JPH01123357U - - Google Patents
Info
- Publication number
- JPH01123357U JPH01123357U JP1988019082U JP1908288U JPH01123357U JP H01123357 U JPH01123357 U JP H01123357U JP 1988019082 U JP1988019082 U JP 1988019082U JP 1908288 U JP1908288 U JP 1908288U JP H01123357 U JPH01123357 U JP H01123357U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead
- semiconductor device
- semiconductor pellet
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019082U JPH01123357U (enExample) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988019082U JPH01123357U (enExample) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123357U true JPH01123357U (enExample) | 1989-08-22 |
Family
ID=31234279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988019082U Pending JPH01123357U (enExample) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123357U (enExample) |
-
1988
- 1988-02-16 JP JP1988019082U patent/JPH01123357U/ja active Pending