JPH01133767U - - Google Patents
Info
- Publication number
- JPH01133767U JPH01133767U JP1822589U JP1822589U JPH01133767U JP H01133767 U JPH01133767 U JP H01133767U JP 1822589 U JP1822589 U JP 1822589U JP 1822589 U JP1822589 U JP 1822589U JP H01133767 U JPH01133767 U JP H01133767U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- mounted component
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係るプリント配線板の外観を
示す斜視図、第２図ａはそのＡ―Ａ断面図、同図
ｂは部品実装状態を示す断面図、第３図は本考案
に係るプリント配線板の製造工程を説明する図、
第４図はリード挿入用孔を覆う導電箔に穿設する
貫通孔形状の異つた実施例を示す図である。
３……配線パターン、４……リード挿入用孔、
５……導電箔に穿つた貫通孔、６……プリプレイ
グ、７……リード挿入用孔を覆う導電箔、８……
接着剤、１０，１２……実装部品のリード。
Fig. 1 is a perspective view showing the external appearance of a printed wiring board according to the present invention, Fig. 2 a is a cross-sectional view taken along line A-A, Fig. b is a cross-sectional view showing a state in which parts are mounted, and Fig. 3 is a cross-sectional view showing the printed wiring board according to the present invention. Diagrams explaining the manufacturing process of printed wiring boards,
FIG. 4 is a diagram showing a different embodiment of the shape of the through hole formed in the conductive foil covering the lead insertion hole. 3... Wiring pattern, 4... Lead insertion hole,
5... Through hole drilled in conductive foil, 6... Pre-preg, 7... Conductive foil covering lead insertion hole, 8...
Adhesive, 10, 12... Leads for mounted components.
Claims (1)
したプリプレイグの少なくとも前記孔を覆う位置
に付着した導電箔を前記孔の中心近傍に於いてロ
ーマ字のＹ状又はＺ状にて貫通し、斯くの如く加
工した複数枚のプレートを前記孔の位置を揃えて
接着剤にて積層固定することによつて前記孔に挿
入した実装部品リードを前記孔の周縁から突出す
る多数の導電箔縁部にて機械的に固定すると共に
電気的に接続するようにしたことを特徴とする無
半田接続プリント配線板。 A conductive foil adhered to at least a position covering the hole of a prepreg having a hole for inserting a mounted component lead in a predetermined position is penetrated in the shape of a Roman letter Y or Z near the center of the hole, and By stacking and fixing a plurality of plates processed in the same manner with adhesive with the holes aligned, the mounted component leads inserted into the holes are attached to the edges of a large number of conductive foils protruding from the periphery of the holes. A solderless connection printed wiring board characterized by being mechanically fixed and electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1822589U JPH01133767U (en) | 1989-02-17 | 1989-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1822589U JPH01133767U (en) | 1989-02-17 | 1989-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133767U true JPH01133767U (en) | 1989-09-12 |
Family
ID=31232678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1822589U Pending JPH01133767U (en) | 1989-02-17 | 1989-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133767U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323073A (en) * | 1976-08-17 | 1978-03-03 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of producing same |
| JPS5550698A (en) * | 1978-10-11 | 1980-04-12 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
-
1989
- 1989-02-17 JP JP1822589U patent/JPH01133767U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323073A (en) * | 1976-08-17 | 1978-03-03 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of producing same |
| JPS5550698A (en) * | 1978-10-11 | 1980-04-12 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0598914A4 (en) | Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board. | |
| JPH01133767U (en) | ||
| JPH03109368U (en) | ||
| JPH02129762U (en) | ||
| JPH0263593U (en) | ||
| JP3124543B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPS61161969U (en) | ||
| JPH0317664U (en) | ||
| JPS63100872U (en) | ||
| JPH0392071U (en) | ||
| JPS6389275U (en) | ||
| JPS6435775U (en) | ||
| JPS6357778U (en) | ||
| JPH0357U (en) | ||
| JPH02146867U (en) | ||
| JPH02125367U (en) | ||
| JPH01108989U (en) | ||
| JPH0459977U (en) | ||
| JPS63174484U (en) | ||
| JPH0217871U (en) | ||
| JPS60101774U (en) | Printed board | |
| JPS6273574U (en) | ||
| JPH0180972U (en) | ||
| JPS6294674U (en) | ||
| JPH02137066U (en) |