JPH01125557U - - Google Patents
Info
- Publication number
- JPH01125557U JPH01125557U JP1988020188U JP2018888U JPH01125557U JP H01125557 U JPH01125557 U JP H01125557U JP 1988020188 U JP1988020188 U JP 1988020188U JP 2018888 U JP2018888 U JP 2018888U JP H01125557 U JPH01125557 U JP H01125557U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- tungsten
- copper
- ceramics
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
-
- H10W72/931—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020188U JPH01125557U (cg-RX-API-DMAC10.html) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020188U JPH01125557U (cg-RX-API-DMAC10.html) | 1988-02-18 | 1988-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01125557U true JPH01125557U (cg-RX-API-DMAC10.html) | 1989-08-28 |
Family
ID=31523283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988020188U Pending JPH01125557U (cg-RX-API-DMAC10.html) | 1988-02-18 | 1988-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01125557U (cg-RX-API-DMAC10.html) |
-
1988
- 1988-02-18 JP JP1988020188U patent/JPH01125557U/ja active Pending
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