JPH1159038A - Card for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely control the dimension of a card in the thickness direction during its assembling by setting the thickness of a peripheral part, the depth of a step-down configured part, and the height of a projection part to allow the peripheral part to be situated in the card thickness direction at the outside of the surface of a metal panel in a state of the metal panel adhesion-fixed inside of the frame peripheral part. SOLUTION: This is used for receiving constituent parts of a module substrate 10 and metal panel 7 or the like. The frame 2 is for forming the outer configuration of a card main body 1, and formed into a reversed C-shape to be a three- sided surface of the card 1 to have beams crossed over inside for loading a module substrate 10 except the front side with a connector attached therewith. At the front side and rear side of the frame 2, a frame peripheral part 3 having a predetermined width is provided over its periphery, and at the inside of the peripheral part 3, a step-down configured part 5 is formed by being vertically stepped down by a predetermined depth from the peripheral part 3. The step- down configured part 5 has a surface spreading in parallel along the level surface part of the card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device card used for a data storage medium or the like.

[0002]

2. Description of the Related Art As is well known, in recent years, so-called semiconductor device cards have been widely used in various fields. In general, such semiconductor device cards generally include internal components such as module boards in which predetermined electronic components and the like are incorporated. Are placed in a frame constituting the outer shape of the main body, and in order to protect those internal components electrically and mechanically from static electricity or impact applied from the outside, the front and back are covered with a pair of metal panels. It is configured. As a structure of a semiconductor device card of this type, a structure as shown in FIGS. 6 and 7 is conventionally known. FIG. 6 is a perspective view showing the internal structure of the card before the metal panel is attached, and FIG. 7 is a cross-sectional view of the card along the width direction (the line BB in FIG. 6) after the metal panel is attached. FIG. This semiconductor device card 41
In the figure, the outer shape of the main body is constituted by a frame 42 made of resin, and a module substrate 50 incorporating predetermined electronic components 50a including a semiconductor circuit is arranged inside the frame 42. And this module substrate 5
A connector 49 is attached to the front end of the connector 0. This connector 49 is connected via a lead wire 51
It is electrically and mechanically connected to the module substrate 50 by soldering.

The flat portion of the semiconductor device card 41 having the above-described internal structure has the front and back sides to protect the electronic components 50a housed in the body frame 42.
It is configured to be covered with a pair of metal panels 47 (see FIG. 7). Therefore, in this conventional example, the frame 4
A step-down portion 45 which is stepped down by a predetermined depth is formed inside the second peripheral portion 43, and a metal panel 47 is assembled inside this peripheral portion 43. That is, the metal panel 47 is assembled to the frame 42 such that the outer periphery is surrounded by the frame peripheral portion 43 and the back surface is in contact with the step-down portion 45.

[0004] The metal panel 47 is connected to the frame 42.
On the other hand, it is usually bonded and fixed with a thermosetting adhesive such as an epoxy adhesive. More specifically, the metal panel 47
A pressure plate (not shown) that fits the outer shape of the semiconductor device card is provided on both front and back sides of the semiconductor device card via a cushioning material (not shown) after a sheet-like adhesive 46 is interposed between the semiconductor device card and the step-down portion 45. Are arranged, and while these are heated and maintained at a predetermined temperature in a thermostat or the like, an adhesive is cured by applying pressure to the pressing plate with a press or the like to cure the adhesive.

However, in the structure of the frame 42 as described above, in the adhesive curing treatment step, a predetermined pressure or more is applied to the entire card flat portion from both the front and back sides by the cushioning material under a predetermined temperature condition. Since the thickness of the adhesive 46 between the metal panel 47 and the stepped portion 45 changes, there is a possibility that the dimensions between the front and back metal panels 47, 47 may vary. If such a variation in the thickness dimension occurs, the metal panel 47
However, it has been difficult to secure dimensional accuracy in the card thickness direction, for example, partially or entirely higher than the frame peripheral portion 43, and it has been difficult to properly manage the card thickness.

In connection with such a problem, Japanese Unexamined Patent Publication No.
In JP-A-61393, in an IC card provided with a metal panel drawn and formed as a panel for protecting an IC, a convex portion in contact with the panel is provided on the step portion, and a top surface of the convex portion is set to be higher than a top surface of the IC. There is disclosed an apparatus which is set at a high position. According to such a configuration, the card thickness is determined by the dimension between the panel surface where the projection on the front side of the frame abuts and the surface of the panel where the projection on the back side of the frame abuts, and the influence of the change in the thickness of the adhesive can be avoided. The thickness can be easily controlled.

[0007]

However, in the case of the above-mentioned prior art, the card thickness is determined only by the distance between the surfaces of the metal panel drawn and formed by press working or the like. As a result, it was actually difficult to control the card thickness with higher accuracy.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a semiconductor device card capable of managing the dimension in the card thickness direction with higher accuracy at the time of assembling the card. . In this specification,
"Semiconductor device card" refers to a card-shaped or flat-plate-shaped one provided with an electronic circuit or an electric circuit including a semiconductor circuit, and includes, for example, an IC card, a PC card, a modem card, a LAN card or an electronic card. Cards called by other different names and having the same basic configuration are also included in this.

[0009]

For this reason, the first invention of the present application provides a frame constituting an outer shape of a main body and a pair of adhesively fixed to the frame so as to cover the front and back sides of a flat portion of the main body. A metal panel, and wherein the metal panel is formed in a flat shape, wherein the metal panel has a stepped portion which is stepped down by a predetermined depth inside a frame peripheral portion having a predetermined width on the front and back sides of the frame. Is formed, a convex portion having a predetermined height is provided inside the stepped portion, and an adhesive is applied to the stepped portion, and the adhesive surface of the metal panel is brought into contact with the convex portion. In a state where the metal panel is bonded and fixed to the inside of the frame peripheral portion, the thickness of the peripheral portion and the step-down portion are set such that the peripheral portion is located outside the metal panel surface in the card thickness direction. Depth and height of protrusion In which There was characterized in that it is set.

[0010] The second invention of the present application is characterized in that the convex portion is provided intermittently along the peripheral edge of the frame.

Further, the third invention of the present application is characterized in that at least the outer wall surface of the projection is formed in a tapered shape.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing the internal structure of the semiconductor device card 1 according to the first embodiment. The semiconductor device card 1 has a main body outer shape formed of a resin frame 2, and a module substrate 10 incorporating predetermined electronic components 10 a including a semiconductor circuit is arranged inside the frame 2. . On the front side (lower left side in FIG. 1) of the semiconductor device card 1, a connection connector 9 for obtaining an electrical connection with an electronic device using the semiconductor device card 1 is attached. The connector 9 is electrically and mechanically connected to the module substrate 10 via a lead wire 11 by soldering. The connector 9 has a plurality of electrode pin insertion holes 9a for receiving electrode pins including various signal terminals on the electronic device side. The flat portion of the semiconductor device card 1 having the above-described internal structure has a front side and a back side to electrically protect the electronic component 10a built in the main body from static electricity applied from the outside. It is configured to be covered by a pair of flat metal panels 7 (see FIG. 2).

In this embodiment, the module substrate 1
The frame 2 shown in FIG. 3 is used as a frame 2 for receiving components such as a metal panel 7 and a metal panel 7. This frame 2
, Which constitutes the outer shape of the card body, is formed in a U-shape so as to form three sides of the card except for a front side (lower left side in FIG. 3) to which the connector 9 is attached. Inside the module board 1
The crosspiece 2a on which the “0” is placed is stretched. On the front side and the back side of the frame 2, over the periphery thereof,
A frame peripheral portion 3 having a predetermined width is provided. Inside the peripheral portion 3, a step-down portion 5 is formed, which is stepped down from the peripheral portion 3 substantially vertically by a predetermined depth. The step-down portion 5
It has a surface that extends parallel to the card plane. In addition, a projection 4 having a predetermined height is provided inside the stepped portion 5 along the frame peripheral portion 3. The convex part 4
Are formed continuously over the periphery of the frame 2, and the inner wall surface is flush with the inner wall of the frame 2.

In the frame 2, the peripheral portion 3 is located at the outermost side in the frame thickness direction, and determines the frame thickness. In other words, in the frame 2, the height of the convex portion 4 is set such that the convex portion 4 is located inside the frame peripheral portion 3 in the frame thickness direction. In addition, the height of the convex portion 4 is determined in a state where the module substrate 10 is mounted on the cross section 2a inside the frame.
The projection 4 is set so as to be located outside the electronic component 10 a on the module substrate 10. The structure of the frame 2 as described above defines an area where the metal panel 7 covering the front side and the back side can be fitted. That is, the metal panel 7 is assembled to the frame 2 such that the outer periphery is surrounded by the frame peripheral portion 3, and the back surface of the metal panel 7 contacts the convex portion 4.

The metal panel 7 is fixed to the frame 2 by a thermosetting adhesive such as an epoxy adhesive. In this embodiment, at the time of this adhesive fixing, a sheet-like thermosetting adhesive 6 is attached to the step-down portion 5 of the frame 2, and then the metal panel 7 is attached to the frame 2. Thus, in a state where the metal panel 7 is attached to the frame 2, the thermosetting adhesive 6 is interposed between the stepped-down portion 5 and the bonding surface of the metal panel 7 facing the stepped portion. In the case of such a thermosetting adhesive, in order to harden the adhesive and develop a strong adhesive force, it is necessary to perform an adhesive curing process in which a predetermined pressure or more is applied under a predetermined temperature condition. Therefore, when assembling the semiconductor device card 1, the adhesive 6 is interposed between the metal panel 7 and the frame 2 as described above, and then the outer shape of the card is interposed on both the front and back sides of the semiconductor device card 1 through the cushioning material. Arrange the pressurizing plates conforming to
In a state where this is heated and maintained at a predetermined temperature in a constant temperature bath or the like,
An adhesive curing treatment step is provided, in which pressure is applied to the pressure plate by a press or the like to cure the adhesive.

FIG. 2 shows the semiconductor device card 1 after the metal panel 7 is bonded and fixed using the above-described adhesive curing treatment. In the semiconductor device card 1 as a finished product, the metal panel 7 is formed by the thermosetting adhesive 6 interposed between the stepped portion 5 of the frame 2 and the bonding surface of the metal panel 7 facing the metal panel 7. In this state, the outer periphery of the metal panel 7 is surrounded by the frame peripheral portion 3, and the rear surface thereof is
Is in contact with

In the state where the metal panel 7 is bonded and fixed to the frame 2, the frame peripheral portion 3 is
It is located outside the surface of the metal panel 7 in the card thickness direction. In the present embodiment, the thickness of the frame peripheral portion 3 is set so as to obtain such a positional relationship.
The depth of the stepped portion 5 and the height of the convex portion 4 are set in advance. That is, on the front side and the back side of the frame 2, the height of the peripheral portion 3 (that is, the depth of the stepped portion 5) is set to be larger than the sum of the height of the convex portion 4 and the thickness of the metal panel 7. Have been. With this setting, the thickness of the semiconductor device card 1 does not become larger than the thickness of the frame peripheral portion 3, and the card thickness can be managed only by the thickness of the frame peripheral portion 3, The dimensional accuracy in the thickness direction of the card can be improved. In this case, by adjusting the height of the convex portion 4, the thickness of the adhesive 6 interposed between the stepped portion 5 of the frame 2 and the bonding surface of the metal panel 7 facing the stepped portion 5 is adjusted. can do. Thereby, the adhesive force acting between the metal panel 7 and the stepped portion 5 of the frame 2 can be increased, and the reliability of the card quality can be improved.

Further, in the semiconductor device card 1, the metal panel 7 comes into direct contact with the surface of the convex portion 4 (without the adhesive 6) while the metal panel 7 is bonded and fixed to the frame 2. Therefore, the position of the metal panel 7 can be set at a constant position in the card thickness direction by the height of the projections 4.
As a result, it is possible to eliminate dimensional variations between the two metal panels 7 on the front side and the back side. Further, in the semiconductor device card 1, as described above, the height of the projection 4 is set such that the projection 4 is located outside the electronic component 10a on the module substrate 10 in the frame thickness direction. ing. Thereby, the back surface of the metal panel 7 does not contact the electronic component 10a, and a transient load is prevented from being applied to the electronic component 10a from the metal panel 7 side.

Embodiment 2 FIG. 4 shows a semiconductor device card 21 according to the second embodiment of the present invention. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and further description is omitted.
As in the first embodiment, the semiconductor device card 21 has a main body outer shape formed of a resin frame 22. On the front side and the back side of the frame 22, a predetermined width is provided inside a frame peripheral portion 23 having a predetermined width. A stepped portion 25 having a depth lowered is formed. In this embodiment,
Inside the stepped portion 25, a convex portion 24 having a surface horizontal to the card flat portion is provided intermittently along the frame peripheral portion 23. The height of the peripheral portion 23 and the height of the convex portion 24 is fixed to the frame 22 such that a metal panel (not shown) that covers the front and back sides of the semiconductor device card 21 contacts the convex portion 24 on the back surface. In this state, the frame peripheral portion 23 is set to be located outside the metal panel surface in the card thickness direction. With this setting, the thickness of the semiconductor device card 21 does not become larger than the frame peripheral portion 23, and the card thickness can be managed only by the frame peripheral portion 23. The dimensional accuracy in the thickness direction can be improved.

Further, in this embodiment, since the convex portions 24 are intermittently arranged along the frame peripheral portion 23,
As compared with the case where the protrusions are provided continuously, the step-down portion 25 is larger by the space between the adjacent protrusions, and the bonding area between the frame 22 and the metal panel is larger. As a result, the adhesive force acting between them increases, and the reliability of the card quality can be improved.

Embodiment 3 FIG. 5 shows a semiconductor device card 31 according to Embodiment 3 of the present invention. The semiconductor device card 31 has a main body outer shape formed of a resin frame 32 as in the first and second embodiments.
On the front side and the back side of the frame 32, a step-down portion 35 having a predetermined depth is formed inside a frame peripheral portion 33 having a predetermined width. In this embodiment, a convex portion 34 having an outer wall surface formed in a tapered shape is provided inside the stepped portion 35 along the frame peripheral portion 33. The height of the peripheral portion 33 and the height of the convex portion 34 are determined by the metal panel 37 that covers the front and back sides of the semiconductor device card 31.
However, the frame 3 is so positioned that its back surface contacts the convex portion 34.
The frame peripheral portion 33 is set so as to be located outside the surface of the metal panel 37 in the card thickness direction in a state where the frame peripheral portion 33 is adhered and fixed to the metal panel 37. With this setting, the thickness of the semiconductor device card 31 does not become larger than the frame peripheral portion 33, and the card thickness can be managed only by the frame peripheral portion 33. The dimensional accuracy in the thickness direction can be improved.

In this embodiment, since the outer wall surface of the projection 34 is formed in a tapered shape, the metal panel 37 is formed.
And the convex portions 34 can be brought into substantially linear contact with each other. As a result, even when the sheet-shaped thermosetting adhesive 6 interposed between the metal panel 37 and the stepped-down portion 35 of the frame 32 overlaps with the convex portion 34 when the metal panel 37 is bonded and fixed, The metal panel 37 can be properly positioned based on the preset height of the convex portion 34 without being affected by the thickness of the adhesive. That is, according to the shape of the convex portion 34, the card 31 can be assembled without making the sticking accuracy of the sheet-like thermosetting adhesive 6 a problem.

It should be noted that the present invention is not limited to the above-exemplified embodiment, and it is needless to say that various improvements or design changes can be made without departing from the gist of the present invention.

[0024]

According to the first aspect of the present invention, a stepped portion having a predetermined depth is formed inside the peripheral portion of the frame having a predetermined width on the front side and the rear side of the frame. Inside, a convex portion of a predetermined height is provided,
An adhesive is applied to the step-down portion, and an adhesive surface of the metal panel is brought into contact with the convex portion so that the metal panel is adhered and fixed to the inside of the frame peripheral portion. The thickness of the peripheral portion, the depth of the step-down portion, and the height of the convex portion are set so as to be located outside in the card thickness direction from the front surface. The thickness of the card does not become larger than the thickness of the peripheral portion of the frame on the back side, and the card thickness can be managed only by the thickness of the peripheral portion of the frame, so that the dimensional accuracy in the thickness direction of the card can be improved. In addition, since the metal panel directly contacts the convex portion, the position of the metal panel in the direction of the card thickness can be set by the height of the convex portion. Further, by adjusting the height of the convex portion and controlling the thickness of the adhesive interposed between the stepped portion of the frame and the adhesive surface of the metal panel facing the stepped portion, the adhesive acting between the two is controlled. Power can be increased, and the reliability of card quality can be improved.

According to the invention of claim 2 of the present application, the convex portion is provided intermittently along the peripheral portion of the frame to increase the bonding area between the frame and the metal panel, and to reduce the adhesive force acting between the two. It is possible to strengthen. Thereby, the reliability of the card quality can be improved.

Further, according to the invention of claim 3 of the present application, since the convex portion is formed to have a tapered cross section, the metal panel and the convex portion can be brought into substantially linear contact with each other. Even when the sheet-like thermosetting adhesive interposed between the metal panel and the stepped-down portion of the frame overlaps with the convex portion, the thickness is not affected by the thickness of the adhesive and is set in advance. The metal panel can be appropriately positioned based on the height of the raised protrusion. This makes it possible to assemble the card without making the sticking accuracy of the sheet-like thermosetting adhesive a problem.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an internal structure of a semiconductor device card according to Embodiment 1 of the present invention.

FIG. 2 is an explanatory cross-sectional view along the width direction of the semiconductor device card.

FIG. 3 is a perspective view of a frame constituting an outer shape of the semiconductor device card.

FIG. 4 is a perspective view showing an internal structure of a semiconductor device card according to Embodiment 2 of the present invention.

FIG. 5 is an explanatory sectional view along a width direction of a semiconductor device card according to a third embodiment of the present invention;

FIG. 6 is a perspective view showing the internal structure of a conventional semiconductor device card.

FIG. 7 is an explanatory cross-sectional view along a width direction of a conventional semiconductor device card.

[Explanation of symbols]

1,21,31 Semiconductor device card, 2,22,32
Frame, 3,23,33 Frame frame, 4,2
4,34 convex part, 5,25,35 step down part, 7 metal panel

Claims (3)

[Claims] 1. A frame constituting an outer shape of a main body, and a pair of metal panels adhered and fixed to the frame so as to cover a front side and a back side of a plane portion of the main body, and the metal panel is formed in a flat shape. A semiconductor device card, wherein on the front and back sides of the frame, a stepped portion having a predetermined depth is formed inside a frame peripheral portion having a predetermined width, and a predetermined height is formed inside the stepped portion. A state in which an adhesive is applied to the step-down portion and the bonding surface of the metal panel is brought into contact with the protrusion, and the metal panel is bonded and fixed inside the frame peripheral portion. The thickness of the peripheral portion, the depth of the step-down portion, and the height of the convex portion are set so that the peripheral portion is located outside the metal panel surface in the card thickness direction. Semiconductor device De. 2. The semiconductor device card according to claim 1, wherein said convex portion is provided intermittently along a peripheral portion of the frame. 3. The device according to claim 1, wherein at least an outer wall surface of the convex portion is formed in a tapered shape.
A semiconductor device card according to claim 1.