JPH01108008A - Cutting of semiconducting wafers - Google Patents

Abstract

PURPOSE:To improve a productivity and make a cost-saving by piling up and fixing a plurality of semiconducting wafers, forming cut grooves from the uppermost section to the lowermost section and cutting a plurality of semiconducting wafers at the same time. CONSTITUTION:Semiconducting wafers 1 are piled up and fixed by using adhesive tapes 2. In this case, the cutting lines of each semiconducting wafers 1 are maintained to be aligned each other. Then, by forming cut grooves from the uppermost semiconducting wafer 1 to the lowermost one 1 with a diamond whetstone or a laser, semiconducting chips 4 are obtained. After cutting, the semiconducting chips 4 are taken out by stretching the lowermost adhesive tape 2, and widening the interval between the semiconducting chips 4 and the semiconducting chips 4 are put to use from one which is cut out from the lowermost semiconducting wafer 1. The adhesive tapes 2 remaining on the surface of the second lower and third lower semiconducting chips 4 are removed by using other highly adhesive tapes and peeling.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for cutting semiconductor wafers.A conventional technique will be explained with reference to FIG. Conventional techniques include a scribe method and a dicing method using a grindstone, but the dicing method will be explained here. First, Figure 2 (&
), a semiconductor wafer 21 is attached to an adhesive tape 22. Thereafter, cutting grooves 23 are formed using a dicing saw as shown in FIG.
0), the adhesive tape 22 is stretched to obtain a semiconductor chip 24.

Problems to be Solved by the Invention In the conventional example described above, since only one semiconductor wafer can be processed and it takes a very long time, there are the following problems.

(1) Particularly in the case of large-diameter semiconductor wafers, a time imbalance occurs with other processes such as a diffusion process and an etching process, and as a result, a large number of cutting devices are required.

@) Due to the above reasons, it is extremely expensive.

The present invention aims to improve productivity and reduce costs in the process of cutting semiconductor wafers.

Means for Solving the Problems The present invention solves the above problems by stacking a plurality of semiconductor wafers and cutting them simultaneously.

By stacking a plurality of working semiconductor wafers and cutting them simultaneously, productivity can be increased and costs can be reduced.

Example An embodiment of the present invention will be described with reference to FIG.

First, as shown in FIG. 1 (IL), semiconductor wafers 1 are stacked and fixed using adhesive tape 2. At this time, the cutting lines of each semiconductor wafer 1 are made to coincide. The alignment of the semiconductor wafer 1 can be easily performed with high precision by using pattern recognition. Next, Figure 1 (b
), a cutting groove 3 is formed from the uppermost semiconductor wafer 1 to the lowermost semiconductor wafer 1 using a diamond grindstone or a laser, and a semiconductor chip 4 is obtained.

The width of the cutting groove 3 is about 10 to 60 μm, and the forming speed of the cutting groove 3 is about 60 to 200 mu/sea. After cutting, the semiconductor chips 4 are taken out by stretching the lowermost adhesive tape 2 to widen the interval between the semiconductor chips 4, and then the semiconductor chips 4 cut from the uppermost semiconductor wafer 1 are used. Since the adhesive strength of the adhesive tape 1 is very weak, the semiconductor chip 4 can be easily removed using a vacuum collet or the like. The adhesive tape 2 remaining on the surface of the semiconductor chip 4 cut out from the second and third semiconductor wafers 1 from the front surface is removed by attaching another adhesive tape with strong adhesive strength and then peeling it 180 degrees. ,
The adhesive tape 2 on the semiconductor chip 4 can be easily removed. In this embodiment, an adhesive tape is used to fix the semiconductor wafer, but the adhesive tape is not limited to this, and adhesives, wax, etc. may also be used.

Effects of the Invention As described above, in the present invention, since multiple semiconductor wafers can be cut simultaneously, productivity is dramatically improved, and semiconductors can be obtained at extremely low cost even from large diameter semiconductor wafers. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of each step of a method according to an embodiment of the present invention, and FIG.
The figure is a process sectional view of a conventional method. 1... Semiconductor wafer, 2... Adhesive tape, 3... Cutting groove, 4... Semiconductor chip. Name of agent: Patent attorney Toshio Nakao and 1 other person22
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Claims (3)

[Claims] (1) A semiconductor wafer in which a plurality of semiconductor wafers are stacked and fixed, and a cutting groove is formed from the top semiconductor wafer to the bottom semiconductor wafer so that the plurality of semiconductor wafers can be cut simultaneously. cutting method. (2) The method for cutting semiconductor wafers according to claim 1, wherein a plurality of semiconductor wafers are fixed with adhesive or adhesive tape. (3) The method for cutting a semiconductor wafer according to claim 2, wherein the cutting grooves are formed using a grindstone or a laser.