JPH01137570U - - Google Patents
Info
- Publication number
- JPH01137570U JPH01137570U JP3278688U JP3278688U JPH01137570U JP H01137570 U JPH01137570 U JP H01137570U JP 3278688 U JP3278688 U JP 3278688U JP 3278688 U JP3278688 U JP 3278688U JP H01137570 U JPH01137570 U JP H01137570U
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- metal foil
- conductive metal
- adhesive
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図に示すＡ―Ａ線の断面図、第３図は第２図
に示す電気回路網２の構成を示す断面図、第４図
は第２図に示す電気部品４の実装を基に引かれた
パターン図である。
１……絶縁基板、２……電気回路網、３，７…
…二液性接着剤、４……電気部品、５……絶縁保
護剤、６……導電金属箔。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line A--A shown in FIG. 1, and FIG. 3 is a sectional view showing the configuration of the electric circuit network 2 shown in FIG. 2. , FIG. 4 is a pattern diagram drawn based on the mounting of the electrical component 4 shown in FIG. 2. 1... Insulating substrate, 2... Electric circuit network, 3, 7...
... Two-component adhesive, 4... Electrical component, 5... Insulating protective agent, 6... Conductive metal foil.
Claims (1)
れて前記絶縁基板に接着剤により貼り付けられ前
記電気部品の端子に接続される導電金属箔とを含
むことを特徴とする回路配線基板。 What is claimed is: 1. A circuit wiring board comprising two sheets of insulating protection material sandwiched between them and a conductive metal foil cut out and pasted on the insulating substrate with an adhesive and connected to the terminal of the electrical component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3278688U JPH01137570U (en) | 1988-03-11 | 1988-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3278688U JPH01137570U (en) | 1988-03-11 | 1988-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137570U true JPH01137570U (en) | 1989-09-20 |
Family
ID=31259360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3278688U Pending JPH01137570U (en) | 1988-03-11 | 1988-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137570U (en) |
-
1988
- 1988-03-11 JP JP3278688U patent/JPH01137570U/ja active Pending
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