JPH01163365U - - Google Patents
Info
- Publication number
- JPH01163365U JPH01163365U JP1988058758U JP5875888U JPH01163365U JP H01163365 U JPH01163365 U JP H01163365U JP 1988058758 U JP1988058758 U JP 1988058758U JP 5875888 U JP5875888 U JP 5875888U JP H01163365 U JPH01163365 U JP H01163365U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wire bonding
- reinforcing
- bonding position
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988058758U JPH0739255Y2 (ja) | 1988-04-30 | 1988-04-30 | ワイヤボンディングを行う両面フレキシブル基板の構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988058758U JPH0739255Y2 (ja) | 1988-04-30 | 1988-04-30 | ワイヤボンディングを行う両面フレキシブル基板の構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01163365U true JPH01163365U (cg-RX-API-DMAC10.html) | 1989-11-14 |
| JPH0739255Y2 JPH0739255Y2 (ja) | 1995-09-06 |
Family
ID=31284556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988058758U Expired - Lifetime JPH0739255Y2 (ja) | 1988-04-30 | 1988-04-30 | ワイヤボンディングを行う両面フレキシブル基板の構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739255Y2 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05118936A (ja) * | 1991-10-25 | 1993-05-14 | Yamatake Honeywell Co Ltd | 薄膜ダイアフラム |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033347A (ja) * | 2000-07-17 | 2002-01-31 | Rohm Co Ltd | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6020058A (ja) * | 1983-07-13 | 1985-02-01 | Hitachi Chem Co Ltd | 集熱面の処理方法 |
-
1988
- 1988-04-30 JP JP1988058758U patent/JPH0739255Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6020058A (ja) * | 1983-07-13 | 1985-02-01 | Hitachi Chem Co Ltd | 集熱面の処理方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05118936A (ja) * | 1991-10-25 | 1993-05-14 | Yamatake Honeywell Co Ltd | 薄膜ダイアフラム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739255Y2 (ja) | 1995-09-06 |