JPH01138698U - - Google Patents
Info
- Publication number
- JPH01138698U JPH01138698U JP3263888U JP3263888U JPH01138698U JP H01138698 U JPH01138698 U JP H01138698U JP 3263888 U JP3263888 U JP 3263888U JP 3263888 U JP3263888 U JP 3263888U JP H01138698 U JPH01138698 U JP H01138698U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing section
- hole processing
- hole
- small hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 5
Description
第１図は本考案に基づく基板分割装置の原理構
成を示す図、第２図は本考案による一加工例を示
す図、第３図は基板分割を説明する図である。
１……長孔加工部、２……大孔加工部、３……
小孔加工部、４……基板、５……単位基板。
FIG. 1 is a diagram showing the principle structure of a substrate dividing apparatus based on the present invention, FIG. 2 is a diagram showing an example of processing according to the present invention, and FIG. 3 is a diagram illustrating substrate dividing. 1...Long hole processing section, 2...Large hole processing section, 3...
Small hole processing section, 4... board, 5... unit board.
補正 昭６３．４．１５
考案の名称を次のように補正する。
考案の名称 基板の分割構造
実用新案登録請求の範囲、図面の簡単な説明を
次のように補正する。Amendment April 15, 1983 The name of the invention is amended as follows. Title of the invention Divided structure of the board The scope of the utility model registration claims and the brief description of the drawings are amended as follows.
【実用新案登録請求の範囲】
１ 基板１を分割して得られる単位基板２の周囲
に沿つて複数の接続部３を残して形成された長孔
ＨＬを有し、所定の部品が実装された基板の分割
構造であつて、
前記長孔ＨＬの先端に到達する大孔ＨＢを前記
接続部３に形成して前記基板１を前記単位基板２
に分割することを特徴とする基板の分割構造。
２ 前記接続部３には前記大孔ＨＢを形成するよ
うに案内し、かつ前記長孔ＨＬの先端に到達しな
い小孔ＨＳが形成されていることを特徴とする請
求項１記載の基板の分割構造。[Claims for Utility Model Registration] 1. A unit board 2 obtained by dividing the board 1 has a long hole HL formed along its periphery leaving a plurality of connecting parts 3 , and a predetermined component is mounted thereon. It is a divided structure of the substrate, in which a large hole HB reaching the tip of the long hole HL is formed in the connecting portion 3, and the substrate 1 is connected to the unit substrate 2.
A board dividing structure characterized by being divided into two parts . 2. Claim 1, wherein the connecting portion 3 is formed with a small hole HS that guides the large hole HB and does not reach the tip of the long hole HL. Divided structure of the described board .
【図面の簡単な説明】
第１図は本考案による基板の分割構造を示す図
、第２図は基板分割を説明する図である。
１……基板、２……単位基板、３……接続部、
ＨＬ……長孔、ＨＢ……大孔、ＨＳ……小孔。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a substrate dividing structure according to the present invention, and FIG. 2 is a diagram explaining the substrate dividing. 1... Board, 2... Unit board, 3... Connection part,
HL...Long hole, HB...Large hole, HS...Small hole.
Claims (1)
に沿つて四隅を残して仮分割する長孔ＨＬを形成
する長孔加工部１と、 前記長孔ＨＬの先端に到達する大孔ＨＢを前記
残した四隅に形成する大孔加工部２とからなるこ
とを特徴とする基板分割装置。 ２ 前記大孔加工部２は小孔加工部３を付加して
なり、 前記小孔加工部３は、前記四隅に前記大孔ＨＢ
を形成するように案内する小孔ＨＳを形成する請
求項１記載の基板分割装置。[Claims for Utility Model Registration] 1. A long hole processing section 1 for forming a long hole HL for temporary division along the periphery of a unit substrate 5 obtained by dividing a substrate 4, leaving four corners intact; A substrate dividing device comprising a large hole processing section 2 that forms large holes HB reaching the tip at the remaining four corners. 2. The large hole processing section 2 is formed by adding a small hole processing section 3, and the small hole processing section 3 has the large hole HB at the four corners.
2. The substrate dividing apparatus according to claim 1, wherein a small hole HS is formed to guide the substrate so as to form a small hole HS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263888U JPH01138698U (en) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263888U JPH01138698U (en) | 1988-03-14 | 1988-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01138698U true JPH01138698U (en) | 1989-09-21 |
Family
ID=31259187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3263888U Pending JPH01138698U (en) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01138698U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818724A (en) * | 2018-06-05 | 2018-11-16 | 江西旭昇电子有限公司 | Route panel forming method without location hole in cell board |
-
1988
- 1988-03-14 JP JP3263888U patent/JPH01138698U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108818724A (en) * | 2018-06-05 | 2018-11-16 | 江西旭昇电子有限公司 | Route panel forming method without location hole in cell board |
| CN108818724B (en) * | 2018-06-05 | 2020-06-05 | 江西旭昇电子有限公司 | Circuit board forming method without positioning holes in unit board |
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