JPH01143126U - - Google Patents

Info

Publication number
JPH01143126U
JPH01143126U JP1988039111U JP3911188U JPH01143126U JP H01143126 U JPH01143126 U JP H01143126U JP 1988039111 U JP1988039111 U JP 1988039111U JP 3911188 U JP3911188 U JP 3911188U JP H01143126 U JPH01143126 U JP H01143126U
Authority
JP
Japan
Prior art keywords
opening
frame
cover
frame holder
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988039111U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988039111U priority Critical patent/JPH01143126U/ja
Priority to US07/305,024 priority patent/US4938834A/en
Publication of JPH01143126U publication Critical patent/JPH01143126U/ja
Priority to US07/769,164 priority patent/US5162068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す断面図、第
２図はそのＤ部拡大断面図、第３図は従来装置の
斜視図、第４図はその部分断面図、第５図はその
Ａ部拡大断面図である。 図中、１はリードフレーム、２はチツプ、６は
フレーム押え、６ｄはスリツト、７はカバー、９
は継手、１０はパイプ、８０は第２の吐出口であ
る。なお、各図中同一符号は同一又は相当部分を
示す。 Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an enlarged sectional view of section D thereof, Fig. 3 is a perspective view of a conventional device, Fig. 4 is a partial sectional view thereof, and Fig. 5 is its It is an enlarged sectional view of part A. In the figure, 1 is a lead frame, 2 is a chip, 6 is a frame holder, 6d is a slit, 7 is a cover, 9
10 is a pipe, and 80 is a second discharge port. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレーム上のチツプに対向して開口した
第１の開口部を有し、上記リードフレームを押え
るフレーム押え、上記第１の開口部に対向して開
口した第２の開口部を有し、上記フレーム押えに
載置されて上記フレーム押えとの間に雰囲気ガス
が導入される空間を形成するカバーを備えたボン
デイング装置において、上記フレーム押えの上記
第１の開口部の周縁に形成され、上記フレーム押
え内に導入された雰囲気ガスを上記チツプ周辺に
吐出する第１の吐出口、上記フレーム押え又は上
記カバーに形成され、上記空間に導入された上記
雰囲気ガスを上記第２の開口部内で斜め上方向へ
吐出する第２の吐出口を備えたことを特徴とする
ボンデイング装置。 a first opening facing the chip on the lead frame; a frame holder for pressing the lead frame; a second opening facing the first opening; In the bonding apparatus, the cover is placed on the frame holder and forms a space between the frame holder and the atmosphere gas is introduced, the cover being formed on the periphery of the first opening of the frame holder; A first discharge port is formed in the frame presser or the cover to discharge the atmospheric gas introduced into the presser to the vicinity of the chip, and the atmospheric gas introduced into the space is discharged diagonally upward within the second opening. A bonding device characterized by comprising a second discharge port that discharges in the direction.
JP1988039111U 1988-03-23 1988-03-23 Pending JPH01143126U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1988039111U JPH01143126U (en) 1988-03-23 1988-03-23
US07/305,024 US4938834A (en) 1988-03-23 1989-02-02 Apparatus for preventing the oxidation of lead frames during bonding
US07/769,164 US5162068A (en) 1988-03-23 1991-09-30 Method for preventing oxidation of lead frame in bonding system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988039111U JPH01143126U (en) 1988-03-23 1988-03-23

Publications (1)

Publication Number Publication Date
JPH01143126U true JPH01143126U (en) 1989-10-02

Family

ID=12543970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988039111U Pending JPH01143126U (en) 1988-03-23 1988-03-23

Country Status (2)

Country Link
US (2) US4938834A (en)
JP (1) JPH01143126U (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5603892A (en) * 1994-06-09 1997-02-18 Fujitsu Limited System for maintaining a controlled atmosphere in an electronic circuit package
USD381940S (en) * 1996-05-13 1997-08-05 Burton Randy E Tail gate protector pad
JP4043495B2 (en) * 2006-04-20 2008-02-06 株式会社カイジョー Work clamp and wire bonding equipment
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices
WO2017077982A1 (en) * 2015-11-05 2017-05-11 古河電気工業株式会社 Die bonding device and die bonding method
EP4299231A1 (en) * 2022-06-29 2024-01-03 Sonplas GmbH Device and method for cutting a film-like workpiece

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650042A (en) * 1969-05-19 1972-03-21 Ibm Gas barrier for interconnecting and isolating two atmospheres
US3652365A (en) * 1970-01-02 1972-03-28 William C Mallonee Gas injection apparatus
JPS58159739A (en) * 1982-03-19 1983-09-22 オリンパス光学工業株式会社 Laser operation apparatus
US4568277A (en) * 1983-12-20 1986-02-04 International Business Machines Corporation Apparatus for heating objects to and maintaining them at a desired temperature
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
JPS62178533A (en) * 1986-01-30 1987-08-05 Mitsui Toatsu Chem Inc Production of bisphenol

Also Published As

Publication number Publication date
US4938834A (en) 1990-07-03
US5162068A (en) 1992-11-10

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