JPH01125571U - - Google Patents
Info
- Publication number
- JPH01125571U JPH01125571U JP1988288U JP1988288U JPH01125571U JP H01125571 U JPH01125571 U JP H01125571U JP 1988288 U JP1988288 U JP 1988288U JP 1988288 U JP1988288 U JP 1988288U JP H01125571 U JPH01125571 U JP H01125571U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- small chip
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019882U JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019882U JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01125571U true JPH01125571U (US08197722-20120612-C00042.png) | 1989-08-28 |
| JPH0631732Y2 JPH0631732Y2 (ja) | 1994-08-22 |
Family
ID=31235786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019882U Expired - Lifetime JPH0631732Y2 (ja) | 1988-02-19 | 1988-02-19 | 面実装用混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631732Y2 (US08197722-20120612-C00042.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459971U (US08197722-20120612-C00042.png) * | 1990-09-29 | 1992-05-22 | ||
| WO2001005201A1 (fr) * | 1999-07-09 | 2001-01-18 | Fujitsu Limited | Carte a circuit imprime, substrat auxiliaire de montage hierarchique et dispositif electronique |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59123347U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS59123348U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS60194550A (ja) * | 1984-03-16 | 1985-10-03 | Nec Corp | 混成集積回路 |
| JPS61106036U (US08197722-20120612-C00042.png) * | 1984-12-18 | 1986-07-05 |
-
1988
- 1988-02-19 JP JP1988019882U patent/JPH0631732Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59123347U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS59123348U (ja) * | 1983-02-07 | 1984-08-20 | 三菱電機株式会社 | 混成集積回路装置 |
| JPS60194550A (ja) * | 1984-03-16 | 1985-10-03 | Nec Corp | 混成集積回路 |
| JPS61106036U (US08197722-20120612-C00042.png) * | 1984-12-18 | 1986-07-05 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459971U (US08197722-20120612-C00042.png) * | 1990-09-29 | 1992-05-22 | ||
| WO2001005201A1 (fr) * | 1999-07-09 | 2001-01-18 | Fujitsu Limited | Carte a circuit imprime, substrat auxiliaire de montage hierarchique et dispositif electronique |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631732Y2 (ja) | 1994-08-22 |
