JPH01135663U - - Google Patents
Info
- Publication number
- JPH01135663U JPH01135663U JP3173088U JP3173088U JPH01135663U JP H01135663 U JPH01135663 U JP H01135663U JP 3173088 U JP3173088 U JP 3173088U JP 3173088 U JP3173088 U JP 3173088U JP H01135663 U JPH01135663 U JP H01135663U
- Authority
- JP
- Japan
- Prior art keywords
- plated
- wiring board
- mounting terminal
- surface mounting
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000010970 precious metal Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3173088U JPH01135663U (un) | 1988-03-10 | 1988-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3173088U JPH01135663U (un) | 1988-03-10 | 1988-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135663U true JPH01135663U (un) | 1989-09-18 |
Family
ID=31257805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3173088U Pending JPH01135663U (un) | 1988-03-10 | 1988-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135663U (un) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11167944A (ja) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | 基板間接続用の半田ダム付きｉ／ｏピン |
| JP2008103351A (ja) * | 2000-10-25 | 2008-05-01 | Japan Aviation Electronics Industry Ltd | 電子部品およびその製法 |
| WO2021044778A1 (ja) * | 2019-09-05 | 2021-03-11 | 株式会社東海理化電機製作所 | 導電ユニット |
-
1988
- 1988-03-10 JP JP3173088U patent/JPH01135663U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11167944A (ja) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | 基板間接続用の半田ダム付きｉ／ｏピン |
| JP2008103351A (ja) * | 2000-10-25 | 2008-05-01 | Japan Aviation Electronics Industry Ltd | 電子部品およびその製法 |
| JP4599388B2 (ja) * | 2000-10-25 | 2010-12-15 | 日本航空電子工業株式会社 | 電子部品およびその製法 |
| WO2021044778A1 (ja) * | 2019-09-05 | 2021-03-11 | 株式会社東海理化電機製作所 | 導電ユニット |