JPH01120352U - - Google Patents
Info
- Publication number
- JPH01120352U JPH01120352U JP1471088U JP1471088U JPH01120352U JP H01120352 U JPH01120352 U JP H01120352U JP 1471088 U JP1471088 U JP 1471088U JP 1471088 U JP1471088 U JP 1471088U JP H01120352 U JPH01120352 U JP H01120352U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- outer periphery
- sealed
- mounting
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案によるフラツトモールドパツケ
ージの部分図。第2図は本考案によるPLCCパ
ツケージの部分図。第3図は従来のフラツトモー
ルドパツケージの部分図。第4図は従来のPLC
Cパツケージの部分図。 1―1,2―1,3―1,4―1…樹脂封止部
、1―2,2―2,3―2,4―2…外周部接続
端子、1―3,2―3…実装面上接続端子。
ージの部分図。第2図は本考案によるPLCCパ
ツケージの部分図。第3図は従来のフラツトモー
ルドパツケージの部分図。第4図は従来のPLC
Cパツケージの部分図。 1―1,2―1,3―1,4―1…樹脂封止部
、1―2,2―2,3―2,4―2…外周部接続
端子、1―3,2―3…実装面上接続端子。
Claims (1)
- 樹脂封止部の外周部と、実装面上で該外周部よ
り内側に入つた部位にそれぞれ接続端子を有する
表面実装用樹脂封止型集積回路パツケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1471088U JPH01120352U (ja) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1471088U JPH01120352U (ja) | 1988-02-05 | 1988-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01120352U true JPH01120352U (ja) | 1989-08-15 |
Family
ID=31226156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1471088U Pending JPH01120352U (ja) | 1988-02-05 | 1988-02-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01120352U (ja) |
-
1988
- 1988-02-05 JP JP1471088U patent/JPH01120352U/ja active Pending