JPH01129841U - - Google Patents
Info
- Publication number
- JPH01129841U JPH01129841U JP1988025312U JP2531288U JPH01129841U JP H01129841 U JPH01129841 U JP H01129841U JP 1988025312 U JP1988025312 U JP 1988025312U JP 2531288 U JP2531288 U JP 2531288U JP H01129841 U JPH01129841 U JP H01129841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- resin
- heat dissipation
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025312U JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025312U JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129841U true JPH01129841U (enExample) | 1989-09-04 |
Family
ID=31245939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988025312U Pending JPH01129841U (enExample) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129841U (enExample) |
-
1988
- 1988-02-26 JP JP1988025312U patent/JPH01129841U/ja active Pending