JPH01121932U - - Google Patents
Info
- Publication number
- JPH01121932U JPH01121932U JP1825388U JP1825388U JPH01121932U JP H01121932 U JPH01121932 U JP H01121932U JP 1825388 U JP1825388 U JP 1825388U JP 1825388 U JP1825388 U JP 1825388U JP H01121932 U JPH01121932 U JP H01121932U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- processing machine
- mounting table
- wafer processing
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1825388U JPH01121932U (zh) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1825388U JPH01121932U (zh) | 1988-02-15 | 1988-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01121932U true JPH01121932U (zh) | 1989-08-18 |
Family
ID=31232732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1825388U Pending JPH01121932U (zh) | 1988-02-15 | 1988-02-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01121932U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245252A (ja) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | シリコンウエハ載置用冶具および微細構造体の表面形状検出方法 |
JP2012156418A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置 |
JP2015185665A (ja) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | シート剥離装置および剥離方法 |
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1988
- 1988-02-15 JP JP1825388U patent/JPH01121932U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006245252A (ja) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | シリコンウエハ載置用冶具および微細構造体の表面形状検出方法 |
JP4522889B2 (ja) * | 2005-03-03 | 2010-08-11 | 大日本印刷株式会社 | シリコンウエハ載置用冶具および微細構造体の表面形状検出方法 |
JP2012156418A (ja) * | 2011-01-28 | 2012-08-16 | Lintec Corp | 板状部材の支持装置 |
JP2015185665A (ja) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | シート剥離装置および剥離方法 |