JPH01129841U - - Google Patents
Info
- Publication number
- JPH01129841U JPH01129841U JP1988025312U JP2531288U JPH01129841U JP H01129841 U JPH01129841 U JP H01129841U JP 1988025312 U JP1988025312 U JP 1988025312U JP 2531288 U JP2531288 U JP 2531288U JP H01129841 U JPH01129841 U JP H01129841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- resin
- heat dissipation
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025312U JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025312U JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129841U true JPH01129841U (enExample) | 1989-09-04 |
Family
ID=31245939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988025312U Pending JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129841U (enExample) |
-
1988
- 1988-02-26 JP JP1988025312U patent/JPH01129841U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01129841U (enExample) | ||
| JPS61158957U (enExample) | ||
| JPH0252393U (enExample) | ||
| JPH01139494U (enExample) | ||
| JPS614436U (ja) | 半導体装置用パツケ−ジ | |
| JPH01104736U (enExample) | ||
| JPH0217854U (enExample) | ||
| JPH0170393U (enExample) | ||
| JPS60124094U (ja) | 印刷配線基板 | |
| JPS625650U (enExample) | ||
| JPS5834743U (ja) | パワ−ダイオ−ドの実装構造 | |
| JPH0227759U (enExample) | ||
| JPS6037247U (ja) | トランジスタ放熱実装構造 | |
| JPS58175650U (ja) | 樹脂封止型半導体装置 | |
| JPH0379444U (enExample) | ||
| JPS6252943U (enExample) | ||
| JPS62131449U (enExample) | ||
| JPH01137542U (enExample) | ||
| JPH01133743U (enExample) | ||
| JPH02131395U (enExample) | ||
| JPH0233494U (enExample) | ||
| JPS5939942U (ja) | 発熱電子部品取付構造 | |
| JPS60169843U (ja) | 絶縁型半導体装置 | |
| JPH0455192U (enExample) | ||
| JPH0163194U (enExample) |