JPH0474700A - Semiconductor device card - Google Patents
Semiconductor device cardInfo
- Publication number
- JPH0474700A JPH0474700A JP2191649A JP19164990A JPH0474700A JP H0474700 A JPH0474700 A JP H0474700A JP 2191649 A JP2191649 A JP 2191649A JP 19164990 A JP19164990 A JP 19164990A JP H0474700 A JPH0474700 A JP H0474700A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor module
- parts
- circuit substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 230000001681 protective effect Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 7
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、主としてコンピュータの外部記憶媒体として
用いられるメモリカード等の半導体装置カードに関する
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a semiconductor device card such as a memory card used mainly as an external storage medium of a computer.
〈従来の技術〉
従来の半導体装置カートの構造を、第３図および第４図
（Ａ）（Ｂ）（Ｃ）に示す。第３図は完成品の断面図、
第４図（Ａ ＸＢ ＸＣ）はその組立途中の断面図であ
る。<Prior Art> The structure of a conventional semiconductor device cart is shown in FIGS. 3 and 4 (A), (B), and (C). Figure 3 is a cross-sectional view of the finished product.
FIG. 4 (A XB XC) is a sectional view during the assembly.
これらの図に示すように、従来の半導体装置カドは、半
導体モジュール２１と、樹脂製の枠体２２と、保護パネ
ル２３．２３とからなる。As shown in these figures, the conventional semiconductor device frame includes a semiconductor module 21, a resin frame 22, and a protection panel 23.23.
半導体モジュール２１は、回路基板２４上に半導体素子
２５やその他の電子部品を搭載したものであり、その回
路基板２４には、位置決め固定用の貫通孔２６が形成さ
れている。The semiconductor module 21 has a semiconductor element 25 and other electronic components mounted on a circuit board 24, and a through hole 26 for positioning and fixing is formed in the circuit board 24.
枠体２２は、その−面側に形成した凹部２２ａ内に半導
体モジュール２１を収容するもので、凹部２２ａ内周に
は、回路基板２４の周縁を受は止める段部２２ｂが形成
され、段部２２ｂには、回路基板２４の貫通孔２６に挿
入される突起２７が突設されている。The frame body 22 accommodates the semiconductor module 21 in a recess 22a formed on the negative side thereof.A step 22b is formed on the inner periphery of the recess 22a to receive the periphery of the circuit board 24. A protrusion 27 that is inserted into the through hole 26 of the circuit board 24 is provided on the protrusion 22b.
組立に当たっては、まず、第４図（Ａ）に示すように、
枠体２２上で半導体素子２５を下側にして半導体モジュ
ール２１の位置決めをして、この半導体モジュール２１
を枠体２２の凹部２２ａ内に収容する。収容した状態で
は、第４図（Ｂ）に示すように、回路基板２４の貫通孔
２６に突起２７が挿入されて貫通し、突起２７の先端部
は回路基板２４の背面側に突出する。そして、回路基板
２４の背面側で、第４図（Ｃ）に示すように、突起２７
の先端部を加圧もしくは加熱によりカシメて、カシメ部
２７ａを形成することで、半導体モジュール２１が枠体
２２内の一定位置に固定される。For assembly, first, as shown in Figure 4 (A),
The semiconductor module 21 is positioned on the frame 22 with the semiconductor element 25 facing downward, and the semiconductor module 21 is
is housed in the recess 22a of the frame 22. In the accommodated state, as shown in FIG. 4(B), the protrusion 27 is inserted into and passes through the through hole 26 of the circuit board 24, and the tip of the protrusion 27 protrudes toward the back side of the circuit board 24. Then, on the back side of the circuit board 24, as shown in FIG.
The semiconductor module 21 is fixed at a fixed position within the frame body 22 by caulking the tip of the semiconductor module 21 by applying pressure or heating to form a caulking portion 27a.
半導体モジュール２１を収容した枠体２２の両面には、
半導体モジュール２１を外部の静電気から保護するため
に、保護パネル２３が取り付けられ、これで、第３図に
示した半導体装置カードが完成する。On both sides of the frame 22 housing the semiconductor module 21,
A protection panel 23 is attached to protect the semiconductor module 21 from external static electricity, and the semiconductor device card shown in FIG. 3 is thus completed.
〈発明か解決しようとする課題〉
上記のように、従来の半導体装置カードでは、枠体２２
に形成された突起２７を、回路基板２４の貫通孔２６に
貫通させて、回″路基板２４の背面側で突起２７の先端
部をカシメるから、カシメ加工を済ませた状態では、カ
シメ部２７ａが回路基板２４の背面から突出することに
なる。<Problem to be solved by the invention> As mentioned above, in the conventional semiconductor device card, the frame 22
The protrusion 27 formed in the circuit board 24 is passed through the through hole 26 of the circuit board 24, and the tip of the protrusion 27 is caulked on the back side of the circuit board 24. will protrude from the back side of the circuit board 24.
したかって、半導体モジュール２１の背面を覆う保護パ
ネル２３は、半導体モンユール２１との間にカシメ部２
’７．ａに相当する隙間を残して枠体２２に取り付ける
必要があり、その分、カートの厚みが厚くなる。このこ
とが、カート全体の薄型化を図るうえでの障害となって
いた。Therefore, the protective panel 23 covering the back surface of the semiconductor module 21 has the caulking portion 2 between it and the semiconductor module 21.
'7. It is necessary to attach the cart to the frame 22 while leaving a gap corresponding to a, which increases the thickness of the cart accordingly. This has been an obstacle in making the entire cart thinner.
本発明は、上述の問題点に鑑みてなされたものであって
、半導体モジュールを固定するためのカシメ部か回路基
板から突出することなく、その板厚内に収まるようにし
て、カード全体の薄型化を可能にすることを課題とする
。The present invention has been made in view of the above-mentioned problems, and the crimped portion for fixing the semiconductor module does not protrude from the circuit board, but is contained within the thickness of the circuit board, thereby reducing the overall thickness of the card. The challenge is to make this possible.
〈課題を解決するための手段〉
本発明は、上記の課題を達成するために、回路基板を有
する半導体モジュールと、この半導体モジュールを収容
する枠体と、枠体の表面を覆う保護パネルとからなり、
半導体モジュールの回路基板には貫通孔が形成され、枠
体には貫通孔と対応する位置に突起が形成され、突起は
貫通孔を貫通した状態でその先端部がカシメ加工されて
いる半導体装置カードであって、貫通孔のカシメ側に広
口部が四人形成され、この広口部内で突起の先端部によ
りカシメ部が形成されている構成とした。<Means for Solving the Problems> In order to achieve the above-mentioned problems, the present invention includes a semiconductor module having a circuit board, a frame housing the semiconductor module, and a protective panel covering the surface of the frame. Become,
A semiconductor device card in which a through hole is formed in the circuit board of the semiconductor module, a protrusion is formed in the frame at a position corresponding to the through hole, and the tip of the protrusion is caulked while passing through the through hole. In this configuration, four wide mouth parts are formed on the caulking side of the through hole, and a caulking part is formed by the tips of the protrusions within the wide mouth parts.
〈作用〉
上記の構成において、組立に当たっては、枠体の突起を
、半導体モノニールの回路基板に形成された貫通孔に挿
入貫通させ、貫通した突起の先端部をカシメることで、
半導体モジュールが枠体に固定されるのであるが、貫通
孔のカシメ側には広口部かあって、この広口部内で突起
の先端部がカシメられるから、カシメ部は広口部内に収
まり、回路基板の背面からは突出しない。<Function> In the above configuration, when assembling, the protrusion of the frame is inserted and penetrated into the through hole formed in the semiconductor monoyl circuit board, and the tip of the protrusion that has passed through is caulked.
The semiconductor module is fixed to the frame, and there is a wide opening on the caulking side of the through hole, and the tip of the protrusion is caulked within this wide opening, so the caulking part fits inside the wide opening and the circuit board is secured. It does not protrude from the back.
したがって、回路基板の背面側を覆うパネルは、回路基
板との間にほとんど隙間のない状態で取り付けることが
可能となり、その分、カード全体の厚みが薄くなる。Therefore, the panel covering the back side of the circuit board can be attached with almost no gap between the panel and the circuit board, and the thickness of the entire card can be reduced accordingly.
〈実施例〉
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.
第１図および第２図（Ａ ）（Ｂ ＸＣ）は本発明の一
実施例に係り、第１図は半導体装置カードの完成品の断
面図、第２図（Ａ ）（Ｂ ）（Ｃ）はその組立途中の
断面図である。1 and 2 (A) (B XC) relate to one embodiment of the present invention, FIG. 1 is a sectional view of a completed product of a semiconductor device card, and FIG. 2 (A) (B) (C) is a cross-sectional view during the assembly process.
これらの図に示すように、この実施例の半導体装置カー
トが、半導体モジュール１と、樹脂製の枠体２と、保護
パネル３．３とからなり、半導体モジュールｌが回路基
板４上に半導体素子５やその他の電子部品を搭載して構
成されている点は、従来の半導体装置カートと同様であ
る。As shown in these figures, the semiconductor device cart of this embodiment consists of a semiconductor module 1, a resin frame 2, and a protection panel 3.3, and a semiconductor module 1 has semiconductor elements mounted on a circuit board 4. 5 and other electronic components are mounted thereon, similar to conventional semiconductor device carts.
また、半導体モジュール１の回路基板４には、位置決め
固定用の貫通孔６か形成されており、方、枠体２には、
その凹部２ａ内周に回路基板４の周縁を受は止める段部
２ｂがあって、その段部２ｂには突起７が形成されてお
り、この突起７は回路基板４の貫通孔６に挿入され、突
起７の先端部が、加圧もしくは加熱によりカシメられる
点も、従来例と同様である。Further, the circuit board 4 of the semiconductor module 1 is formed with a through hole 6 for positioning and fixing, and the frame body 2 is provided with a through hole 6 for positioning and fixing.
There is a step 2b on the inner periphery of the recess 2a that receives the peripheral edge of the circuit board 4, and a protrusion 7 is formed on the step 2b, and the protrusion 7 is inserted into the through hole 6 of the circuit board 4. , the tip of the protrusion 7 is caulked by pressure or heating, which is similar to the conventional example.
この実施例の半導体装置カードの構造が、従来例と異な
る点は、貫通孔６のカシメ側（半導体素子５がある側と
は反対側で、図面では、回路基板４の上側）に広口部８
が凹入状に形成されており、突起７の先端部がこの広口
部８の内部でカシメられるところにある。The structure of the semiconductor device card of this embodiment differs from the conventional example in that a wide opening 8 is provided on the caulking side of the through hole 6 (the side opposite to the side where the semiconductor element 5 is located, and in the drawing, the upper side of the circuit board 4).
is formed in a concave shape, and the tip of the protrusion 7 is in a place where it is caulked inside this wide opening part 8.
組立に当たっては、まず、半導体モジュール１と、枠体
２とを別個に用意する。半導体モジュールｌの回路基板
４には貫通孔６が、また、枠体２には突起７かそれぞれ
形成されているが、さらに、貫通孔６のカシメ側、すな
わち回路基板４の背面側には広口部８か形成されている
。そして、第２図（Ａ）に示すように、枠体２上で半導
体素子５を下側にして半導体モジュールＩの位置決めを
して、この半導体モジュール１を枠体２の凹部２ａ内に
収容する。For assembly, first, the semiconductor module 1 and the frame 2 are prepared separately. A through hole 6 is formed in the circuit board 4 of the semiconductor module l, and a protrusion 7 is formed in the frame 2, but a wide opening is formed on the caulking side of the through hole 6, that is, on the back side of the circuit board 4. Part 8 is formed. Then, as shown in FIG. 2(A), the semiconductor module I is positioned on the frame 2 with the semiconductor element 5 facing downward, and the semiconductor module 1 is housed in the recess 2a of the frame 2. .
収容した状態では、第２図（Ｂ）に示すように、回路基
板４の貫通孔６に突起７が挿入されて貫通し、突起７の
先端部は回路基板４の背面側に突出する。In the accommodated state, as shown in FIG. 2(B), the protrusion 7 is inserted into and passes through the through hole 6 of the circuit board 4, and the tip of the protrusion 7 protrudes toward the back side of the circuit board 4.
次に、回路基板４の背面側にある広口部８内で、第２図
（Ｃ）に示すように、突起７の先端部を加圧もしくは加
熱によりカシメて、カシメ部７ａを形成する。このカシ
メ部７ａにより、回路基板４が段部２ｂ上に固定され、
半導体モジュールｌの全体が枠体２内に固定される。Next, in the wide opening 8 on the back side of the circuit board 4, as shown in FIG. 2(C), the tips of the protrusions 7 are crimped by pressure or heating to form a crimped part 7a. The circuit board 4 is fixed on the step part 2b by this caulking part 7a,
The entire semiconductor module 1 is fixed within the frame 2.
この場合、カシメ部７ａは広口部８内に収まり、回路基
板４の背面からは突出しない。In this case, the caulked portion 7a fits within the wide opening portion 8 and does not protrude from the back surface of the circuit board 4.
こののち、半導体モジュール１を収容しＲ枠体２の両面
に、それぞれ保護パネル３．３を取り付けることで、第
１図に示した完成品か得られるのであるか、両保護パネ
ル３．３のうち、回路基板４の背面側を覆う保護パネル
３は、回路基板４からの突出物かないから、回路基板４
との間にほとんと隙間のない状態で取り付けられる。After this, the semiconductor module 1 is accommodated and the protective panels 3.3 are attached to both sides of the R frame body 2, so that the finished product shown in FIG. 1 can be obtained. Of these, the protective panel 3 that covers the back side of the circuit board 4 has no protruding parts from the circuit board 4, so the protection panel 3 covers the back side of the circuit board 4.
It can be installed with almost no gap between the
〈発明の効果〉
以上述へたように、本発明によれば、回路基板の貫通孔
の広口部内で、枠体側の突起の先端部かカシメられるか
ら、突起とその先端のカシメ部とは回路基板の板厚内に
収まり、回路基板の背面から突出しなくなる。したがっ
て、回路基板の背面側を覆うパネルを、回路基板との間
にはとんと隙間のない密接した状態で取り付けることが
でき、保護パネルと回路基板との間の隙間がなくなる分
、カード全体の厚みを薄くすることができる。<Effects of the Invention> As described above, according to the present invention, the tip of the protrusion on the frame side is caulked within the wide opening of the through hole of the circuit board, so that the protrusion and the caulked portion of the tip are connected to the circuit. It fits within the board thickness and does not protrude from the back of the circuit board. Therefore, the panel that covers the back side of the circuit board can be attached in close contact with the circuit board, with no gaps between the panel and the circuit board. can be made thinner.
第１図および第２図（Ａ ）（Ｂ ）（Ｃ）は本発明の
一実施例に係り、第１図は完成品の断面図、第２図（Ａ
）（Ｂ ）（Ｃ）はその組立途中の断面図である。
第３図および第４図（Ａ ）（Ｂ ＸＣ）は従来例に係
り、第３図は完成品の断面図、第４図（Ａ ）（Ｂ ）
（Ｃ）はその組立途中の断面図である。
１・・半導体モジュール、２・・・枠体、３・・・保護
パネル、４・・回路基板、６・貫通孔、７・−突起、７
ａ・・・カシメ部、８・・・広口部。
第３図 ２１Figures 1 and 2 (A), (B), and (C) relate to one embodiment of the present invention; Figure 1 is a sectional view of the finished product; Figure 2 (A);
)(B) and (C) are cross-sectional views during the assembly process. Figures 3 and 4 (A) (B
(C) is a sectional view during the assembly. DESCRIPTION OF SYMBOLS 1...Semiconductor module, 2...Frame body, 3...Protection panel, 4...Circuit board, 6.Through hole, 7.-Protrusion, 7
a... Caulking part, 8... Wide mouth part. Figure 3 21
Claims (1)
体モジュールを収容する枠体と、枠体の表面を覆う保護
パネルとからなり、半導体モジュールの回路基板には貫
通孔が形成され、枠体には貫通孔と対応する位置に突起
が形成され、突起は貫通孔を貫通した状態でその先端部
がカシメ加工されている半導体装置カードであって、 貫通孔のカシメ側に広口部が凹入形成され、この広口部
内で、突起の先端部によりカシメ部が形成されている、 ことを特徴とする半導体装置カード。(1) Consisting of a semiconductor module having a circuit board, a frame that houses the semiconductor module, and a protective panel that covers the surface of the frame, a through hole is formed in the circuit board of the semiconductor module, and a through hole is formed in the frame. A semiconductor device card in which a protrusion is formed at a position corresponding to the through hole, the tip of the protrusion is caulked while passing through the through hole, and a wide opening is recessed and formed on the caulking side of the through hole. A semiconductor device card characterized in that a caulking portion is formed within the wide opening portion by the tip of the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191649A JPH0474700A (en) | 1990-07-17 | 1990-07-17 | Semiconductor device card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2191649A JPH0474700A (en) | 1990-07-17 | 1990-07-17 | Semiconductor device card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474700A true JPH0474700A (en) | 1992-03-10 |
Family
ID=16278172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2191649A Pending JPH0474700A (en) | 1990-07-17 | 1990-07-17 | Semiconductor device card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474700A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06171275A (en) * | 1992-09-29 | 1994-06-21 | Mitsubishi Electric Corp | Ic card and production thereof |
| JPH0652294U (en) * | 1992-12-10 | 1994-07-15 | 帝国通信工業株式会社 | Remote control device |
| US7483273B2 (en) * | 2005-05-27 | 2009-01-27 | Shinko Electric Industries Co., Ltd. | Semiconductor module and semiconductor module heat radiation plate |
-
1990
- 1990-07-17 JP JP2191649A patent/JPH0474700A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06171275A (en) * | 1992-09-29 | 1994-06-21 | Mitsubishi Electric Corp | Ic card and production thereof |
| JPH0652294U (en) * | 1992-12-10 | 1994-07-15 | 帝国通信工業株式会社 | Remote control device |
| US7483273B2 (en) * | 2005-05-27 | 2009-01-27 | Shinko Electric Industries Co., Ltd. | Semiconductor module and semiconductor module heat radiation plate |
| TWI382810B (en) * | 2005-05-27 | 2013-01-11 | Shinko Electric Ind Co | Semiconductor module and semiconductor module heat radiation plate |
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