JPH01104736U - - Google Patents
Info
- Publication number
- JPH01104736U JPH01104736U JP1988000409U JP40988U JPH01104736U JP H01104736 U JPH01104736 U JP H01104736U JP 1988000409 U JP1988000409 U JP 1988000409U JP 40988 U JP40988 U JP 40988U JP H01104736 U JPH01104736 U JP H01104736U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- semiconductor
- flush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000409U JPH01104736U (enExample) | 1988-01-05 | 1988-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000409U JPH01104736U (enExample) | 1988-01-05 | 1988-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104736U true JPH01104736U (enExample) | 1989-07-14 |
Family
ID=31199409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988000409U Pending JPH01104736U (enExample) | 1988-01-05 | 1988-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104736U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011155171A (ja) * | 2010-01-28 | 2011-08-11 | Denso Corp | 半導体モジュール |
-
1988
- 1988-01-05 JP JP1988000409U patent/JPH01104736U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011155171A (ja) * | 2010-01-28 | 2011-08-11 | Denso Corp | 半導体モジュール |