JPH01152138A - 印刷回路用積層板の製造方法 - Google Patents
印刷回路用積層板の製造方法Info
- Publication number
- JPH01152138A JPH01152138A JP30965987A JP30965987A JPH01152138A JP H01152138 A JPH01152138 A JP H01152138A JP 30965987 A JP30965987 A JP 30965987A JP 30965987 A JP30965987 A JP 30965987A JP H01152138 A JPH01152138 A JP H01152138A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- varnish
- laminate
- intermediate layer
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 32
- 229920000647 polyepoxide Polymers 0.000 abstract description 32
- 239000011521 glass Substances 0.000 abstract description 27
- 239000002966 varnish Substances 0.000 abstract description 15
- 239000010410 layer Substances 0.000 abstract description 13
- 239000011256 inorganic filler Substances 0.000 abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 11
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 9
- 239000004593 Epoxy Substances 0.000 abstract description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 8
- 239000002344 surface layer Substances 0.000 abstract description 8
- 239000004744 fabric Substances 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 5
- 150000004984 aromatic diamines Chemical class 0.000 abstract description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract description 3
- 239000004843 novolac epoxy resin Substances 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- 239000002131 composite material Substances 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 239000004745 nonwoven fabric Substances 0.000 description 8
- 239000002759 woven fabric Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910001679 gibbsite Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000004682 monohydrates Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000004684 trihydrates Chemical class 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 241000221035 Santalaceae Species 0.000 description 1
- 235000008632 Santalum album Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001680 bayerite Inorganic materials 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910001682 nordstrandite Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30965987A JPH01152138A (ja) | 1987-12-09 | 1987-12-09 | 印刷回路用積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30965987A JPH01152138A (ja) | 1987-12-09 | 1987-12-09 | 印刷回路用積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152138A true JPH01152138A (ja) | 1989-06-14 |
| JPH0360862B2 JPH0360862B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-18 |
Family
ID=17995717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30965987A Granted JPH01152138A (ja) | 1987-12-09 | 1987-12-09 | 印刷回路用積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152138A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08276532A (ja) * | 1995-04-03 | 1996-10-22 | Toshiba Chem Corp | ガラスエポキシ銅張積層板 |
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| JP2000025155A (ja) * | 1998-07-10 | 2000-01-25 | Shin Kobe Electric Mach Co Ltd | コンポジット金属箔張り積層板 |
| JP2001253929A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、これを用いたプリプレグ及び積層板 |
-
1987
- 1987-12-09 JP JP30965987A patent/JPH01152138A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08276532A (ja) * | 1995-04-03 | 1996-10-22 | Toshiba Chem Corp | ガラスエポキシ銅張積層板 |
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| SG94696A1 (en) * | 1996-02-29 | 2003-03-18 | Sumitomo Bakelite Co | Laminated board and process for production thereof |
| KR100403649B1 (ko) * | 1996-02-29 | 2004-03-20 | 스미또모 베이크라이트 가부시키가이샤 | 적층판및그의제조방법 |
| JP2000025155A (ja) * | 1998-07-10 | 2000-01-25 | Shin Kobe Electric Mach Co Ltd | コンポジット金属箔張り積層板 |
| JP2001253929A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、これを用いたプリプレグ及び積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0360862B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-18 |