JPH01127259U - - Google Patents
Info
- Publication number
- JPH01127259U JPH01127259U JP2173688U JP2173688U JPH01127259U JP H01127259 U JPH01127259 U JP H01127259U JP 2173688 U JP2173688 U JP 2173688U JP 2173688 U JP2173688 U JP 2173688U JP H01127259 U JPH01127259 U JP H01127259U
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- nut
- molded
- resin
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示すナツト部分の
断面図、第２図、第３図はそれぞれナツトの形状
例を示す正面図、第４図はモールド型整流器の平
面図、第５図はその正面図、第６図は結線図、第
７図は従来例のナツト部分の断面図、第８図はそ
の破損例の断面図である。
図面中、１，２は整流器、３は樹脂、４はモー
ルド型整流器、５Ａ，５Ｂ，５Ｃは端子、６は取
付用孔付金具、７はリード線、９はばね座金、１
０は座金、１１はボルト、１２はナツト、１３，
１５は凹部、１４は板である。
Fig. 1 is a sectional view of a nut portion showing an embodiment of the present invention, Figs. 2 and 3 are front views showing examples of the shape of the nut, Fig. 4 is a plan view of a molded rectifier, and Fig. 5. 6 is a wiring diagram, FIG. 7 is a sectional view of a conventional nut portion, and FIG. 8 is a sectional view of a damaged example. In the drawing, 1 and 2 are rectifiers, 3 is resin, 4 is a molded rectifier, 5A, 5B, 5C are terminals, 6 is a mounting hole fitting, 7 is a lead wire, 9 is a spring washer, 1
0 is washer, 11 is bolt, 12 is nut, 13,
15 is a recess, and 14 is a plate.
Claims (1)
が樹脂でモールドされ、前記ナツトの外周に樹脂
が入り込む凹部が形成されているモールド型整流
器。 A molded rectifier in which a rectifier and a nut for fixing lead wires of the rectifier are molded with resin, and a recess into which the resin enters is formed on the outer periphery of the nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173688U JPH01127259U (en) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173688U JPH01127259U (en) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127259U true JPH01127259U (en) | 1989-08-31 |
Family
ID=31239227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2173688U Pending JPH01127259U (en) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127259U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028969A (en) * | 2009-07-24 | 2011-02-10 | Yazaki Corp | Fixing structure for fixing metal plate and bolt to synthetic resin member and connector having the same |
| JP2014056982A (en) * | 2012-09-13 | 2014-03-27 | Mitsubishi Electric Corp | Power semiconductor device and manufacturing method of the same |
| WO2017017749A1 (en) * | 2015-07-27 | 2017-02-02 | 三菱電機株式会社 | Semiconductor device |
-
1988
- 1988-02-23 JP JP2173688U patent/JPH01127259U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011028969A (en) * | 2009-07-24 | 2011-02-10 | Yazaki Corp | Fixing structure for fixing metal plate and bolt to synthetic resin member and connector having the same |
| JP2014056982A (en) * | 2012-09-13 | 2014-03-27 | Mitsubishi Electric Corp | Power semiconductor device and manufacturing method of the same |
| WO2017017749A1 (en) * | 2015-07-27 | 2017-02-02 | 三菱電機株式会社 | Semiconductor device |
| JPWO2017017749A1 (en) * | 2015-07-27 | 2017-11-02 | 三菱電機株式会社 | Semiconductor device |
| US10304748B2 (en) | 2015-07-27 | 2019-05-28 | Mitsubishi Electric Corporation | Semiconductor device |