JPH01120342U - - Google Patents
Info
- Publication number
- JPH01120342U JPH01120342U JP1573188U JP1573188U JPH01120342U JP H01120342 U JPH01120342 U JP H01120342U JP 1573188 U JP1573188 U JP 1573188U JP 1573188 U JP1573188 U JP 1573188U JP H01120342 U JPH01120342 U JP H01120342U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- resin
- thin metal
- metal wires
- substantially flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1573188U JPH01120342U (is) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1573188U JPH01120342U (is) | 1988-02-10 | 1988-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01120342U true JPH01120342U (is) | 1989-08-15 |
Family
ID=31228033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1573188U Pending JPH01120342U (is) | 1988-02-10 | 1988-02-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01120342U (is) |
-
1988
- 1988-02-10 JP JP1573188U patent/JPH01120342U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5827934U (ja) | 半導体装置 | |
JPH01120342U (is) | ||
JPS62180738U (is) | ||
JPS61182036U (is) | ||
JPS63200355U (is) | ||
JPH0279047U (is) | ||
JPH02146437U (is) | ||
JPS63187330U (is) | ||
JPH0245676U (is) | ||
JPS585347U (ja) | 樹脂封止型半導体装置 | |
JPH0279046U (is) | ||
JPH0377461U (is) | ||
JPS59117166U (ja) | 樹脂封止型半導体装置 | |
JPH0176040U (is) | ||
JPS633160U (is) | ||
JPH0256439U (is) | ||
JPS63174449U (is) | ||
JPS6429843U (is) | ||
JPS6232556U (is) | ||
JPS5840843U (ja) | 樹脂封止型半導体装置 | |
JPH0265355U (is) | ||
JPS61123544U (is) | ||
JPH0436251U (is) | ||
JPS6076045U (ja) | 樹脂封止半導体装置 | |
JPH0474461U (is) |