JPH01143126U - - Google Patents

Info

Publication number
JPH01143126U
JPH01143126U JP1988039111U JP3911188U JPH01143126U JP H01143126 U JPH01143126 U JP H01143126U JP 1988039111 U JP1988039111 U JP 1988039111U JP 3911188 U JP3911188 U JP 3911188U JP H01143126 U JPH01143126 U JP H01143126U
Authority
JP
Japan
Prior art keywords
opening
frame
cover
frame holder
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988039111U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988039111U priority Critical patent/JPH01143126U/ja
Priority to US07/305,024 priority patent/US4938834A/en
Publication of JPH01143126U publication Critical patent/JPH01143126U/ja
Priority to US07/769,164 priority patent/US5162068A/en
Pending legal-status Critical Current

Links

Classifications

    • H10P72/0446
    • H10W72/07125
    • H10W72/07178
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1988039111U 1988-03-23 1988-03-23 Pending JPH01143126U (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1988039111U JPH01143126U (enExample) 1988-03-23 1988-03-23
US07/305,024 US4938834A (en) 1988-03-23 1989-02-02 Apparatus for preventing the oxidation of lead frames during bonding
US07/769,164 US5162068A (en) 1988-03-23 1991-09-30 Method for preventing oxidation of lead frame in bonding system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988039111U JPH01143126U (enExample) 1988-03-23 1988-03-23

Publications (1)

Publication Number Publication Date
JPH01143126U true JPH01143126U (enExample) 1989-10-02

Family

ID=12543970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988039111U Pending JPH01143126U (enExample) 1988-03-23 1988-03-23

Country Status (2)

Country Link
US (2) US4938834A (enExample)
JP (1) JPH01143126U (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5603892A (en) * 1994-06-09 1997-02-18 Fujitsu Limited System for maintaining a controlled atmosphere in an electronic circuit package
USD381940S (en) * 1996-05-13 1997-08-05 Burton Randy E Tail gate protector pad
JP4043495B2 (ja) * 2006-04-20 2008-02-06 株式会社カイジョー ワーククランプ及びワイヤボンディング装置
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices
CN107112248B (zh) * 2015-11-05 2021-07-27 古河电气工业株式会社 芯片接合装置以及芯片接合方法
EP4299231A1 (de) * 2022-06-29 2024-01-03 Sonplas GmbH Vorrichtung und verfahren zum beschneiden eines folienartigen werkstücks

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650042A (en) * 1969-05-19 1972-03-21 Ibm Gas barrier for interconnecting and isolating two atmospheres
US3652365A (en) * 1970-01-02 1972-03-28 William C Mallonee Gas injection apparatus
JPS58159739A (ja) * 1982-03-19 1983-09-22 オリンパス光学工業株式会社 レ−ザ手術装置
US4568277A (en) * 1983-12-20 1986-02-04 International Business Machines Corporation Apparatus for heating objects to and maintaining them at a desired temperature
EP0169574B1 (en) * 1984-07-27 1990-04-25 Kabushiki Kaisha Toshiba Apparatus for manufacturing semiconductor device
JPS62178533A (ja) * 1986-01-30 1987-08-05 Mitsui Toatsu Chem Inc ビスフエノ−ルの製造方法

Also Published As

Publication number Publication date
US4938834A (en) 1990-07-03
US5162068A (en) 1992-11-10

Similar Documents

Publication Publication Date Title
JPH01143126U (enExample)
JPS62183516U (enExample)
JPH0270450U (enExample)
JPS59160567U (ja) 練条機におけるフリ−スギヤザラ−
JPH0335066U (enExample)
JPH01174384U (enExample)
JPH02121194U (enExample)
JPS6371529U (enExample)
JPH02147471U (enExample)
JPH01122899U (enExample)
JPS5812535U (ja) 穀粒乾燥機の穀粒供給装置
JPS6352315U (enExample)
JPS62157138U (enExample)
JPH0295241U (enExample)
JPH02132956U (enExample)
JPS59159232U (ja) 下扱式脱穀機における扱室の排藁側構造
JPS63177677U (enExample)
JPS62180941U (enExample)
JPH02733U (enExample)
JPH0328731U (enExample)
JPS62122341U (enExample)
JPH0463130U (enExample)
JPH02106840U (enExample)
JPH026248U (enExample)
JPS6313609U (enExample)