JPH01127241U - - Google Patents
Info
- Publication number
- JPH01127241U JPH01127241U JP2363888U JP2363888U JPH01127241U JP H01127241 U JPH01127241 U JP H01127241U JP 2363888 U JP2363888 U JP 2363888U JP 2363888 U JP2363888 U JP 2363888U JP H01127241 U JPH01127241 U JP H01127241U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- metal ball
- semiconductor device
- bonded
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/50—
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- H10W72/01551—
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- H10W72/07511—
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- H10W72/07521—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5434—
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- H10W72/547—
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- H10W72/5473—
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- H10W72/5475—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2363888U JPH01127241U (enExample) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2363888U JPH01127241U (enExample) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127241U true JPH01127241U (enExample) | 1989-08-31 |
Family
ID=31242799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2363888U Pending JPH01127241U (enExample) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127241U (enExample) |
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1988
- 1988-02-23 JP JP2363888U patent/JPH01127241U/ja active Pending