01-02 住友电气工业株式会社 安装方法、安装装置及安装夹具
JP2013010156A (ja) * 2011-06-28 2013-01-17 Sumitomo Electric Ind Ltd 実装方法、実装装置、および実装治具

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