JPH01152013A - Cutting device - Google Patents

Abstract

PURPOSE:To shorten the time for cutting a column-shaped material in the shape of dice cubes by providing a plurality of music wires on a plane surface and running in parallel in the same direction at same speed and a plurality of music wires running in parallel in the direction square to said direction at same speed. CONSTITUTION:Abrasive grains are applied to music wires 31 running in the direction 41 and a wafer lamination 11 bonded with a jig 2 is started to cut. Then, the wafer lamination 11 is started for delayed cutting in the direction 42 by using music wires running in the direction 42 to cross the music wires 31, for instance, at 100mum value. In other words, at the time of starting cutting in the direction 42, the music wires 32, crossing square with the music wires 31 cutting into a topmost wafer 1 of a lamination by 100mum, are brought into contact with the upper surface of the wafer 1 to start cutting. Thus, a square column lamination of high pressure diode can be cut with good accuracy and the square column body never falls down during the cutting. The best state of the interval of the music wires 31 and 32 is approximately 100mum.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method for manufacturing high-voltage silicon diodes by cutting a cylindrical object such as a stacked and bonded semiconductor wafer into dice in two orthogonal directions. This invention relates to a cutting device for making a prismatic body.

[Conventional technology]

Cutting methods for dividing semiconductor wafers into chips include the diamond scribing method, in which the wafer is cut by making cuts with a diamond needle, the blade dicing method, in which the wafer is cut by rotating a diamond blade at high speed, and the wafer material is separated using laser light. There are laser scribing methods that cut by melting and evaporating. However, it is impossible to cut a cylindrical wafer stack having a length of approximately 100 mm into a prismatic shape using such a method, or even if it is possible, it takes a considerable amount of time. Therefore, conventionally, Fig. 2 1a
l ~ (as shown in dl, silicon wafers 1 on which impurities have been diffused to form a PN junction are stacked using M or the like to form a cylindrical body lO, which is fixed to a jig 2 with an adhesive (Figure a).
Using a wire saw consisting of a plurality of equally spaced piano wires 31 running parallel to the direction of the arrow 41 at the same speed, the jig 2 is moved relatively close to the piano wire 3 to cut it while keeping the abrasive grains flowing (Fig. b) As a result, the strips 11 as shown in FIG. C are lined up on the jig 2. Resin 5 is embedded in the gap between the strips 11 for reinforcement (Fig. d), and then cutting is performed in the direction 42 perpendicular to the piano wire 32 and the abrasive grains in the same manner as the cutting in the direction 41. Obtain a laminate (Figure e).

[Problem that the invention seeks to solve]

As shown in FIG. 2 (C1), if the resin 5 is not filled in the gap between the armrest strips 11, the piano wire 31 will be cut during cutting in the direction 42.
The rectangular body 11 falls down due to the force of the movement. Therefore, it becomes necessary to embed the resin. Furthermore, it is necessary to perform two cuts in directions 41° and 42°, and the cent of the jig relative to the wire saw must also be converted to 90″, resulting in a problem that the time required for cutting becomes longer.

An object of the present invention is to provide a cutting device that can shorten the time required to cut a columnar body into dice.

[Means for solving problems]

In order to achieve the above object, the cutting device of the present invention comprises:-
A plurality of piano wires that are on a plane and run parallel at the same speed in one direction, and a plurality of pianos that are on a parallel plane close to the plane and run parallel at the same speed in another direction perpendicular to the plane. It shall be equipped with a line.

[Effect]

The columnar body is cut parallel to one direction by applying abrasive grains to a plurality of piano wires running parallel to one direction, and then the piano wires running parallel to orthogonal directions on adjacent surfaces are applied with abrasive grains. Since it is applied with a delay due to the action of , the prismatic body created by cutting will not fall.

(Example) Figure 1 1al~ (C1 shows an example of the present invention,
Parts common to those in the figure are given the same reference numerals.

In Figure 1 1al, the direction 41 is the same as in Figure 2 (mountain).
Cutting of the wafer stack 11 bonded to the jig 2 is started by applying abrasive grains to the running piano wire 31. Next, piano wire 3
Cutting of the wafer stack 11 in the direction 42 is started with a delay using a piano wire running in the orthogonal direction 42 at intervals of 1 and 100 tna (Figure b), that is, the state at the start of cutting in the direction 42 is As shown in the cross section of Figure 1 (C1), when the piano wire 31 cuts 100 μ into the uppermost wafer l of the stack, the perpendicular piano wire 32 comes into contact with the upper surface of the wafer l and starts cutting. The prismatic stack of diodes could be cut with high precision, and the prismatic body did not fall during cutting.

If the orthogonal pianos m31.32 are placed too close together,
The best results were obtained with a width of about 100 n, since the piano wires would rub against each other, shortening their lifespan, and if the distance was too large, the object to be cut would shake, reducing cutting accuracy.

〔Effect of the invention〕

According to the present invention, by configuring the wire saw to run a plurality of piano wires parallel to each other at right angles on two planes having a narrow interval, and to cut while flowing abrasive grains, cutting in two directions is possible. can be performed almost simultaneously, cutting the time for cutting a columnar object in half, and eliminating the need to fill the cutting gap with resin or the like after cutting in the negative direction, and to rotate the support jig for the columnar object by 90°, especially when using a high-pressure die. This method was extremely effective in reducing the number of man-hours required for producing buds.

[Brief explanation of the drawing]

Figures 1+8) to (cl show cutting of a silicon wafer stack according to an embodiment of the present invention, (al, (bl) are perspective views sequentially showing the cutting process, (C1 is a sectional view at the initial stage of cutting, (a
l~tel indicates conventional wafer stack cutting, (al
, (b), (dl. tel is a perspective view sequentially showing the cutting process, and (C) is a perspective view taken out and showing the strip produced after the -th cutting. 11; Wafer stack, 31. 32; Piano Line, 41°4
2: Cutting direction. Figure 1 Figure 2

Claims (1)

[Claims] (1) A plurality of piano wires are on one plane and run parallel at the same speed in one direction, and a plurality of piano wires are on a parallel plane close to said plane and run parallel at the same speed in another direction perpendicular to said plane. A cutting device comprising a plurality of running piano wires.