JPH01139440U - - Google Patents
Info
- Publication number
- JPH01139440U JPH01139440U JP3463388U JP3463388U JPH01139440U JP H01139440 U JPH01139440 U JP H01139440U JP 3463388 U JP3463388 U JP 3463388U JP 3463388 U JP3463388 U JP 3463388U JP H01139440 U JPH01139440 U JP H01139440U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- sealed
- signal system
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034633U JPH0726844Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988034633U JPH0726844Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01139440U true JPH01139440U (enrdf_load_stackoverflow) | 1989-09-22 |
JPH0726844Y2 JPH0726844Y2 (ja) | 1995-06-14 |
Family
ID=31261333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988034633U Expired - Lifetime JPH0726844Y2 (ja) | 1988-03-16 | 1988-03-16 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0726844Y2 (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0511480U (ja) * | 1991-07-24 | 1993-02-12 | 三洋電機株式会社 | 混成集積回路 |
JP2000091767A (ja) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | 半導体素子 |
WO2009090694A1 (ja) * | 2008-01-15 | 2009-07-23 | Panasonic Corporation | 回路基板モジュール及び電子機器 |
JP2020035939A (ja) * | 2018-08-31 | 2020-03-05 | アイシン精機株式会社 | 回路基板装置および回路基板装置のポッティング方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918470A (enrdf_load_stackoverflow) * | 1972-06-12 | 1974-02-18 | ||
JPS629730U (enrdf_load_stackoverflow) * | 1985-07-04 | 1987-01-21 |
-
1988
- 1988-03-16 JP JP1988034633U patent/JPH0726844Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918470A (enrdf_load_stackoverflow) * | 1972-06-12 | 1974-02-18 | ||
JPS629730U (enrdf_load_stackoverflow) * | 1985-07-04 | 1987-01-21 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0511480U (ja) * | 1991-07-24 | 1993-02-12 | 三洋電機株式会社 | 混成集積回路 |
JP2000091767A (ja) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | 半導体素子 |
WO2009090694A1 (ja) * | 2008-01-15 | 2009-07-23 | Panasonic Corporation | 回路基板モジュール及び電子機器 |
JP2020035939A (ja) * | 2018-08-31 | 2020-03-05 | アイシン精機株式会社 | 回路基板装置および回路基板装置のポッティング方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0726844Y2 (ja) | 1995-06-14 |