JPH01128882A - Portable medium - Google Patents
Portable mediumInfo
- Publication number
- JPH01128882A JPH01128882A JP62286476A JP28647687A JPH01128882A JP H01128882 A JPH01128882 A JP H01128882A JP 62286476 A JP62286476 A JP 62286476A JP 28647687 A JP28647687 A JP 28647687A JP H01128882 A JPH01128882 A JP H01128882A
- Authority
- JP
- Japan
- Prior art keywords
- card
- thickness
- filling plate
- wiring board
- outer enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000011800 void material Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
この発明は、例えばICカード等の携帯可能媒体に関す
る。Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to a portable medium such as an IC card.
(従来の技術)
携帯可能媒体をICカードに例をとって説明すると、I
Cカードは、外形枠にステンレス等製の1対の外板が取
付けられてカード状の外筺が構成され、この外筺に、C
PUやメモリを構成するLSIチップ及び液晶表示板(
以下LCDという)等を含む所要の電子部品が配線基板
に実装されて内装されている。上記電子部品のうらLC
Dの表示部は、その機能上、一方の外板に開口された窓
部から外部に表われるように内装されている。また外板
部には、リーダ・ライタ等の外部装置との所要データの
送受用等のコンタクトが設けられている。(Prior art) To explain a portable medium using an IC card as an example, I
A C card has a card-shaped outer casing with a pair of outer plates made of stainless steel or the like attached to an outer frame.
LSI chips and liquid crystal display boards (which make up PU and memory)
Necessary electronic components including an LCD (hereinafter referred to as an LCD) are mounted and installed on a wiring board. Behind the above electronic parts LC
The display section D is functionally installed so that it can be exposed to the outside through a window opened in one of the outer panels. Further, the outer plate portion is provided with contacts for transmitting and receiving required data to and from external devices such as readers/writers.
180(国際標準化機構)規格によると、ICカードの
厚さは、0.76mmに規定され\縦、横についてもそ
れぞれ所定の寸法に規定されている。According to the 180 (International Organization for Standardization) standard, the thickness of an IC card is defined as 0.76 mm, and the vertical and horizontal dimensions are also defined as predetermined dimensions.
このため、配線基板についても、ごく薄形のものが用い
られ、電子部品の内装部位以外の部位における配線基板
と外板との間には空隙が生じるが、従来のICカードに
あっては、この空隙は、そのまま残されるか、又は樹脂
充填が行なわれるか、さらには外板に空隙に対応した凸
部が設けられて空隙が生じないような手段が施されてい
た。For this reason, a very thin wiring board is used, and a gap is created between the wiring board and the outer panel in areas other than the internal parts of the electronic component, but in conventional IC cards, These voids were either left as they were, filled with resin, or even provided with protrusions corresponding to the voids on the outer panel to prevent the formation of voids.
(発明が解決しようとする問題点)
電子部品の内装部位以外の部位における配線基板と外板
との間に生じる空隙がそのまま残されていた従来例にあ
っては、外力により凹みが生じ易く、また曲り易いとい
う問題点があった。(Problems to be Solved by the Invention) In the conventional example in which the gap between the wiring board and the outer panel in areas other than the interior area of the electronic component is left as is, dents are likely to occur due to external force. Another problem was that it was easy to bend.
また、空隙に樹脂充填を行なうようにしたものでは、充
填の際の厚さ管理が比較的難しく、また硬化のための工
程が必要となり、さらにはLCDの接合部に充填樹脂が
硬化すると、カード全体に変形を生じさせるような外力
が加わったときに接合部が外れてLCDが破損するおそ
れがあるという問題点があった。In addition, in the case where resin is filled into the gap, it is relatively difficult to control the thickness during filling, and a curing process is required.Furthermore, when the resin filled in the LCD joints hardens, the card There is a problem in that when an external force that causes deformation of the entire display is applied, the joint may come off and the LCD may be damaged.
さらに、外板に、空隙に対応した凸部を設【ノるように
したものでは、凸部加工のためコスト高をJR<という
問題点があった。Furthermore, in the case where a convex portion corresponding to the void is provided on the outer panel, there is a problem in that the cost is high due to the machining of the convex portion.
この発明は上記事情に基づいてなされたもので、製造時
の厚さ管理が容易でカード厚さの均一性を向上させ、ま
た外力に対する耐久性を増大させて信頼性を向上させ、
さらには外板への凸部加工を不要としてコスト低減を図
ることのできる携帯可能媒体を捉供することを目的とす
る。This invention was made based on the above-mentioned circumstances, and it is easy to control the thickness during manufacturing, improves the uniformity of card thickness, and increases durability against external forces to improve reliability.
Furthermore, it is an object of the present invention to provide a portable medium that does not require the processing of convex portions on the outer panel and can reduce costs.
[発明の構成]
(問題点を解決するための手段)
この発明は上記問題点を解決するために、カード状の外
筺に所要の電子部品を内装してなる携帯可能媒体におい
て、当該電子部品の内装部位以外の部位に形成される前
記外筐内の空隙部を充填プレートで充填したことを要旨
とする。[Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a portable medium comprising a card-like outer casing with required electronic components. The gist is that a void in the outer casing formed in a portion other than the interior portion of the housing is filled with a filling plate.
(作用)
電子部品の内装部位以外の部位に形成される外筺内の空
隙部が充填プレートで充填されるので、製造時の厚さ管
理が容易となってカード厚さの均一性が向上する。また
、空隙部への充填プレートの介装により、外力に対する
耐久性が増して信頼性の向上が図られる。(Function) Since the voids in the outer casing that are formed in areas other than the internal parts of the electronic component are filled with the filler plate, thickness control during manufacturing is facilitated and the uniformity of card thickness is improved. . In addition, by interposing the filling plate in the gap, durability against external forces is increased and reliability is improved.
(実施例)
以下、この発明の実施例を第1図及び第2図に基づいて
説明する。この実施例は多機能を有する■Cカードに適
用されている。(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 and 2. This embodiment is applied to a ■C card having multiple functions.
まず、携帯可能媒体としてのlcカードの構成を説明す
ると、第1図及び第2図中、3は外形枠であり、外形枠
3の両面部に1対のステンレス製の外板1.2が接合さ
れてカード状の外筺が構成されている。4は厚さが20
0μm程度の配線基板であり、配線基板4には、CPU
及びメモリ等を構成するLSIチップ5a、5b、電池
6、チップ抵抗7a、7b及びLCD8等の電子部品が
実装され、各電子部品は、このような実装状態で外筺に
内装されている。そしてこれらの電子部品のうち、LC
D8の表示部は、その機能上、外板2に開口された窓部
から外部に表われるように内装されている。また、配線
基板4には、リーダ・ライタ等の外部装置との所要デニ
タの送受用等のコンタクト9が取付けられ、このコンタ
クト9も外板の窓部から、外部に表われている。First, to explain the structure of an LC card as a portable medium, in FIGS. 1 and 2, 3 is an outer frame, and a pair of stainless steel outer plates 1.2 are provided on both sides of the outer frame 3. They are joined together to form a card-shaped outer casing. 4 has a thickness of 20
It is a wiring board of about 0 μm, and the wiring board 4 has a CPU
Electronic components such as LSI chips 5a, 5b, batteries 6, chip resistors 7a, 7b, and LCD 8 constituting memories and the like are mounted, and each electronic component is housed in the outer casing in such a mounted state. Among these electronic components, LC
Functionally, the display section of D8 is installed so that it can be exposed to the outside through a window section opened in the outer panel 2. Further, contacts 9 for transmitting and receiving required data to and from an external device such as a reader/writer are attached to the wiring board 4, and these contacts 9 are also exposed to the outside through a window in the outer panel.
第2図に示すように、配線基板4は一方の外板1の内面
に対接されているので、上記の各電子部品の内装部位及
びコンタクト9の取付部位以外の部位と他方の外板2と
の間には空隙が生じるが、この空隙が充填プレート11
(第1図の斜線部分〉で充填されている。充填プレート
11は、例えばガラスエポキシで作製され、その厚さは
約300μmである。また、前記の各電子部品のうち、
LSIチップ5a15bについては樹脂モールドが行な
われるが、この樹脂モールド用枠が充填プレート11に
一体的に形成されている。充填プレート11と配線基板
4及び外板2と対接する部分等は接着剤で接着されてい
る。As shown in FIG. 2, the wiring board 4 is in contact with the inner surface of one of the outer panels 1, so that the wiring board 4 is in contact with the inner surface of the outer panel 1, so that the inner surface of the outer panel 1 is connected to the other outer panel 2. A gap is created between the filling plate 11 and the filling plate 11.
The filling plate 11 is made of glass epoxy, for example, and has a thickness of about 300 μm.
The LSI chip 5a15b is resin molded, and a frame for this resin mold is integrally formed with the filling plate 11. The portions of the filling plate 11 that come into contact with the wiring board 4 and the outer panel 2 are bonded together with an adhesive.
上述のように構成される携帯可能媒体は、ラツ造工程時
において、各電子部品等が実装された配線基板4及びこ
れに対接された充填プレート−11が両外板1.2の間
に挟み込まれるようにして、その両外板1.2の周縁部
が外形枠3に接合され、この後、規定間隔の2枚の型板
の間に外筺が挟まれてその厚さが一定となるように保持
された状態で外筺内に適宜に流し込まれた接着剤が硬化
される。このとき、外筺内の空隙部には充填プレート1
1が組込まれているので、硬化に伴なう両外根1.2の
“ひけ”が防止され、ICカードの厚さの均一性が図ら
れる。In the portable medium configured as described above, during the manufacturing process, the wiring board 4 on which electronic components etc. are mounted and the filling plate 11 that is in contact with the wiring board 4 are placed between the two outer panels 1.2. The peripheral edges of both outer panels 1.2 are joined to the outer frame 3 so as to be sandwiched between them, and then the outer casing is sandwiched between the two templates at a specified interval so that its thickness remains constant. The adhesive appropriately poured into the outer casing is cured while the housing is held in place. At this time, the filling plate 1 is filled in the cavity inside the outer casing.
1 is incorporated, "sinking" of both outer roots 1.2 due to hardening is prevented, and uniformity in the thickness of the IC card is achieved.
また、使用時においては、厚さ方向の外力を受けても、
その外力は充填プレート11の介装により凹みの生じる
ことが防止され、また、その外力の大部分はスペーサと
して機能する充填プレート11により受けられて内装さ
れた電子部品にかかる外力が減少し、外力に対する耐久
性の向上が図られる。Also, during use, even if subjected to external force in the thickness direction,
By interposing the filling plate 11, the external force is prevented from causing a dent, and most of the external force is received by the filling plate 11, which functions as a spacer, reducing the external force applied to the internal electronic components. Improved durability against
[発明の効果]
以上説明したように、この発明によれば、電子部品の内
装部位以外の部位に形成される外筺内の空隙部が充填プ
レートで充填されているので、製造時の厚さ管理が容易
となってカード厚さの均一性を向上させることができ、
また外力に対する耐久性が増大して信頼性を向上させる
ことができるという利点がある。さらに空隙が生じない
ようにするための外板への凸部加工が不要となるのでコ
スト低減を図ることができる。[Effects of the Invention] As explained above, according to the present invention, since the void in the outer casing formed in the part other than the interior part of the electronic component is filled with the filling plate, the thickness at the time of manufacture is reduced. It is easier to manage and improve the uniformity of card thickness.
Further, there is an advantage that durability against external forces is increased and reliability can be improved. Furthermore, since it is not necessary to process a convex part on the outer panel to prevent the formation of voids, it is possible to reduce costs.
第1図はこの発明に係る携帯可能媒体の実施例を外板を
取除いて示寸平面図、第2図は第1図のII−II線に
相当する拡大断面図である。
1.2:外形枠とどもに外筺を構成する外板、3:外形
枠、 4:配線基板、
5 a 、 5 a : L S Iチップ、 6:
電池、7a17b:チップ抵抗、 8 : LCD
。
11:充填プレート。
r゛、埋人J1埋士二好保男FIG. 1 is a dimensional plan view of an embodiment of a portable medium according to the present invention with the outer panel removed, and FIG. 2 is an enlarged sectional view taken along line II--II in FIG. 1.2: Outer plate forming an outer casing together with the outer frame, 3: Outer frame, 4: Wiring board, 5 a, 5 a: LSI chip, 6:
Battery, 7a17b: Chip resistor, 8: LCD
. 11: Filling plate. r゛, Buried J1 Buried Yasuo Futoshi
Claims (2)
る携帯可能媒体において、 当該電子部品の内装部位以外の部位に形成される前記外
筺内の空隙部を充填プレートで充填したことを特徴とす
る携帯可能媒体。(1) In a portable medium consisting of a card-shaped outer casing with required electronic components inside, the voids in the outer casing that are formed in areas other than the internal parts of the electronic components are filled with a filling plate. A portable medium featuring:
する前記電子部品の樹脂モールド用枠が形成されている
ことを特徴とする特許請求の範囲第1項に記載の携帯可
能媒体。(2) The portable medium according to claim 1, wherein the filling plate is formed with a resin molding frame for the electronic component that requires a resin mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62286476A JPH01128882A (en) | 1987-11-14 | 1987-11-14 | Portable medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62286476A JPH01128882A (en) | 1987-11-14 | 1987-11-14 | Portable medium |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01128882A true JPH01128882A (en) | 1989-05-22 |
Family
ID=17704886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62286476A Pending JPH01128882A (en) | 1987-11-14 | 1987-11-14 | Portable medium |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01128882A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03114789A (en) * | 1989-09-29 | 1991-05-15 | Mitsubishi Electric Corp | Semiconductor-device card |
JP2019087124A (en) * | 2017-11-09 | 2019-06-06 | 凸版印刷株式会社 | Plastic card and manufacturing method therefor |
-
1987
- 1987-11-14 JP JP62286476A patent/JPH01128882A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03114789A (en) * | 1989-09-29 | 1991-05-15 | Mitsubishi Electric Corp | Semiconductor-device card |
JP2019087124A (en) * | 2017-11-09 | 2019-06-06 | 凸版印刷株式会社 | Plastic card and manufacturing method therefor |
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