JPH01128598A - Bonding apparatus of electronic part - Google Patents

Abstract

PURPOSE:To suppress the dispersion in quality to the minimum degree, to meet the requirements of multi-product/mixed production and to improve production efficiency, by controlling the relative movement positions of a bonding agent applying means and a printed circuit board with respect to a bonding head by a moving means based on the result of reading of a pattern recognizing means, and automating bonding work for bonding electronic parts to the printed circuit board. CONSTITUTION:A bonding apparatus of electronic parts have the following parts. A pattern recognizing means 37 optically reads positions, where electronic parts are bonded to a printed circuit board. A bonding agent applying means 53 applies bonding agent to the positions, where the electronic parts are bonded. A bonding head 41 has a plurality of vacuum tools 42-47, which hold the electronic parts and bond the parts to the printed circuit board. At this time, the center of each electronic part is determined with gaging means 31. A moving means 23 moves the printed circuit board relatively and also moves the electronic part, which is arranged at a part supplying position with respect to said bonding head, and said gaging means relatively. A control part controls the relative moving position of the printed circuit board based on the result of the reading of the pattern recognizing means.

Description

[Detailed description of the invention] [Object of the invention] (Field of industrial application)
The present invention relates to an electronic component bonding device for bonding electronic components such as IC chips to a flexible printed circuit board cap.

(Prior art) Generally, a bendable, thin and light flexible printed circuit board is used as a mounting board for a thin transistor type liquid crystal display IVfi, and IC chips and other electronic components are directly mounted on the board to achieve high density. We carry out the mounting process by taking advantage of the advantages of flexible printed circuit boards and bending the board.
I'm trying to make it lighter, thinner, and smaller.

For example, as shown in FIG. 3, the mounting board has a configuration in which four types of flexible printed circuit boards 2, 3, 4, and 5 are attached to the four sides of the outer periphery of the liquid crystal display section 1. IC chips 6 to 12 as electronic components are bonded onto the chips 2 to 5.

The flexible printed circuit boards 2 to 5 have shapes, sizes, and Ic
Because the bonding positions of the chips 6 to 12 are different, mixed production of various products is required. It was difficult to automate the gluing of ~12.

Therefore, conventionally, an operator manually inspects the flexible printed circuit board 2 while visually using a microscope or the like.
Adhesive was applied to IC chips 6 to 5, and IC chips 6 to 12 were purchased and bonded together, allowing for mixed production of a wide variety of products.

The form of adhesion of IC chips 6 to 12 is as shown in FIG.
2 is pressed to perform adhesion.

- As an example, manual gluing methods are described.

First, while observing the adhesive surfaces of the IC chips 6 to 12 of the flexible printed circuit boards 2 to 5 with a microscope, the adhesive silver paste 15 is applied to several points using a tweezers 'V application rod.

Next, the IC chips 6 to 12 are adsorbed using vacuum tweezers and adhered while being aligned using a microscope.

(Problems to be Solved by the Invention) In the above-described method of manually bonding the IC chips 6 to 12, it is difficult for the operator to do so. Depending on A degree and individual differences,
Variations in the application m of the silver paste 15, variations in the adhesion position, i! The spread of the silver paste varies due to the pressing force at 1:00, which causes a decline in quality and production efficiency.

The present invention has been made in view of the above points, and improves quality by making it possible to self-adhere electronic components such as IC chips 6 to 12 to printed circuit boards such as flexible printed circuit boards 2 to 5. The purpose of this is to minimize variations in production, support mixed production of a wide variety of products, and improve production efficiency.

[Structure of the invention]

(Means for Solving the Problems) The present invention relates to a device for bonding electronic parts to a printed circuit board, and the present invention relates to a device for bonding electronic parts to a printed circuit board, and the present invention relates to a device for bonding electronic parts to a printed circuit board placed at a board/supply position. A pattern recognition means for optically reading the position, an adhesive application means for applying adhesive to the position where the electronic components of the printed circuit board placed at the board supply position are to be adhered, and aligning and positioning the plurality of types of electronic components. and a plurality of types of vacuum tools that hold electronic components placed at a component supply position and mount them on the casing means, and hold and press-bond the electronic components aligned with the casing means to a printed circuit board. A bonding head having an adhesive head, a printed circuit board disposed at the board supply position with respect to the pattern recognition means, the adhesive application stage 1, and the bonding head is moved relative to the bonding head, and a strip is applied to the bonding head. a moving means for relatively moving the electronic component placed at the component supply position and the caging means;
The apparatus is equipped with a control section that controls relative movement of the printed circuit board with respect to the adhesive applying means and the adhesive head by the moving means based on the reading result of the pattern recognition means.

(Function) The electronic component bonding system (2) of the present invention uses a pattern recognition means to optically read the position where the electronic component is to be bonded on the printed circuit board, and based on this reading result, the electronic component is attached to the printed circuit board. It is used to properly adhere to a predetermined position with high positional accuracy.

(Embodiment) An embodiment of the electronic component bonding apparatus of the present invention will be described with reference to the drawings.

In FIG. 1, 21 is a board supply tray for aligning and positioning the flexible printed circuit boards 2.3.4.5 shown in FIG. 3, and 22 is an IC chip 6.7 as an electronic component, also shown in FIG. , 8゜9, 10.11.12 is a component supply tray for aligning and positioning the board supply tray 21.
The component supply tray 22 is vacuum-adsorbed and fixed to the substrate supply position 24 and the component supply position 25 of an XY moving stage 230, which serves as a moving means, respectively.

The XY moving stage 23 is moved in the horizontal X-axis direction by an X-axis drive servo motor 28 shown in FIG.
horizontally perpendicular to the X-axis <E Y-axis direction 1. :Moving.

A first stage of casing 31 is provided on the XY moving stage 23. This casing means 31 uses a pair of front and rear clamping bins 32 that open and close synchronously, and a pair of left and right clamping bins 32 that open and close synchronously, and holds a plurality of types of IC chips 6 to 12 of irregular shapes and sizes in four directions. IC chips 6 to 1 of multiple categories are sandwiched and positioned from
2 is automatically aligned.

Further, an optical system 3 is provided above the XY moving stage 23.
pattern recognition means 37 consisting of 5 and a television camera 36;
is provided. This pattern recognition means 37 is
Due to the movement of the Y-movement stage 23, the board supply tray 21 on the board supply 4D14 that has been moved directly below (f7! 3G and inputs it as a signal to the VTM section 38 shown in FIG.

Further, above the XY moving stage 23, a rotary type adhesive head 41 is installed.

This adhesive head 41 has vacuum collets 42, 43, 44, 45, 4 as a plurality of vacuum tools that hold a plurality of types of IC chips 6 to 12 according to their shapes.
6 and vacuum tweezers 47 are attached to a disk 48 in M pairs, and this disk 48 is moved in the vertical Z-axis direction by a 7-axis drive servo motor 49 shown in FIG. 2, and rotated as shown in FIG. The component supply tray 22 on the component supply position fi2s is rotated by the driving servo motor 50 to direct any one of the vacuum collets 42 to 46 and the vacuum tweezers 47 downward, and is moved directly below by the movement of the XY movement stage 23. Holds IC chips 6 to 12 positioned at
12 is lowered between the four clamping bins 320 of the casing means 31 that has been moved directly below, the IC chips 6 to 12 that have been aligned and positioned by this casing means 31 are held again, and the IC chips 6 to 12 are placed directly below the casing means 31. 1) - The flexible printed circuit boards 2 to 5 positioned on the board supply tray 21 on the board supply position 24 that has been moved to are placed at predetermined positions.

Further, above the XY moving stage 23, a syringe type pneumatically controlled adhesive applying means 53 is provided. This adhesive application means 53 applies adhesive to predetermined positions of the flexible printed circuit boards 2 to 5 positioned on the single board supply tray 21 on the board supply 4D14 that has been moved directly below as a result of the movement of the XY moving stage 23. The silver paste 15 shown in the figure is applied by discharging it.

Next, specific operations for bonding the IC chips 6 to 12 to the flexible printed circuit boards 2 to 5 will be explained.

First, before starting the work, information is provided to determine the bonding position of IC chips 6 to 12 on flexible printed circuit boards 2 to 5.
Information regarding the circuit pattern at the bonding position of ~12, information regarding the application conditions of the silver paste 15, information regarding the IC chips 6 to 12 to be bonded, and IC chips 6 to 12 at the time of bonding.
111 information on the pressure strip 1'F of
The information is entered into section 38 and stored.

The specific operations are as follows: (1) The flexible printed circuit boards 2 to 5 are mounted on the board supply tray 21.

(2) Mounting the IC chips 6 to 12 on the component supply tray 22.

(2) Fix the substrate supply tray 21 at the substrate supply position 24 of the XY movement stage 23 and the component supply tray 22 at the component supply position 25 of the XY movement stage 23, respectively.

The operator performs steps 1 to 2 above and issues a start command to the equipment.

- Based on the information regarding the adhesion position stored in the control unit 38, the XY movement stage 23 is driven, and the I of the flexible printed circuit boards 2 to 5 on the board supply tray 21 is driven.
The adhesion positions of the C chips 6 to 12 are moved to directly below the pattern recognition means 37, and the pattern recognition means 37 is attached to the IC chips 6 of the flexible printed circuit boards 2 to 5 that have been moved directly below.
The circuit pattern at the bonding position of ~12 is read and inputted as a signal to the v control unit 38, and the control 8B38 compares the stored information regarding the circuit pattern at the bonding position with the circuit pattern read signal, Deviations due to expansion and contraction due to temperature changes of the flexible printed circuit boards 2 to 5 are determined, and the stored information regarding the adhesion positions is corrected based on this deviation.

- Based on the information regarding the adhesion position corrected by the control unit 38, the XY moving stage 23 is driven, and the adhesive is applied to the four contact necks of the IC chips 6 to 12 of the flexible printed circuit boards 2 to 5 on the board supply tray 21. The adhesive application means 53 moves directly under the means 53 and applies the IC chips 6 to 12 of the flexible printed circuit boards 2 to 5 directly below the adhesive application means 53 based on the information regarding the application conditions of the silver paste 15 stored in the control unit 38. Adhesion [1] Silver paste 15 is applied to several points according to the shape of IC chips 6 to 12.

- Based on the information regarding the IC chips 6 to 12 stored in the control unit 38, the XY moving stage 23 is driven, and the IC chips 6 to 12 on the component supply tray 22 are moved directly below the bonding head 41, and the bonding head 41 is disk 4
After the vacuum tweezers 47 is directed downward by the rotation of 8, it descends to the IC chips 6 to 12 directly below, rises while holding the IC chips 6 to 12, and then, by driving the XY moving stage 23, When the casing means 31 moves directly below the adhesive head 41 holding the IC chips 6 to 12, the adhesive head 41 descends to the casing means 31 and the I
The C-chips 6 to 12 are lowered between the four clamping bins 32 of the casing means 31.

■ The casing means 31 closes the four clamping bins 32 and clamps the IC chips 6 to 12 from four sides.
After positioning ~12 with self-centering, four clamping bins 3
Open 2.

■ The adhesive head 41 is moved by the rotation of the disk 48.
In accordance with the shape of the C chips 6 to 12, one of the vacuum collets 42 to 46 is moved downward, descending to the IC chips 6 to 12 of the caging means 31, and holding the IC chips 6 to 12. After rising, &! Based on the information regarding the adhesion positions corrected by the control unit 38, the XY moving stage 23 is driven, and the adhesion positions of the IC depths 6 to 12 of the flexible printed circuit boards 2 to 5 on the board supply tray 21 are set directly below the adhesion head 41. and glue head 4
1 is the IC at the time of adhesion that was memorized by t11111 section 38.
Based on the information regarding the pressurizing conditions for the chips 6 to 12, the IC chips 6 to 12 are lowered to the adhesion position of the flexible printed circuit boards 2 to 5 directly below and applied with a predetermined pressure.
C chips 6 to 12 are bonded to flexible printed circuit boards 2 to 6 via silver paste 15, and IC chips 6 to 1
Question 2.

The above operations (1) to (2) are repeated on a self-help basis, and all the IC chips 6 to 12 are sequentially adhered to the flexible printed circuit board 2 and 5 at predetermined positions.

■ Substrate supply position of XY moving stage 23'? Remove the board supply tray 21 from J24, and
Take out the circuit boards 2 to 5 from the board.

@Remove the component supply tray 22 from the component supply position 25 of the XY moving stage 23.

The worker completes the work by performing the above step (1).

Next, switching of types will be explained.

The shapes and sizes of flexible printed circuit boards 2 to 5 and IC chips 6 to 12, and the IC
Loss of chips 6-12 and l? −? This is the S position.

In this embodiment, only the board supply tray 21 and the component supply tray 22 are prepared as dedicated parts depending on the product type, and the contact operation is related to the adhesion positions of the IC chips 6 to 12 on the flexible printed circuit boards 2 to 5. information,
IC depth 6~ of flexible printed circuit board 2~5
Information regarding the circuit pattern at the bonding position 12, information regarding the application conditions of the silver paste 15, and the IC chip 6 to be bonded.
12 and the pressure conditions for IC chips 6 to 12 during adhesion, etc., for each product type.
Once you input it into s3g and memorize it, all you have to do is select the product type (JNow) and you can handle mixed production of many products.

In this embodiment, the flexible printed circuit boards 2 to 5 are moved for positioning, but the pattern recognition means 37, adhesive head 41, and adhesive application means 53 may also be moved.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to automate the process of attaching electronic components to printed circuit boards.
This makes it possible to minimize variations in quality, save labor, and enable mixed production of a wide variety of products, making it easy to respond to the production of new scales.・The pattern recognition means optically reads the position on the circuit board where the electronic component is to be bonded, and based on this reading result, the electronic component is bonded to the printed circuit board, allowing the electronic component to be bonded accurately with high positional accuracy. be able to.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the electronic component bonding device of the present invention, FIG. 2 is a configuration diagram of its control 11, and FIG. 3 is a perspective view showing the mounting state of a thin film transistor type liquid crystal display device. Figure 4 is a cross-sectional view showing the feldspathic state of the electronic components and circuit board. 2.3.4.5th grade/Printed circuit board, 6°7, 8.9
．． 10.11.12... [C-Dep as an electronic component,
15...Silver paste as adhesive, 23...XY movement stage as moving means, 24...Substrate supply position, 2
5. Parts supply position, 31. Caging means, 37.
- Pattern recognition means, 38... Control 211 section, 41...
Adhesive head, 42.43.44.45.4G... Vacuum collet as a vacuum tool, 47. Vacuum tweezers as a vacuum tool, 53...
Adhesive application means. Inventor: November 13, 1986
Sachi Patent Applicant: Toshiba Co., Ltd. Kabasawa
Atsushi... "11-1

Claims (1)

[Claims] (1) A device for bonding electronic components to a printed circuit board, the device comprising: a pattern recognition means for optically reading a position where the electronic component is to be bonded on a printed circuit board placed at a board supply position; and a pattern recognition means placed at the board supply position. an adhesive application means for applying adhesive to a position on a printed circuit board where electronic components are to be adhered; a casing means for aligning and positioning multiple types of electronic components; and a casing means for holding electronic components placed at a component supply position. an adhesive head having a plurality of types of vacuum tools attached to the casing means, holding the electronic component aligned by the casing means and press-bonding it to the printed circuit board; the pattern recognition means; and the adhesive application. moving the printed circuit board located at the board supply position relative to the means and the adhesive head, and moving the electronic component located at the component supply position and the casing means relative to the adhesive head; The present invention is characterized by comprising a moving means for moving the printed circuit board, and a control section for controlling the relative movement position of the printed circuit board by the moving means with respect to the adhesive application means and the adhesive head based on the reading result of the pattern recognition means. Adhesion equipment for electronic parts.