JPH01133755U - - Google Patents
Info
- Publication number
- JPH01133755U JPH01133755U JP1988029484U JP2948488U JPH01133755U JP H01133755 U JPH01133755 U JP H01133755U JP 1988029484 U JP1988029484 U JP 1988029484U JP 2948488 U JP2948488 U JP 2948488U JP H01133755 U JPH01133755 U JP H01133755U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diodes
- wiring
- wiring part
- emitting surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Description
第１図は本考案実施例の投光用発光ダイオード
アレイの斜視図、第２図ａは本考案に係る測距方
法の説明図、同図ｂ及びｃは光強度特性図である
。 １…発光ダイオード、１２…光放出面、２…電
極、２１…配線部、２２…細帯状部。
アレイの斜視図、第２図ａは本考案に係る測距方
法の説明図、同図ｂ及びｃは光強度特性図である
。 １…発光ダイオード、１２…光放出面、２…電
極、２１…配線部、２２…細帯状部。
Claims (1)
- 光放出面が整列するように配置された複数の発
光ダイオードと、該発光ダイオードの光放出面に
電流を供給する配線手段とを具備し、前記発光ダ
イオードの光放出面には隣接する発光ダイオード
に対向しない辺近傍に配線部を有し、その配線部
に連接し光放出面の略中央部に整列方向に平行に
設けられた細帯状部とを有した電極が設けられて
いる事を特徴とする投光用発光ダイオードアレイ
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029484U JPH01133755U (ja) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029484U JPH01133755U (ja) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133755U true JPH01133755U (ja) | 1989-09-12 |
Family
ID=31253741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988029484U Pending JPH01133755U (ja) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133755U (ja) |
-
1988
- 1988-03-04 JP JP1988029484U patent/JPH01133755U/ja active Pending