JPH01165167U - - Google Patents

Info

Publication number
JPH01165167U
JPH01165167U JP6161988U JP6161988U JPH01165167U JP H01165167 U JPH01165167 U JP H01165167U JP 6161988 U JP6161988 U JP 6161988U JP 6161988 U JP6161988 U JP 6161988U JP H01165167 U JPH01165167 U JP H01165167U
Authority
JP
Japan
Prior art keywords
electronic component
pair
iron parts
soldering device
lead terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6161988U
Other languages
Japanese (ja)
Other versions
JPH0641726Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988061619U priority Critical patent/JPH0641726Y2/en
Publication of JPH01165167U publication Critical patent/JPH01165167U/ja
Application granted granted Critical
Publication of JPH0641726Y2 publication Critical patent/JPH0641726Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の原理構成を示す正面図、第２
図はこて部が移動する様子を上から見た平面図、
第３図は本考案の一実施例を部分断面で示す正面
図、第４図は本考案の一実施例を示す平面図、第
５図は水平ガイド軸が上下ガイド孔を移動する様
子を示す部分側面図、第６図は半田付けが完了し
た状態を示す正面図、第７図はこて部の変形例を
示す平面図、第８図は従来のリード端子の半田付
け具を示す斜視図である。 １……電子部品半田付装置、１０，１０′……
一対のこて部、１４……加熱部、２０……水平対
称移動部、２２……ホルダ、２４……水平ガイド
軸、３０……押圧部、３１……押圧棒、３２……
押圧力印加部、３６……係合部、７０……電子部
品、７５，７５′……端子、８０……基板。 Figure 1 is a front view showing the principle configuration of the present invention, Figure 2
The figure is a plan view from above showing how the iron part moves.
Fig. 3 is a front view showing an embodiment of the present invention in partial cross section, Fig. 4 is a plan view showing an embodiment of the invention, and Fig. 5 shows how the horizontal guide shaft moves through the upper and lower guide holes. A partial side view, FIG. 6 is a front view showing a state in which soldering is completed, FIG. 7 is a plan view showing a modified example of the iron part, and FIG. 8 is a perspective view showing a conventional soldering tool for lead terminals. It is. 1... Electronic component soldering device, 10, 10'...
A pair of iron parts, 14... Heating part, 20... Horizontal symmetrical moving part, 22... Holder, 24... Horizontal guide shaft, 30... Pressing part, 31... Pressing rod, 32...
Pressing force applying section, 36... engaging section, 70... electronic component, 75, 75'... terminal, 80... board.

Claims (1)

【実用新案登録請求の範囲】 １ 複数のリード端子７５，７５′を有する電子
部品７０を基板８０の所定面上に固定する電子部
品半田付装置であつて、 前記所定面に前記リード端子７５，７５′を半
田付けする少なくとも一対のこて部１０，１０′
と、 該一対のこて部１０，１０′を前記電子部品７
０に向かつて水平方向に移動自在に押圧する押圧
部３０と、 前記一対のこて部１０，１０′を前記リード端
子７５，７５′に沿つてそれぞれ水平方向に前記
電子部品７０を中心として対称に移動させる水平
対称移動部２０とからなることを特徴とする電子
部品半田付装置。 ２ 前記押圧部３０はテーパを有し、前記水平対
称移動部２０は前記一対のこて部１０，１０′を
支持するホルダ２２を有しており、前記テーパは
、前記ホルダ２２を外方に向かつて水平方向に移
動するように押圧する請求項１記載の電子部品半
田付装置。[Claims for Utility Model Registration] 1. An electronic component soldering device for fixing an electronic component 70 having a plurality of lead terminals 75, 75' on a predetermined surface of a board 80, the lead terminals 75, 75' on the predetermined surface. At least one pair of iron parts 10, 10' for soldering 75'
and the pair of soldering iron parts 10, 10' to the electronic component 7.
0, and the pair of iron parts 10, 10' are moved horizontally along the lead terminals 75, 75', respectively, symmetrically with respect to the electronic component 70. 1. An electronic component soldering device characterized by comprising a horizontally symmetrical moving section 20 that moves the electronic components. 2. The pressing part 30 has a taper, the horizontally symmetrical moving part 20 has a holder 22 that supports the pair of iron parts 10, 10', and the taper allows the holder 22 to move outward. 2. The electronic component soldering device according to claim 1, wherein the electronic component soldering device is pressed so as to move in a horizontal direction.
JP1988061619U 1988-05-12 1988-05-12 Electronic component soldering equipment Expired - Lifetime JPH0641726Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061619U JPH0641726Y2 (en) 1988-05-12 1988-05-12 Electronic component soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061619U JPH0641726Y2 (en) 1988-05-12 1988-05-12 Electronic component soldering equipment

Publications (2)

Publication Number Publication Date
JPH01165167U true JPH01165167U (en) 1989-11-17
JPH0641726Y2 JPH0641726Y2 (en) 1994-11-02

Family

ID=31287277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061619U Expired - Lifetime JPH0641726Y2 (en) 1988-05-12 1988-05-12 Electronic component soldering equipment

Country Status (1)

Country Link
JP (1) JPH0641726Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052099A (en) * 1983-08-31 1985-03-23 日本電気ホームエレクトロニクス株式会社 Automatically mounting device of part
JPS6352762A (en) * 1986-04-09 1988-03-05 Apollo Seiko Kk Solidering method for alignment terminal part and its automatic soldering device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052099A (en) * 1983-08-31 1985-03-23 日本電気ホームエレクトロニクス株式会社 Automatically mounting device of part
JPS6352762A (en) * 1986-04-09 1988-03-05 Apollo Seiko Kk Solidering method for alignment terminal part and its automatic soldering device

Also Published As

Publication number Publication date
JPH0641726Y2 (en) 1994-11-02

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