JPH01162237U - - Google Patents

Info

Publication number
JPH01162237U
JPH01162237U JP5604388U JP5604388U JPH01162237U JP H01162237 U JPH01162237 U JP H01162237U JP 5604388 U JP5604388 U JP 5604388U JP 5604388 U JP5604388 U JP 5604388U JP H01162237 U JPH01162237 U JP H01162237U
Authority
JP
Japan
Prior art keywords
view
sectional
showing
present
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5604388U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5604388U priority Critical patent/JPH01162237U/ja
Publication of JPH01162237U publication Critical patent/JPH01162237U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8336—Bonding interfaces of the semiconductor or solid state body
    • H01L2224/83365—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5604388U 1988-04-26 1988-04-26 Pending JPH01162237U (uk)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5604388U JPH01162237U (uk) 1988-04-26 1988-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5604388U JPH01162237U (uk) 1988-04-26 1988-04-26

Publications (1)

Publication Number Publication Date
JPH01162237U true JPH01162237U (uk) 1989-11-10

Family

ID=31281930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5604388U Pending JPH01162237U (uk) 1988-04-26 1988-04-26

Country Status (1)

Country Link
JP (1) JPH01162237U (uk)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128169A (ja) * 2004-10-26 2006-05-18 Fujitsu Ltd 半導体装置及び半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834932A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834932A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128169A (ja) * 2004-10-26 2006-05-18 Fujitsu Ltd 半導体装置及び半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JPH01162237U (uk)
JPS63142855U (uk)
JPS62178532U (uk)
JPS58440U (ja) プラスチツクパツケ−ジ
JPS6033452U (ja) 樹脂封止型半導体装置
JPS60130649U (ja) 樹脂封止型半導体装置
JPS60149137U (ja) 樹脂封止型半導体装置
JPS6073243U (ja) 樹脂封止形半導体装置
JPH01107157U (uk)
JPS635634U (uk)
JPS6447058U (uk)
JPH0328757U (uk)
JPS62122359U (uk)
JPS594648U (ja) 樹脂封止型半導体装置
JPH0312429U (uk)
JPH0254248U (uk)
JPH01104720U (uk)
JPS63108641U (uk)
JPH02146437U (uk)
JPH01120343U (uk)
JPH0165142U (uk)
JPH0444145U (uk)
JPS6387843U (uk)
JPH0373455U (uk)
JPS62126835U (uk)